Category:Tarek A. Ibrahim of Mesa AZ (US)
Tarek A. Ibrahim
Tarek A. Ibrahim from Mesa AZ (US) has applied for patents in technology areas such as H01L23/538, H01L23/00, H01L23/31 with intel corporation.
Patents
Subcategories
This category has the following 5 subcategories, out of 5 total.
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Pages in category "Tarek A. Ibrahim of Mesa AZ (US)"
The following 16 pages are in this category, out of 16 total.
1
- 17937474. PACKAGE SUBSTRATE WITH OPEN AIR GAP STRUCTURES simplified abstract (Intel Corporation)
- 17956338. EMBEDDED PASSIVES WITH CAVITY SIDEWALL INTERCONNECT IN GLASS CORE ARCHITECTURE simplified abstract (Intel Corporation)
- 18089491. LIQUID METAL WELLS FOR INTERCONNECT ARCHITECTURES simplified abstract (Intel Corporation)
- 18089934. OPTICAL SEMICONDUCTOR PACKAGE AND METHOD simplified abstract (Intel Corporation)
- 18091028. ULTRATHIN LAMINATED GLASS AND GLASS STIFFENERS FOR CORELESS PACKAGES simplified abstract (Intel Corporation)
- 18345106. TECHNOLOGIES FOR SUBSTRATE FEATURES FOR A PLUGGABLE OPTICAL CONNECTOR (Intel Corporation)
- 18943420. MICROELECTRONIC COMPONENT HAVING MOLDED REGIONS WITH THROUGH-MOLD VIAS (Intel Corporation)
2
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- Intel corporation (20240113049). PACKAGE SUBSTRATE WITH OPEN AIR GAP STRUCTURES simplified abstract
- Intel corporation (20240114622). EMBEDDED PASSIVES WITH CAVITY SIDEWALL INTERCONNECT IN GLASS CORE ARCHITECTURE simplified abstract
- Intel corporation (20240186250). Microelectronic Assembly Including Interconnect Bridges with Through Vias Embedded Therein simplified abstract
- Intel corporation (20240213156). LIQUID METAL WELLS FOR INTERCONNECT ARCHITECTURES simplified abstract
- Intel corporation (20240217216). ULTRATHIN LAMINATED GLASS AND GLASS STIFFENERS FOR CORELESS PACKAGES simplified abstract
- Intel corporation (20240219660). OPTICAL SEMICONDUCTOR PACKAGE AND METHOD simplified abstract
- Intel corporation (20250060531). PHOTONIC INTEGRATED CIRCUIT PACKAGING ARCHITECTURE
- Intel corporation (20250070030). MICROELECTRONIC COMPONENT HAVING MOLDED REGIONS WITH THROUGH-MOLD VIAS