Category:Aniket Patil of San Diego CA (US)
Aniket Patil
Aniket Patil from San Diego CA (US) has applied for patents in technology areas such as H01L23/498, H01L23/00, H01L23/538 with qualcomm incorporated.
Patents
Pages in category "Aniket Patil of San Diego CA (US)"
The following 28 pages are in this category, out of 28 total.
1
- 17386278. SENSE LINES FOR HIGH-SPEED APPLICATION PACKAGES simplified abstract (QUALCOMM Incorporated)
- 17443740. SPLIT DIE INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING DIE-TO-DIE (D2D) CONNECTIONS IN DIE-SUBSTRATE STANDOFF CAVITY, AND RELATED FABRICATION METHODS simplified abstract (QUALCOMM Incorporated)
- 17455576. RECESS STRUCTURE FOR PADLESS STACK VIA simplified abstract (QUALCOMM Incorporated)
- 17456068. INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING A PACKAGE SUBSTRATE WITH A DOUBLE SIDE EMBEDDED TRACE SUBSTRATE (ETS), AND RELATED FABRICATION METHODS simplified abstract (QUALCOMM Incorporated)
- 17532754. PACKAGE COMPRISING CHANNEL INTERCONNECTS LOCATED BETWEEN SOLDER INTERCONNECTS simplified abstract (QUALCOMM Incorporated)
- 17816502. DEEP TRENCH CAPACITORS (DTCs) EMPLOYING BYPASS METAL TRACE SIGNAL ROUTING, AND RELATED INTEGRATED CIRCUIT (IC) PACKAGES AND FABRICATION METHODS simplified abstract (QUALCOMM Incorporated)
- 17879594. PACKAGE COMPRISING AN INTEGRATED DEVICE AND A FIRST METALLIZATION PORTION COUPLED TO A SECOND METALLIZATION PORTION simplified abstract (QUALCOMM Incorporated)
- 18179223. SPLIT PAD WITH TEST LINE simplified abstract (QUALCOMM Incorporated)
- 18340556. PACKAGE COMPRISING SIDEWALL INTERCONNECTS CONFIGURED FOR POWER ROUTING (QUALCOMM Incorporated)
- 18340733. PACKAGE COMPRISING OPTICAL INTEGRATED DEVICE simplified abstract (QUALCOMM Incorporated)
- 18455439. DEVICE INCLUDING SUBSTRATE WITH PASSIVE ELECTRONIC COMPONENT EMBEDDED THEREIN (QUALCOMM Incorporated)
- 18455928. PACKAGE-ON-PACKAGE DEVICE INCLUDING REDISTRIBUTION DIE (QUALCOMM Incorporated)
- 18460471. PACKAGE COMPRISING AN INTEGRATED DEVICE AND A METALLIZATION PORTION WITH VARIABLE THICKNESS METALLIZATION INTERCONNECTS ON A SAME METAL LAYER simplified abstract (QUALCOMM Incorporated)
- 18607170. PACKAGE COMPRISING AN OPTICAL INTEGRATED DEVICE simplified abstract (QUALCOMM Incorporated)
- 18817038. INKJET PRINTING DEDICATED TEST PINS (QUALCOMM Incorporated)
Q
- Qualcomm incorporated (20240105568). PACKAGE COMPRISING A SUBSTRATE WITH INTERCONNECTS simplified abstract
- Qualcomm incorporated (20240105687). PACKAGE COMPRISING A FLEXIBLE SUBSTRATE simplified abstract
- Qualcomm incorporated (20240105688). PACKAGE COMPRISING AN INTEGRATED DEVICE, A CHIPLET AND A METALLIZATION PORTION simplified abstract
- Qualcomm incorporated (20240276739). DISCRETE DEVICE INTERCONNECTIONS BETWEEN STACKED SUBSTRATES simplified abstract
- Qualcomm incorporated (20240304503). SPLIT PAD WITH TEST LINE simplified abstract
- Qualcomm incorporated (20240319455). PACKAGE COMPRISING AN OPTICAL INTEGRATED DEVICE simplified abstract
- Qualcomm incorporated (20240321709). PACKAGE COMPRISING AN INTEGRATED DEVICE AND A METALLIZATION PORTION WITH VARIABLE THICKNESS METALLIZATION INTERCONNECTS ON A SAME METAL LAYER simplified abstract
- Qualcomm incorporated (20240321849). PACKAGE COMPRISING OPTICAL INTEGRATED DEVICE simplified abstract
- Qualcomm incorporated (20240421105). INKJET PRINTING DEDICATED TEST PINS
- Qualcomm incorporated (20240429141). PACKAGE COMPRISING SIDEWALL INTERCONNECTS CONFIGURED FOR POWER ROUTING
- Qualcomm incorporated (20250062203). SUBSTRATE(S) FOR AN INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING A CORE LAYER AND AN ADJACENT INSULATION LAYER(S) WITH AN EMBEDDED METAL STRUCTURE(S) POSITIONED FROM THE CORE LAYER
- Qualcomm incorporated (20250070001). DEVICE INCLUDING SUBSTRATE WITH PASSIVE ELECTRONIC COMPONENT EMBEDDED THEREIN
- Qualcomm incorporated (20250070086). PACKAGE-ON-PACKAGE DEVICE INCLUDING REDISTRIBUTION DIE