Taiwan semiconductor manufacturing company, ltd. (20240379407). TRENCH FILLING THROUGH REFLOWING FILLING MATERIAL simplified abstract

TRENCH FILLING THROUGH REFLOWING FILLING MATERIAL

Organization Name

taiwan semiconductor manufacturing company, ltd.

Inventor(s)

Wen-Yen Chen of Hsinchu (TW)

Li-Ting Wang of Hsinchu (TW)

Wan-Chen Hsieh of Hsinchu (TW)

Bo-Cyuan Lu of New Taipei City (TW)

Tai-Chun Huang of Hsinchu (TW)

Huicheng Chang of Tainan City (TW)

Yee-Chia Yeo of Hsinchu (TW)

TRENCH FILLING THROUGH REFLOWING FILLING MATERIAL - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240379407 titled 'TRENCH FILLING THROUGH REFLOWING FILLING MATERIAL

The method described in the patent application involves the formation of protruding fins over a base structure with a trench in between, followed by the deposition of trench-filling material and a laser reflow process on the material. The reflow process heats the material to a temperature between its melting point and the melting point of the fins, solidifying it afterwards. The trench-filling material is then patterned, with a remaining portion forming part of a gate stack, and a source/drain region is formed on the side of the gate stack.

• Formation of protruding fins over a base structure with a trench in between
• Deposition of trench-filling material and laser reflow process
• Heating the material to a specific temperature range for solidification
• Patterning of the material to form part of a gate stack
• Formation of a source/drain region on the side of the gate stack

Potential Applications: - Semiconductor manufacturing - Integrated circuit fabrication - Nanotechnology research

Problems Solved: - Improving the efficiency and precision of semiconductor device manufacturing - Enhancing the performance of integrated circuits - Facilitating the development of advanced nanoscale technologies

Benefits: - Increased device performance and functionality - Enhanced manufacturing processes - Potential for smaller and more powerful electronic devices

Commercial Applications: Title: Advanced Semiconductor Manufacturing Method This technology could be utilized in the production of high-performance electronic devices such as smartphones, computers, and other consumer electronics. It may also find applications in the automotive industry for advanced driver assistance systems and autonomous vehicles.

Questions about the technology: 1. How does the laser reflow process improve the performance of the semiconductor devices? 2. What are the specific advantages of using protruding fins in the fabrication process?

Original Abstract Submitted

a method includes forming a first protruding fin and a second protruding fin over a base structure, with a trench located between the first protruding fin and the second protruding fin, depositing a trench-filling material extending into the trench, and performing a laser reflow process on the trench-filling material. in the reflow process, the trench-filling material has a temperature higher than a first melting point of the trench-filling material, and lower than a second melting point of the first protruding fin and the second protruding fin. after the laser reflow process, the trench-filling material is solidified. the method further includes patterning the trench-filling material, with a remaining portion of the trench-filling material forming a part of a gate stack, and forming a source/drain region on a side of the gate stack.