18152131. PACKAGE STRUCTURE HAVING THERMOELECTRIC COOLER simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

PACKAGE STRUCTURE HAVING THERMOELECTRIC COOLER

Organization Name

Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor(s)

Chao-Wei Chiu of Hsinchu City (TW)

Chao-Wei Li of Hsinchu City (TW)

Hsiu-Jen Lin of Hsinchu County (TW)

Ching-Hua Hsieh of Hsinchu (TW)

PACKAGE STRUCTURE HAVING THERMOELECTRIC COOLER - A simplified explanation of the abstract

This abstract first appeared for US patent application 18152131 titled 'PACKAGE STRUCTURE HAVING THERMOELECTRIC COOLER

Simplified Explanation

The patent application describes a package structure that includes a redistribution layer (RDL) structure, a die, a circuit substrate, and a thermoelectric cooler. The RDL structure has a first side and a second side, with the die placed on the first side. The circuit substrate is bonded to the second side of the RDL structure using conductive connectors, and the thermoelectric cooler is positioned between the RDL structure and the circuit substrate, comprising N-type and P-type doped regions.

• The package structure includes a redistribution layer (RDL) structure, die, circuit substrate, and thermoelectric cooler.
• The RDL structure has two sides, with the die placed on one side and the circuit substrate bonded to the other side using conductive connectors.
• The thermoelectric cooler, positioned between the RDL structure and circuit substrate, consists of N-type and P-type doped regions.

Potential Applications

This technology could be applied in:

• Electronics cooling systems
• Semiconductor packaging
• Thermal management solutions

Problems Solved

This technology addresses issues related to:

• Heat dissipation in electronic devices
• Thermal stress on semiconductor components

Benefits

The benefits of this technology include:

• Improved thermal performance
• Enhanced reliability of electronic systems
• Compact and efficient cooling solutions

Potential Commercial Applications

Potential commercial applications of this technology could be found in:

• Consumer electronics
• Automotive electronics
• Aerospace industry

Possible Prior Art

One possible prior art for this technology could be:

• Thermoelectric cooling devices used in electronic systems

How does this technology compare to traditional cooling methods in terms of efficiency and cost-effectiveness?

This article does not provide a direct comparison between this technology and traditional cooling methods. Further research or testing may be needed to evaluate the efficiency and cost-effectiveness of this innovation.

What are the specific materials used in the thermoelectric cooler and how do they contribute to its performance?

The article does not detail the specific materials used in the thermoelectric cooler or their impact on its performance. Additional information on the composition and properties of the materials could provide insights into the functionality of the cooler.

Original Abstract Submitted

Provided is a package structure including a first redistribution layer (RDL) structure, a die, a circuit substrate, and a first thermoelectric cooler. The RDL) structure has a first side and a second side opposite to each other. The die is disposed on the first side of the first RDL structure. The circuit substrate is bonded to the second side of the first RDL structure through a plurality of first conductive connectors. The first thermoelectric cooler is between the first RDL structure and the circuit substrate, wherein the first thermoelectric cooler includes at least a N-type doped region and at least a P-type doped region.