Taiwan semiconductor manufacturing co., ltd. (20240096740). PACKAGE STRUCTURE HAVING THERMOELECTRIC COOLER simplified abstract
Contents
- 1 PACKAGE STRUCTURE HAVING THERMOELECTRIC COOLER
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 PACKAGE STRUCTURE HAVING THERMOELECTRIC COOLER - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
PACKAGE STRUCTURE HAVING THERMOELECTRIC COOLER
Organization Name
taiwan semiconductor manufacturing co., ltd.
Inventor(s)
Chao-Wei Chiu of Hsinchu City (TW)
Chao-Wei Li of Hsinchu City (TW)
Hsiu-Jen Lin of Hsinchu County (TW)
Ching-Hua Hsieh of Hsinchu (TW)
PACKAGE STRUCTURE HAVING THERMOELECTRIC COOLER - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240096740 titled 'PACKAGE STRUCTURE HAVING THERMOELECTRIC COOLER
Simplified Explanation
The abstract describes a package structure for electronic components, including a redistribution layer (RDL) structure, a die, a circuit substrate, and a thermoelectric cooler. The RDL structure has two sides, with the die placed on one side and the circuit substrate bonded to the other side using conductive connectors. The thermoelectric cooler is positioned between the RDL structure and the circuit substrate, with n-type and p-type doped regions.
- The package structure includes a redistribution layer (RDL) structure, die, circuit substrate, and thermoelectric cooler.
- The RDL structure has two sides, with the die placed on one side and the circuit substrate bonded to the other side using conductive connectors.
- The thermoelectric cooler is positioned between the RDL structure and the circuit substrate, with n-type and p-type doped regions.
Potential Applications
The technology described in this patent application could be applied in various electronic devices and systems that require efficient cooling solutions for electronic components.
Problems Solved
This technology addresses the challenge of managing heat dissipation in electronic components, which is crucial for maintaining optimal performance and reliability.
Benefits
The use of a thermoelectric cooler in this package structure can help improve the overall thermal management of electronic devices, leading to enhanced performance and longevity.
Potential Commercial Applications
One potential commercial application of this technology could be in high-performance computing systems where efficient cooling of electronic components is essential for optimal operation.
Possible Prior Art
Prior art in the field of thermoelectric cooling systems for electronic devices may include similar package structures with thermoelectric coolers, but the specific configuration and integration described in this patent application may offer unique advantages.
Unanswered Questions
How does the efficiency of the thermoelectric cooler compare to traditional cooling methods in electronic devices?
The article does not provide specific data or comparisons regarding the efficiency of the thermoelectric cooler in this package structure.
Are there any limitations or drawbacks associated with the use of thermoelectric coolers in electronic component packaging?
The potential limitations or drawbacks of using thermoelectric coolers in electronic component packaging are not discussed in detail in the article.
Original Abstract Submitted
provided is a package structure including a first redistribution layer (rdl) structure, a die, a circuit substrate, and a first thermoelectric cooler. the rdl) structure has a first side and a second side opposite to each other. the die is disposed on the first side of the first rdl structure. the circuit substrate is bonded to the second side of the first rdl structure through a plurality of first conductive connectors. the first thermoelectric cooler is between the first rdl structure and the circuit substrate, wherein the first thermoelectric cooler includes at least a n-type doped region and at least a p-type doped region.
