18920749. STACKED SEMICONDUCTOR DEVICE WITH SEMICONDUCTOR DIES OF VARIABLE SIZE (Micron Technology, Inc.)
STACKED SEMICONDUCTOR DEVICE WITH SEMICONDUCTOR DIES OF VARIABLE SIZE
Organization Name
Inventor(s)
Kunal R. Parekh of Boise ID US
Akshay N. Singh of Boise ID US
STACKED SEMICONDUCTOR DEVICE WITH SEMICONDUCTOR DIES OF VARIABLE SIZE
This abstract first appeared for US patent application 18920749 titled 'STACKED SEMICONDUCTOR DEVICE WITH SEMICONDUCTOR DIES OF VARIABLE SIZE
Original Abstract Submitted
A semiconductor device assembly is disclosed. The semiconductor device assembly includes a first semiconductor die and second semiconductor dies and an additional semiconductor component coupled with the logic die. Dielectric peripheral material is disposed along sidewalls of the first die and extends beyond a first footprint of the first die. A gap fill material is disposed at the first die and at the dielectric peripheral material beyond a second footprint of the second semiconductor dies and a third footprint of the additional semiconductor component such that the gap fill material at least partially surrounds the second semiconductor dies and the additional semiconductor component.
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