Pages that link to "Category:Abhishek A. Sharma of Portland OR (US)"
The following pages link to Category:Abhishek A. Sharma of Portland OR (US):
Displaying 18 items.
- 18314875. INTEGRATED CIRCUIT DEVICES WITH ANGLED TRANSISTORS AND ANGLED ROUTING TRACKS simplified abstract (Intel Corporation) (â links)
- 18312847. STATIC RANDOM-ACCESS MEMORY DEVICES WITH ANGLED TRANSISTORS simplified abstract (Intel Corporation) (â links)
- 18314862. LOGIC CIRCUITS USING VERTICAL TRANSISTORS WITH BACKSIDE SOURCE OR DRAIN REGIONS simplified abstract (Intel Corporation) (â links)
- Intel corporation (20240105852). TOP-GATE DOPED THIN FILM TRANSISTOR simplified abstract (â links)
- Intel corporation (20240429162). INTEGRATED CIRCUIT DEVICES WITH CONDUCTIVE LINES EXTENDING OVER SCRIBE LINES (â links)
- Intel corporation (20240429164). INTEGRATED CIRCUIT DEVICES WITH FLIPPED STAIRCASE INTERCONNECT STRUCTURES (â links)
- Intel corporation (20240431092). MEMORY CELL WITH TRANSISTOR HAVING INCREASED LEAKAGE CURRENT (â links)
- Intel corporation (20240431117). MEMORY WITH ONE ACCESS TRANSISTOR COUPLED TO MULTIPLE CAPACITORS (â links)
- 18341852. THREE-DIMENSIONAL FLOATING BODY MEMORY (Intel Corporation) (â links)
- Intel corporation (20250062278). PACKAGE ARCHITECTURES HAVING VERTICALLY STACKED DIES WITH SOLDER INTERCONNECTS (â links)
- Intel corporation (20250079263). PACKAGE ARCHITECTURES HAVING VERTICALLY STACKED DIES WITH A COOLING MICROCHANNEL (â links)
- Intel corporation (20250079398). PACKAGE ARCHITECTURES HAVING VERTICALLY STACKED DIES AND VOLTAGE REGULATORS (â links)
- Intel corporation (20250079399). PACKAGE ARCHITECTURES HAVING VERTICALLY STACKED DIES AS A SOLID STATE BATTERY (â links)
- Intel Corporation Patent Application Trends in 2025 (â links)
- Category:Debendra Mallik of Chandler AZ (US) (â links)
- Category:Sagar Suthram of Portland OR (US) (â links)
- Category:Wilfred Gomes of Portland OR (US) (â links)
- Category:Nitin A. Deshpande of Chandler AZ (US) (â links)