Category:Zhijie Wang of San Diego CA (US)
Zhijie Wang
Zhijie Wang from San Diego CA (US) has applied for patents in technology areas such as H01L23/538, H01L21/48, H01L25/16 with qualcomm incorporated.
Patents
Pages in category "Zhijie Wang of San Diego CA (US)"
The following 11 pages are in this category, out of 11 total.
1
- 18063384. METAL POCKET FANOUT PACKAGE simplified abstract (QUALCOMM Incorporated)
- 18158225. EMBEDDED TRACE SUBSTRATES (ETSs) WITH T-SHAPED INTERCONNECTS WITH REDUCED-WIDTH EMBEDDED METAL TRACES, AND RELATED INTEGRATED CIRCUIT (IC) PACKAGES AND FABRICATION METHODS simplified abstract (QUALCOMM Incorporated)
- 18190019. PACKAGE SUBSTRATE COMPRISING EMBEDDED INTEGRATED DEVICE simplified abstract (QUALCOMM Incorporated)
Q
- Qualcomm incorporated (20240105687). PACKAGE COMPRISING A FLEXIBLE SUBSTRATE simplified abstract
- Qualcomm incorporated (20240194545). METAL POCKET FANOUT PACKAGE simplified abstract
- Qualcomm incorporated (20240250009). EMBEDDED TRACE SUBSTRATES (ETSs) WITH T-SHAPED INTERCONNECTS WITH REDUCED-WIDTH EMBEDDED METAL TRACES, AND RELATED INTEGRATED CIRCUIT (IC) PACKAGES AND FABRICATION METHODS simplified abstract
- Qualcomm incorporated (20240274516). INTERPOSER WITH SOLDER RESIST POSTS simplified abstract
- Qualcomm incorporated (20240276739). DISCRETE DEVICE INTERCONNECTIONS BETWEEN STACKED SUBSTRATES simplified abstract
- Qualcomm incorporated (20240321752). PACKAGE SUBSTRATE COMPRISING EMBEDDED INTEGRATED DEVICE simplified abstract
- Qualcomm incorporated (20250062235). PACKAGE SUBSTRATE WITH METALLIZATION LAYER(S) THAT INCLUDES AN ADDITIONAL METAL PAD LAYER TO FACILITATE REDUCED VIA SIZE FOR REDUCED BUMP PITCH, AND RELATED INTEGRATED CIRCUIT (IC) PACKAGES AND FABRICATION METHODS
- Qualcomm incorporated (20250062246). STRUCTURE FOR DELAMINATION MITIGATION IN A SEMICONDUCTOR DEVICE