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Category:H01L21/68
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Pages in category "H01L21/68"
The following 44 pages are in this category, out of 44 total.
1
- 17383849. METHOD FOR CALIBRATING ALIGNMENT OF WAFER AND LITHOGRAPHY SYSTEM simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17525729. LAYER FORMING SYSTEM INCLUDING COVER WITH SUPPORT PADS, A POSITIONING SYSTEM WITH THE COVER AND SUPPORT PADS, AND A METHOD OF LOADING A PLATE simplified abstract (CANON KABUSHIKI KAISHA)
- 17541946. SILICON HANDLER WITH LASER-RELEASE LAYERS simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17708301. SEMICONDUCTOR DEVICE TRANSFER STRUCTURE, DISPLAY APPARATUS, AND METHOD OF MANUFACTURING DISPLAY APPARATUS simplified abstract (Samsung Electronics Co., Ltd.)
- 17836199. OPTICAL ASSEMBLY FOR ALIGNMENT INSPECTION, OPTICAL APPARATUS INCLUDING THE SAME, DIE BONDING SYSTEM AND DIE BONDING METHOD USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18059291. SYSTEMS, DEVICES, AND METHODS FOR REGISTERING A SUPERSTRATE OF AN IMPRINT TOOL simplified abstract (CANON KABUSHIKI KAISHA)
- 18078249. MOUNTING DEVICE AND MOUNTING METHOD simplified abstract (Samsung Electronics Co., Ltd.)
- 18081102. WAFER TYPE SENSOR, WAFER ALIGNMENT METHOD USING THE SAME, AND CALIBRATION DEVICE FOR CALIBRATING WAFER TYPE SENSOR simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18086992. CHIP WET TRANSFER APPARATUS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18133242. SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18162182. SENSOR MODULE AND SUBSTRATE PROCESSING APPARATUS USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18217020. SEMICONDUCTOR PROCESSING DEVICE AND SEMICONDUCTOR PROCESSING SYSTEM simplified abstract (Samsung Electronics Co., Ltd.)
- 18255037. SUBSTRATE FOR CARRYING WAFER simplified abstract (NIPPON TELEGRAPH AND TELEPHONE CORPORATION)
- 18376512. SUBSTRATE TRANSFER UNIT AND SUBSTRATE TRANSFER CONTROL METHOD simplified abstract (Tokyo Electron Limited)
- 18435175. CALIBRATION JIG AND CALIBRATION METHOD simplified abstract (Applied Materials, Inc.)
- 18457785. MOUNTING DEVICE AND MOUNTING METHOD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18465533. SEMICONDUCTOR MANUFACTURING EQUIPMENT, AND METHOD FOR TRANSPORTING REPLACEABLE COMPONENTS IN THE SEMICONDUCTOR MANUFACTURING EQUIPMENT simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18469684. SUBSTRATE LOADING DEVICE AND SUBSTRATE LOADING METHOD USING THE SAME simplified abstract (Samsung Display Co., Ltd.)
- 18521314. Wafer Positioning Method and Apparatus simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18581722. WAFER NOTCH POSITIONING DETECTION simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
C
S
- Samsung display co., ltd. (20240096679). SUBSTRATE LOADING DEVICE AND SUBSTRATE LOADING METHOD USING THE SAME simplified abstract
- Samsung Display Co., Ltd. patent applications on March 21st, 2024
- Samsung electronics co., ltd. (20240105524). OPTICAL DEVICE, DIE BONDING SYSTEM, AND DIE BONDING METHOD simplified abstract
- Samsung electronics co., ltd. (20240120224). SEMICONDUCTOR MANUFACTURING EQUIPMENT, AND METHOD FOR TRANSPORTING REPLACEABLE COMPONENTS IN THE SEMICONDUCTOR MANUFACTURING EQUIPMENT simplified abstract
- Samsung electronics co., ltd. (20240178025). SEMICONDUCTOR PROCESSING DEVICE AND SEMICONDUCTOR PROCESSING SYSTEM simplified abstract
- Samsung electronics co., ltd. (20240186278). MOUNTING DEVICE AND MOUNTING METHOD simplified abstract
- SAMSUNG ELECTRONICS CO., LTD. patent applications on April 11th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on January 25th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on June 6th, 2024
- Samsung Electronics Co., Ltd. patent applications on June 6th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on March 28th, 2024
- Samsung Electronics Co., Ltd. patent applications on May 30th, 2024
T
- Taiwan semiconductor manufacturing co., ltd. (20240096677). Wafer Positioning Method and Apparatus simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240194513). WAFER NOTCH POSITIONING DETECTION simplified abstract
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on June 13th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on March 21st, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on February 8th, 2024
U
- US Patent Application 18347971. SYSTEM FOR TRANSFERRING SUBSTRATE AND METHOD FOR TRANSFERRING SUBSTRATE USING THE SAME simplified abstract
- US Patent Application 18359416. System and Method for Bonding Semiconductor Devices simplified abstract
- US Patent Application 18448869. APPARATUS FOR AND METHOD FOR ALIGNING DIPOLES AND METHOD OF FABRICATING DISPLAY DEVICE simplified abstract