Category:Yee-Chia Yeo of Hsinchu (TW)
Yee-Chia Yeo
Yee-Chia Yeo from Hsinchu (TW) has applied for patents in technology areas such as H01L29/66, H01L21/02, H01L29/10 with taiwan semiconductor manufacturing co., ltd..
Patents
Pages in category "Yee-Chia Yeo of Hsinchu (TW)"
The following 59 pages are in this category, out of 59 total.
1
- 17459043. Systems, Methods, and Semiconductor Devices simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17461688. APPARATUS, SYSTEM, AND METHOD FOR MEASURING THE TEMPERATURE OF A SUBSTRATE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17463000. Method of Forming A Semiconductor Device simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17567659. Semiconductor Device and Method of Forming Same simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17657822. Adjusting the Profile of Source/Drain Regions to Reduce Leakage simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17809025. METAL LAYER PROTECTION DURING WET ETCHING simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18151761. NANO-FET SEMICONDUCTOR DEVICE AND METHOD OF FORMING simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18366864. SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18390439. ION IMPLANTATION WITH ANNEALING FOR SUBSTRATE CUTTING simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18401780. Ion Implantation For Nano-FET simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18401955. Shallow Trench Isolation Forming Method and Structures Resulting Therefrom simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18502183. Sacrificial Layer for Semiconductor Process simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18508788. MELT ANNEAL SOURCE AND DRAIN REGIONS simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18521314. Wafer Positioning Method and Apparatus simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18526397. TRANSISTOR ISOLATION REGIONS AND METHODS OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18585422. NANOSHEET SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18624725. METAL LAYER PROTECTION DURING WET ETCHING simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18625377. SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18636490. Source/Drain Device and Method of Forming Thereof simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18639595. HEAT DISSIPATION FOR SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18654111. SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18956113. FIN FIELD EFFECT TRANSISTOR DEVICE STRUCTURE (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18957156. LOW GE ISOLATED EPITAXIAL LAYER GROWTH OVER NANO-SHEET ARCHITECTURE DESIGN FOR RP REDUCTION (Taiwan Semiconductor Manufacturing Co., Ltd.)
T
- Taiwan semiconductor manufacturing co., ltd. (20240096677). Wafer Positioning Method and Apparatus simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240096897). TRANSISTOR ISOLATION REGIONS AND METHODS OF FORMING THE SAME simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240194788). NANOSHEET SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240250147). METAL LAYER PROTECTION DURING WET ETCHING simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20250089286). FIN FIELD EFFECT TRANSISTOR DEVICE STRUCTURE
- Taiwan semiconductor manufacturing co., ltd. (20250089295). LOW GE ISOLATED EPITAXIAL LAYER GROWTH OVER NANO-SHEET ARCHITECTURE DESIGN FOR RP REDUCTION
- Taiwan semiconductor manufacturing company, ltd. (20240120314). ION IMPLANTATION WITH ANNEALING FOR SUBSTRATE CUTTING simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240136220). Shallow Trench Isolation Forming Method and Structures Resulting Therefrom simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240136228). Ion Implantation For Nano-FET simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240266229). SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240266285). HEAT DISSIPATION FOR SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240266398). Source/Drain Device and Method of Forming Thereof simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240321751). SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240377263). APPARATUS, SYSTEM, AND METHOD FOR MEASURING THE TEMPERATURE OF A SUBSTRATE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379355). INTEGRATED PHOTORESIST REMOVAL AND LASER ANNEALING simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379356). INTEGRATED PHOTORESIST REMOVAL AND LASER ANNEALING simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379407). TRENCH FILLING THROUGH REFLOWING FILLING MATERIAL simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379446). Dual Dopant Source/Drain Regions and Methods of Forming Same simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379454). Source/Drain Regions and Methods of Forming Same simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379461). TRANSISTOR ISOLATION REGIONS simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379616). DYNAMIC BONDING GAP CONTROL AND TOOL FOR WAFER BONDING simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379663). LEAKAGE REDUCTION BY HALO-IMP TECHNOLOGY IN MESA REGION OF NANO SHEET DEVICE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379751). Semiconductor Device and Method of Manufacture simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379781). Backside Source/Drain Contacts and Methods of Forming the Same simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20250063807). SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING
U
- US Patent Application 17749038. INTEGRATED PHOTORESIST REMOVAL AND LASER ANNEALING simplified abstract
- US Patent Application 18358112. Semiconductor Device and Method simplified abstract
- US Patent Application 18359414. SEMICONDUCTOR DEVICE WITH CONNECTING STRUCTURE HAVING A DOPED LAYER AND METHOD FOR FORMING THE SAME simplified abstract
- US Patent Application 18362707. TRANSISTOR ISOLATION REGIONS AND METHODS OF FORMING THE SAME simplified abstract
- US Patent Application 18364588. Warm Wafer After Ion Cryo-Implantation simplified abstract
- US Patent Application 18365654. SEMICONDUCTOR DEVICE AND METHOD simplified abstract
- US Patent Application 18365832. Source/Drain Regions and Methods of Forming Same simplified abstract
- US Patent Application 18446416. AMBIENT CONTROLLED TWO-STEP THERMAL TREATMENT FOR SPIN-ON COATING LAYER PLANARIZATION simplified abstract
- US Patent Application 18446738. SYSTEM AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES simplified abstract
- US Patent Application 18447493. Apparatus and Method for Use with a Substrate Chamber simplified abstract