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Category:CPC H01L23/49827
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Pages in category "CPC H01L23/49827"
The following 130 pages are in this category, out of 130 total.
1
- 18089499. DIRECT PLATING OF COPPER ON DIELECTRICS FOR GLASS CORE PLATING simplified abstract (Intel Corporation)
- 18121264. VIA STRUCTURES IN BONDED GLASS SUBSTRATES simplified abstract (Intel Corporation)
- 18147457. ARCHITECTURES AND METHODS FOR METAL LAMINATION ON A GLASS LAYER simplified abstract (Intel Corporation)
- 18148355. INTEGRATED CIRCUIT DEVICE PACKAGE SUBSTRATES WITH GLASS CORE LAYER HAVING ROUGHENED SURFACES simplified abstract (Intel Corporation)
- 18228209. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18277654. SEMICONDUCTOR PACKAGE simplified abstract (LG INNOTEK CO., LTD.)
- 18327220. 3D Stacking Structure and Method of Fabricating the Same simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18334695. Integrated Circuit Package and Methods of Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18356721. SEMICONDUCTOR PACKAGES AND METHODS FOR FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18373848. SELF-HEALING LINER FOR THROUGH GLASS VIA RELIABILITY (Intel Corporation)
- 18399324. COMPOSITE COMPONENT simplified abstract (Murata Manufacturing Co., Ltd.)
- 18468533. INTEGRATED DEVICES COUPLED TO INTERPOSER COMPRISING POROUS PORTION (QUALCOMM Incorporated)
- 18474151. BACK END OF LINE OPTIMIZED TO FUNCTION IN A 3D STACK CONFIGURATION simplified abstract (ADVANCED MICRO DEVICES, INC.)
- 18516039. 3DIC WITH GAP-FILL STRUCTURES AND THE METHOD OF MANUFACTURING THE SAME (Taiwan Semiconductor Manufacturing Company, LTD.)
- 18617499. SEMICONDUCTOR CHIP PACKAGES HAVING BOND OVER ACTIVE CIRCUIT (BOAC) STRUCTURES simplified abstract (Texas Instruments Incorporated)
- 18622500. VERTICALLY SPACED INTRA-LEVEL INTERCONNECT LINE METALLIZATION FOR INTEGRATED CIRCUIT DEVICES simplified abstract (Intel Corporation)
- 18626700. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD FOR THE SAME (Samsung Electronics Co., Ltd.)
- 18630122. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18725118. ELECTRICAL COMPONENT AND METHOD OF FORMING SAME (Medtronic, Inc.)
- 18725120. ELECTRICAL COMPONENT AND METHOD OF FORMING SAME (Medtronic, Inc.)
- 18745592. ELECTRONIC DEVICE INCLUDING INTERPOSER AND METHOD FOR MANUFACTURING SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18783807. 3DIC WITH GAP-FILL STRUCTURES AND THE METHOD OF MANUFACTURING THE SAME (Taiwan Semiconductor Manufacturing Company, LTD.)
- 18813059. MANUFACTURING METHOD OF ELECTRONIC DEVICE HAVING THROUGH-HOLE SUBSTRATE AND ELECTRONIC DEVICE (InnoLux Corporation)
- 18882324. SEMICONDUCTOR DEVICE, CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD (Kioxia Corporation)
- 18895961. THROUGH ELECTRODE SUBSTRATE AND MOUNTING SUBSTRATE (DAI NIPPON PRINTING CO., LTD.)
- 18955884. PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF (Taiwan Semiconductor Manufacturing Co., Ltd.)
A
I
- Industrial Technology Research Institute Patent Application Trends in 2024
- INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE Patent Application Trends in 2024
- Innolux Corporation Patent Application Trends in 2024
- Intel corporation (20240203853). DRY FILM PHOTORESIST WET LAMINATION AND METHOD simplified abstract
- Intel corporation (20240213131). DIRECT PLATING OF COPPER ON DIELECTRICS FOR GLASS CORE PLATING simplified abstract
- Intel corporation (20240222248). ARCHITECTURES AND METHODS FOR METAL LAMINATION ON A GLASS LAYER simplified abstract
- Intel corporation (20240222249). INTEGRATED CIRCUIT DEVICE PACKAGE SUBSTRATES WITH GLASS CORE LAYER HAVING ROUGHENED SURFACES simplified abstract
- Intel corporation (20240243052). VERTICALLY SPACED INTRA-LEVEL INTERCONNECT LINE METALLIZATION FOR INTEGRATED CIRCUIT DEVICES simplified abstract
- Intel corporation (20240312888). VIA STRUCTURES IN BONDED GLASS SUBSTRATES simplified abstract
- Intel corporation (20250022786). METHODS AND APPARATUS FOR EDGE PROTECTED GLASS CORES
- Intel corporation (20250062206). PACKAGE ARCHITECTURE WITH BRIDGE DIES HAVING AIR GAPS AROUND VIAS
- Intel corporation (20250062207). METHODS AND APPARATUS TO REDUCE CRACKING IN GLASS CORES
- Intel corporation (20250105119). SELF-HEALING LINER FOR THROUGH GLASS VIA RELIABILITY
- INTEL CORPORATION Patent Application Trends in 2025
- Intel Corporation Patent Application Trends in 2025
- Intel Corporation patent applications on February 20th, 2025
- Intel Corporation patent applications on January 16th, 2025
- Intel Corporation patent applications on January 23rd, 2025
- Intel Corporation patent applications on July 18th, 2024
- Intel Corporation patent applications on July 4th, 2024
- Intel Corporation patent applications on June 20th, 2024
- INTEL CORPORATION patent applications on June 20th, 2024
- Intel Corporation patent applications on June 27th, 2024
- Intel Corporation patent applications on March 27th, 2025
- Intel Corporation patent applications on September 19th, 2024
K
M
- MACRONIX INTERNATIONAL CO., LTD. Patent Application Trends in 2024
- MEDTRONIC, INC. Patent Application Trends in 2025
- Micron Technology, Inc. Patent Application Trends in 2024
- Mitsubishi Electric Corporation Patent Application Trends in 2024
- MITSUBISHI ELECTRIC CORPORATION Patent Application Trends in 2024
N
Q
- Qualcomm incorporated (20250096093). INTEGRATED DEVICES COUPLED TO INTERPOSER COMPRISING POROUS PORTION
- Qualcomm Incorporated Patent Application Trends in 2024
- QUALCOMM INCORPORATED Patent Application Trends in 2024
- Qualcomm Incorporated Patent Application Trends in 2025
- QUALCOMM Incorporated patent applications on March 20th, 2025
S
- SAMSUNG ELECTRO-MECHANICS CO., LTD. Patent Application Trends in 2024
- SAMSUNG ELECTRONICS CO., LTD Patent Application Trends in 2024
- Samsung electronics co., ltd. (20240203854). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240203855). SEMICONDUCTOR PACKAGES AND METHODS FOR FABRICATING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240258224). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240339391). ELECTRONIC DEVICE INCLUDING INTERPOSER AND METHOD FOR MANUFACTURING SAME simplified abstract
- Samsung electronics co., ltd. (20240347437). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20250087570). SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD FOR THE SAME
- Samsung Electronics Co., Ltd. Patent Application Trends in 2024
- SAMSUNG ELECTRONICS CO., LTD. Patent Application Trends in 2024
- Samsung electronics Co., Ltd. Patent Application Trends in 2024
- Samsung electronics CO., LTD. Patent Application Trends in 2025
- Samsung Electronics Co., Ltd. patent applications on August 1st, 2024
- Samsung Electronics Co., Ltd. patent applications on February 13th, 2025
- Samsung Electronics Co., Ltd. patent applications on January 30th, 2025
- Samsung Electronics Co., Ltd. patent applications on June 20th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on June 20th, 2024
- Samsung Electronics Co., Ltd. patent applications on March 13th, 2025
- Samsung Electronics Co., Ltd. patent applications on October 10th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on October 10th, 2024
- Samsung Electronics Co., Ltd. patent applications on October 17th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on October 17th, 2024
- SAMSUNG ELECTRONICS CO.,LTD. Patent Application Trends in 2025
- SILICONWARE PRECISION INDUSTRIES CO., LTD. Patent Application Trends in 2024
- SKYWORKS SOLUTIONS, INC. Patent Application Trends in 2024
- Skyworks Solutions, Inc. Patent Application Trends in 2025
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION Patent Application Trends in 2025
- Sony Semiconductor Solutions Corporation Patent Application Trends in 2025
T
- Taiwan Semiconductor Manufacturing Co., Ltd Patent Application Trends in 2024
- Taiwan semiconductor manufacturing co., ltd. (20250087571). PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Taiwan Semiconductor Manufacturing Co., Ltd. Patent Application Trends in 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. Patent Application Trends in 2025
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on March 13th, 2025
- Taiwan Semiconductor Manufacturing Company Limited Patent Application Trends in 2024
- Taiwan semiconductor manufacturing company, ltd. (20240203857). PACKAGE STRUCTURE WITH THROUGH VIAS simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240282686). 3D Stacking Structure and Method of Fabricating the Same simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240304535). Integrated Circuit Package and Methods of Forming the Same simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379519). SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379520). DIELECTRIC ANCHORS FOR ANCHORING A CONDUCTIVE PILLAR simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20250062204). INTEGRATED CIRCUIT PACKAGE AND METHOD
- Taiwan semiconductor manufacturing company, ltd. (20250070007). 3DIC WITH GAP-FILL STRUCTURES AND THE METHOD OF MANUFACTURING THE SAME
- Taiwan semiconductor manufacturing company, ltd. (20250070010). 3DIC WITH GAP-FILL STRUCTURES AND THE METHOD OF MANUFACTURING THE SAME
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. Patent Application Trends in 2025
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on August 22nd, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on February 20th, 2025
- Taiwan Semiconductor Manufacturing Company, LTD. patent applications on February 27th, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on June 20th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on November 14th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on September 12th, 2024
- TDK Corporation Patent Application Trends in 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD. Patent Application Trends in 2024
- TOPPAN INC. Patent Application Trends in 2024
- TSINGHUA UNIVERSITY Patent Application Trends in 2025
