18144031. TRANSFER MOLDING SYSTEMS FOR SEMICONDUCTOR DEVICE PACKAGING simplified abstract (Apple Inc.)
TRANSFER MOLDING SYSTEMS FOR SEMICONDUCTOR DEVICE PACKAGING
Organization Name
Inventor(s)
Nitesh Kumbhat of San Jose CA (US)
Yanfeng Chen of San Ramon CA (US)
Mandar S. Painaik of Chandler AZ (US)
Shankar S. Pennathur of San Jose CA (US)
Pierpaolo Lupo of Cupertino CA (US)
TRANSFER MOLDING SYSTEMS FOR SEMICONDUCTOR DEVICE PACKAGING - A simplified explanation of the abstract
This abstract first appeared for US patent application 18144031 titled 'TRANSFER MOLDING SYSTEMS FOR SEMICONDUCTOR DEVICE PACKAGING
Simplified Explanation
- Mold cavity structure of a transfer molding system is disclosed - System includes a first mold-forming structure and a second mold-forming structure - Second mold-forming structure includes a mold cavity with gate, component, and vent regions - Component region encloses an electrical component - Volume of vent region is adjustable - System includes an inlet port to direct molding compound into the mold cavity
Potential Applications
- Electronics manufacturing - Automotive industry - Aerospace industry
Problems Solved
- Ensures proper encapsulation of electrical components - Allows for adjustable venting to prevent air bubbles in molded parts
Benefits
- Improved quality of molded parts - Enhanced reliability of electrical components - Increased efficiency in manufacturing process
Original Abstract Submitted
Various embodiments of a mold cavity structure of a transfer molding system are disclosed. The transfer molding system includes a first mold-forming structure and a second mold-forming structure. The second mold-forming structure includes a mold cavity. The mold cavity includes a gate region, a component region, and a vent region. The component region is configured to enclose an electrical component. A volume of the vent region is adjustable. The transfer molding system further includes an inlet port coupled to the gate region and configured to direct a flow of a molding compound into the mold cavity during an operation of the transfer molding system.
