Intel corporation (20250060531). PHOTONIC INTEGRATED CIRCUIT PACKAGING ARCHITECTURE
PHOTONIC INTEGRATED CIRCUIT PACKAGING ARCHITECTURE
Organization Name
Inventor(s)
Omkar G. Karhade of Chandler AZ (US)
Xiaoqian Li of Chandler AZ (US)
Tarek A. Ibrahim of Mesa AZ (US)
Ravindranath Vithal Mahajan of Chandler AZ (US)
Nitin A. Deshpande of Chandler AZ (US)
PHOTONIC INTEGRATED CIRCUIT PACKAGING ARCHITECTURE
This abstract first appeared for US patent application 20250060531 titled 'PHOTONIC INTEGRATED CIRCUIT PACKAGING ARCHITECTURE
Original Abstract Submitted
photonic packages and device assemblies that include photonic integrated circuits (pics) coupled to optical lenses on lateral sides of the pics. an example photonic package comprises a package support, an integrated circuit (ic), an insulating material, a pic having an active side and a lateral side substantially perpendicular to the active side. at least one optical structure is on the active side. a substantial portion of the active side is in contact with the insulating material, and the pic is electrically coupled to the package support and to the ic. the photonic package further includes an optical lens coupled to the pic on the lateral side. in some embodiments, the photonic package further includes an interposer between the pic or the ic and the package support.