Category:Sanjay Dabral of Cupertino CA (US)
Sanjay Dabral
Sanjay Dabral from Cupertino CA (US) has applied for patents in technology areas such as H01L23/538, H01L21/56, H01L21/66 with apple inc..
Patents
Pages in category "Sanjay Dabral of Cupertino CA (US)"
The following 16 pages are in this category, out of 16 total.
1
- 17485022. Decoupling Device Using Stored Charge Reverse Recovery simplified abstract (Apple Inc.)
- 18339132. DIE STITCHING AND HARVESTING OF ARRAYED STRUCTURES simplified abstract (APPLE INC.)
- 18471868. Decoupling Device Using Stored Charge Reverse Recovery simplified abstract (Apple Inc.)
- 18481931. SYSTEMS AND METHODS FOR IMPLEMENTING A SCALABLE SYSTEM simplified abstract (Apple Inc.)
- 18485709. Structure and Method for Sealing a Silicon IC simplified abstract (Apple Inc.)
- 18488561. Selectable Monolithic or External Scalable Die-to-Die Interconnection System Methodology simplified abstract (Apple Inc.)
- 18509801. Seal Ring Designs Supporting Efficient Die to Die Routing simplified abstract (Apple Inc.)
2
A
- Apple inc. (20240096648). Seal Ring Designs Supporting Efficient Die to Die Routing simplified abstract
- Apple inc. (20240103238). 3D System and Wafer Reconstitution with Mid-layer Interposer simplified abstract
- Apple inc. (20240105545). Thermally Enhanced Chip-on-Wafer or Wafer-on-Wafer Bonding simplified abstract
- Apple inc. (20240105626). Semiconductor Package with Local Interconnect and Chiplet Integration simplified abstract
- Apple inc. (20240105699). 3D System and Wafer Reconstitution with Mid-layer Interposer simplified abstract
- Apple inc. (20240105702). 3D Package with Chip-on-Reconstituted Wafer or Reconstituted Wafer-on-Reconstituted Wafer Bonding simplified abstract
- Apple inc. (20240105704). 3D Package with Chip-on-Reconstituted Wafer or Reconstituted Wafer-on-Reconstituted Wafer Bonding simplified abstract
- Apple inc. (20250062236). Very Fine Pitch and Wiring Density Organic Side by Side Chiplet Integration