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Category:Chu Aun Lim of Hillsboro OR (US)
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Pages in category "Chu Aun Lim of Hillsboro OR (US)"
The following 8 pages are in this category, out of 8 total.
1
- 17848630. HYPER DENSITY PACKAGE SUBSTRATE AND MEMORY COUPLED TO A MODIFIED SEMI-ADDITIVE PROCESS BOARD simplified abstract (Intel Corporation)
- 17848639. SLOTTED STIFFENER FOR A PACKAGE SUBSTRATE simplified abstract (Intel Corporation)
- 17848643. ELECTRICAL CONDUCTOR EXTENDING FROM A SURFACE OF A SUBSTRATE simplified abstract (Intel Corporation)
- 17849352. COPPER RINGS FOR BGA COUNT REDUCTION IN SMALL FORM FACTOR PACKAGES simplified abstract (Intel Corporation)
- 17972923. COPPER FILL FOR HEAT MANAGEMENT IN INTEGRATED CIRCUIT DEVICE simplified abstract (Intel Corporation)
- 17972975. INTEGRATED INDUCTOR OVER TRANSISTOR LAYER simplified abstract (Intel Corporation)
