Apple inc. (20240105699). 3D System and Wafer Reconstitution with Mid-layer Interposer simplified abstract
3D System and Wafer Reconstitution with Mid-layer Interposer
Organization Name
Inventor(s)
Sanjay Dabral of Cupertino CA (US)
SivaChandra Jangam of Milpitas CA (US)
3D System and Wafer Reconstitution with Mid-layer Interposer - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240105699 titled '3D System and Wafer Reconstitution with Mid-layer Interposer
Simplified Explanation
The abstract describes a system in package structure and method of fabrication using wafer reconstitution. In one embodiment, a 3D system includes a mid-layer interposer, a first package level underneath the mid-layer interposer, and a second package level over the mid-layer interposer. Components at the second package level can be bonded to the mid-layer interposer with metal-metal bonds and optionally dielectric-dielectric bonds, while components at the first package level can be bonded to the mid-layer interposer with dielectric-dielectric and optionally metal-metal bonds.
- 3D system with mid-layer interposer
- Components bonded with metal-metal and dielectric-dielectric bonds
- Wafer reconstitution method of fabrication
Potential Applications
The technology described in the patent application could be applied in:
- Advanced electronic devices
- High-performance computing systems
- Aerospace and defense applications
Problems Solved
This technology helps in:
- Increasing packaging density
- Enhancing signal integrity
- Improving thermal management
Benefits
The benefits of this technology include:
- Improved performance
- Reduced footprint
- Enhanced reliability
Potential Commercial Applications
This technology could find commercial applications in:
- Semiconductor industry
- Telecommunications sector
- Automotive electronics market
Possible Prior Art
One possible prior art could be the use of traditional 2D packaging techniques in electronic devices.
Unanswered Questions
How does the technology impact manufacturing costs?
The article does not provide information on the potential impact of this technology on manufacturing costs. Further research or analysis may be needed to determine this aspect.
What are the environmental implications of this technology?
The environmental implications of implementing this technology are not discussed in the article. It would be important to consider factors such as material usage and disposal methods to assess the environmental impact.
Original Abstract Submitted
a system in package structure and method of fabrication using wafer reconstitution are described. in an embodiment a 3d system includes a mid-layer interposer a first package level underneath the mid-layer interposer and a second package level over the mid-layer interposer. second package level components can be bonded to the mid-layer interposer with metal-metal bonds and optionally dielectric-dielectric bonds, while the first package level components can be bonded to the mid-layer interposer with dielectric-dielectric and optionally metal-metal bonds.
