Category:Tai-Chun Huang of Hsinchu (TW)
Tai-Chun Huang
Tai-Chun Huang from Hsinchu (TW) has applied for patents in technology areas such as H01L21/762, H01L21/02 with taiwan semiconductor manufacturing co., ltd..
Patents
Pages in category "Tai-Chun Huang of Hsinchu (TW)"
The following 12 pages are in this category, out of 12 total.
1
- 18322921. SEMICONDUCTOR STRUCTURE INCLUDING OPTICAL DEVICE AND METHOD FOR MANUFACTURING THE SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18464993. METHOD FOR FILLING GAP (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18668960. Forming Isolation Regions for Separating Fins and Gate Stacks simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18753240. DIELECTRIC SPACER TO PREVENT CONTACTING SHORTING simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
T
- Taiwan semiconductor manufacturing co., ltd. (20240429313). SELECTIVE BOTTOM SEED LAYER FORMATION FOR BOTTOM-UP EPITAXY
- Taiwan semiconductor manufacturing co., ltd. (20250087529). METHOD FOR FILLING GAP
- Taiwan semiconductor manufacturing company, ltd. (20240230996). SEMICONDUCTOR STRUCTURE INCLUDING OPTICAL DEVICE AND METHOD FOR MANUFACTURING THE SAME simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240304496). Forming Isolation Regions for Separating Fins and Gate Stacks simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240347623). DIELECTRIC SPACER TO PREVENT CONTACTING SHORTING simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379407). TRENCH FILLING THROUGH REFLOWING FILLING MATERIAL simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240413157). SEMICONDUCTOR DEVICE AND METHOD