Samsung electronics co., ltd. (20240098912). CIRCUIT BOARD MODULE AND ELECTRONIC DEVICE INCLUDING THE SAME simplified abstract
Contents
- 1 CIRCUIT BOARD MODULE AND ELECTRONIC DEVICE INCLUDING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 CIRCUIT BOARD MODULE AND ELECTRONIC DEVICE INCLUDING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
CIRCUIT BOARD MODULE AND ELECTRONIC DEVICE INCLUDING THE SAME
Organization Name
Inventor(s)
CIRCUIT BOARD MODULE AND ELECTRONIC DEVICE INCLUDING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240098912 titled 'CIRCUIT BOARD MODULE AND ELECTRONIC DEVICE INCLUDING THE SAME
Simplified Explanation
The electronic device described in the patent application includes a housing, a circuit board, a first component, a second component, a shielding mold, and an open structure. The shielding mold covers the top and side surfaces of the first component, while the open structure surrounds a side surface of the second component, leaving the top portion open to expose part of the second component or the circuit board.
- Housing, circuit board, first component, second component, shielding mold, and open structure are key components of the electronic device.
- The shielding mold covers the top and side surfaces of the first component to provide protection.
- The open structure surrounds a side surface of the second component, leaving the top portion open for exposure.
- The inner surface of the open structure is spaced apart from the second component, while the outer surface contacts the shielding mold for added protection.
Potential Applications
The technology described in the patent application could be applied in various electronic devices where components need protection and exposure for functionality.
Problems Solved
This technology solves the problem of protecting sensitive components while allowing for necessary exposure for functionality.
Benefits
The benefits of this technology include enhanced protection for components, improved functionality, and potentially increased durability of the electronic device.
Potential Commercial Applications
The technology could be utilized in smartphones, tablets, laptops, and other electronic devices where component protection and functionality are crucial.
Possible Prior Art
Prior art in similar technologies may include patents related to component protection and exposure in electronic devices.
Unanswered Questions
How does this technology compare to existing solutions in terms of cost-effectiveness?
The article does not address the cost-effectiveness of implementing this technology compared to existing solutions.
What are the potential challenges in manufacturing electronic devices using this technology?
The article does not discuss any potential challenges in manufacturing electronic devices using this technology.
Original Abstract Submitted
an electronic device includes a housing, a circuit board disposed within the housing, a first component and a second component disposed on one surface of the circuit board, a shielding mold disposed on the one surface of the circuit board to cover top and side surfaces of the first component, and an open structure disposed on the one surface of the circuit board to surround a side surface of the second component. in the open structure, a top portion is opened and exposes a part of the second component or the circuit board, an inner surface is spaced apart from the second component, and an outer surface contacts the shielding mold.
