20250218998. Low Temperature Solder Inter (Intel)
LOW TEMPERATURE SOLDER INTERCONNECT FOR PACKAGE PITCH SCALING
Abstract: embodiments disclosed herein include an apparatus that comprises a first substrate and a second substrate over the first substrate. in an embodiment, an array of interconnects is provided between the first substrate and the second substrate. the array of interconnects comprises a first interconnect with a first material composition, and a second interconnect with a second material composition that is different than the first material composition.
Inventor(s): Bohan SHAN, Shripad GOKHALE, Rui ZHANG, Mine KAYA, Haobo CHEN, Steve S. CHO, Timothy GOSSELIN, Kartik SRINIVASAN, Edvin CETEGEN, Kyle ARRINGTON, Nicholas S. HAEHN, Ryan CARRAZZONE, Hongxia FENG, Srinivas Venkata Ramanuja PIETAMBARAM, Gang DUAN, Ashay DANI, Yoshihiro TOMITA, Ziyin LIN, Yiqun BAI, Jose WAIMIN, Dingying David XU, Bin MU, Mohit GUPTA, Jeremy D. ECTON, Brandon C. MARIN, Xiaoying GUO, Jung Kyu HAN, Liang HE
CPC Classification: H01L24/14 ({of a plurality of bump connectors})
Search for rejections for patent application number 20250218998
- Patent Applications
- Intel Corporation
- CPC H01L24/14
- Bohan SHAN of Chandler AZ US
- Shripad GOKHALE of Gilbert AZ US
- Rui ZHANG of Chandler AZ US
- Mine KAYA of Scottsdale AZ US
- Haobo CHEN of Chandler AZ US
- Steve S. CHO of Chandler AZ US
- Timothy GOSSELIN of Phoenix AZ US
- Kartik SRINIVASAN of Gilbert AZ US
- Edvin CETEGEN of Chandler AZ US
- Kyle ARRINGTON of Gilbert AZ US
- Nicholas S. HAEHN of Scottsdale AZ US
- Ryan CARRAZZONE of Chandler AZ US
- Hongxia FENG of Chandler AZ US
- Srinivas Venkata Ramanuja PIETAMBARAM of Chandler AZ US
- Gang DUAN of Chandler AZ US
- Ashay DANI of Chandler AZ US
- Yoshihiro TOMITA of Tsukuba-shi JP
- Ziyin LIN of Chandler AZ US
- Yiqun BAI of Chandler AZ US
- Jose WAIMIN of Gilbert AZ US
- Dingying David XU of Chandler AZ US
- Bin MU of Tempe AZ US
- Mohit GUPTA of Chandler AZ US
- Jeremy D. ECTON of Gilbert AZ US
- Brandon C. MARIN of Gilbert AZ US
- Xiaoying GUO of Chandler AZ US
- Jung Kyu HAN of Chandler AZ US
- Liang HE of Chandler AZ US