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Category:H05K3/28
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Pages in category "H05K3/28"
The following 14 pages are in this category, out of 14 total.
1
- 17383241. PACKAGE COMPRISING A BLOCK DEVICE WITH A SHIELD simplified abstract (QUALCOMM Incorporated)
- 17768063. PROTECTIVE COATING COMPOSITION FOR CIRCUIT BOARD simplified abstract (Samsung Electronics Co., Ltd.)
- 18144031. TRANSFER MOLDING SYSTEMS FOR SEMICONDUCTOR DEVICE PACKAGING simplified abstract (Apple Inc.)
- 18164748. MODULE BOARD AND SEMICONDUCTOR MODULE HAVING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18373776. CIRCUIT BOARD MODULE AND ELECTRONIC DEVICE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18416937. ELECTRICAL LEAD-OUT STRUCTURE AND PREPARATION METHOD THEREOF, HERMETIC APPARATUS, AND OPTICAL COMMUNICATION DEVICE simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.)