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Category:Jun Zhai of Cupertino CA (US)
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Pages in category "Jun Zhai of Cupertino CA (US)"
The following 10 pages are in this category, out of 10 total.
1
- 17932182. Structure and Method of Fabrication for High Performance Integrated Passive Device simplified abstract (Apple Inc.)
- 18156287. HIGH BANDWIDTH DIE TO DIE INTERCONNECT WITH PACKAGE AREA REDUCTION simplified abstract (Apple Inc.)
- 18339132. DIE STITCHING AND HARVESTING OF ARRAYED STRUCTURES simplified abstract (APPLE INC.)
- 18485709. Structure and Method for Sealing a Silicon IC simplified abstract (Apple Inc.)
- 18488561. Selectable Monolithic or External Scalable Die-to-Die Interconnection System Methodology simplified abstract (Apple Inc.)
A
- Apple inc. (20240105545). Thermally Enhanced Chip-on-Wafer or Wafer-on-Wafer Bonding simplified abstract
- Apple inc. (20240105626). Semiconductor Package with Local Interconnect and Chiplet Integration simplified abstract
- Apple inc. (20240105702). 3D Package with Chip-on-Reconstituted Wafer or Reconstituted Wafer-on-Reconstituted Wafer Bonding simplified abstract
- Apple inc. (20240105704). 3D Package with Chip-on-Reconstituted Wafer or Reconstituted Wafer-on-Reconstituted Wafer Bonding simplified abstract