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  • Patent Applications Report for 31st May 2024
    ...8]] (7), [[:Category:H04W72/0446|H04W72/0446]] (6), [[:Category:H01L23/538|H01L23/538]] (5) ...the areas of [[:Category:H04W72/23|H04W72/23]] (14), [[:Category:H01L23/00|H01L23/00]] (13), [[:Category:H10B80/00|H10B80/00]] (13), [[:Category:H10B43/27|H1
    55 KB (6,817 words) - 03:50, 10 June 2024
  • TEXAS INSTRUMENTS INCORPORATED patent applications on April 4th, 2024
    ...2M1/00]] (5), [[:Category:H01L27/01|H01L27/01]] (5), [[:Category:H01L23/66|H01L23/66]] (4) IPC Code(s): H01L21/768, H01L23/522, H01L23/528
    55 KB (8,096 words) - 08:52, 11 April 2024
  • Patent Applications Report for 3rd Mar 2023
    ...:Category:H01L21/768|H01L21/768]] (56 applications), [[:Category:H01L23/00|H01L23/00]] (54 applications), [[:Category:H01L29/423|H01L29/423]] (47 application ...ry:H01L27/11582|H01L27/11582]] (12 applications), [[:Category:H01L23/49816|H01L23/49816]] (12 applications)
    38 KB (4,639 words) - 04:49, 2 January 2024
  • SK hynix Inc. patent applications on May 30th, 2024
    IPC Code(s): G05F1/46, G05F1/575 ...le signal during an activation period of an enable signal.[[Category:G05F1/46]][[Category:G05F1/575]][[Category:sk hynix inc.]]
    39 KB (6,167 words) - 08:20, 31 May 2024
  • Patent Applications Report for 1st Mar 2024
    ...[:Category:H01L24/16|H01L24/16]] (17 applications), [[:Category:H01L23/498|H01L23/498]] (17 applications), [[:Category:H10B43/27|H10B43/27]] (15 applications ...:Category:G06F3/0679|G06F3/0679]] (38 applications), [[:Category:H01L23/00|H01L23/00]] (28 applications), [[:Category:H01L27/11582|H01L27/11582]] (27 applica
    45 KB (5,535 words) - 03:18, 4 March 2024
  • Patent Applications Report for 24th Nov 2023
    ...:Category:H01L29/423|H01L29/423]] (43 applications), [[:Category:H01L23/00|H01L23/00]] (43 applications) ...ategory:H01M4/04|H01M4/04]] (9 applications), [[:Category:H01M50/46|H01M50/46]] (8 applications)
    36 KB (4,390 words) - 15:28, 6 December 2023
  • Patent Applications Report for 14th Apr 2023
    ...[[:Category:H01L24/16|H01L24/16]] (13 applications), [[:Category:H01L23/00|H01L23/00]] (12 applications), [[:Category:H01L27/092|H01L27/092]] (9 applications ...[:Category:H01L29/66|H01L29/66]] (25 applications), [[:Category:H01L23/528|H01L23/528]] (17 applications), [[:Category:H01L21/768|H01L21/768]] (17 applicatio
    36 KB (4,381 words) - 18:22, 2 January 2024
  • Patent Applications Report for 17th May 2024
    ...(2), [[:Category:H04L67/1001|H04L67/1001]] (2), [[:Category:H01Q3/46|H01Q3/46]] (2), [[:Category:G02B27/01|G02B27/01]] (2), [[:Category:G06F3/04815|G06F3 ...:Category:H01L25/065|H01L25/065]] (11 applications), [[:Category:H01L23/00|H01L23/00]] (11 applications)
    47 KB (5,826 words) - 06:52, 24 May 2024
  • Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on June 20th, 2024
    ...the areas of [[:Category:H01L29/66|H01L29/66]] (10), [[:Category:H01L23/00|H01L23/00]] (10), [[:Category:H01L29/78|H01L29/78]] (8), [[:Category:H01L21/8234|H IPC Code(s): B32B38/18, H01L21/48, H01L23/00
    85 KB (12,382 words) - 16:47, 21 June 2024
  • Patent Applications Report for 7th Jun 2024
    ...he areas of [[:Category:H01L23/00|H01L23/00]] (11), [[:Category:H01L23/498|H01L23/498]] (7), [[:Category:H01L21/48|H01L21/48]] (7), [[:Category:H04L5/00|H04L ...), [[:Category:CPC_H04L5/0053|H04L5/0053]] (2), [[:Category:CPC_H01L23/562|H01L23/562]] (2)
    60 KB (7,485 words) - 02:41, 11 June 2024
  • KABUSHIKI KAISHA TOSHIBA patent applications on March 14th, 2024
    .../872]] (4), [[:Category:H01L23/492|H01L23/492]] (4), [[:Category:H01L23/13|H01L23/13]] (4), [[:Category:H01L29/78|H01L29/78]] (4), [[:Category:H01L29/66068|H IPC Code(s): H01F27/36, H01F27/28, H01F27/32, H01F38/14, H01L23/552, H01L25/16
    50 KB (7,547 words) - 03:05, 19 March 2024
  • Texas Instruments Incorporated patent applications on February 29th, 2024
    ...areas of [[:Category:H01L23/498|H01L23/498]] (4), [[:Category:H01L23/49838|H01L23/49838]] (4), [[:Category:G01R31/371|G01R31/371]] (4), [[:Category:H04W40/32 IPC Code(s): G11C17/18, G11C17/16, H01L23/525, H10B20/25
    54 KB (8,046 words) - 05:00, 4 March 2024
  • Patent Applications Report for 9th Feb 2024
    ...[:Category:H10B80/00|H10B80/00]] (12 applications), [[:Category:H01L23/498|H01L23/498]] (12 applications), [[:Category:H04W72/232|H04W72/232]] (12 applicatio ...[[:Category:H01L29/66|H01L29/66]] (19 applications), [[:Category:H01L23/00|H01L23/00]] (15 applications), [[:Category:H01L29/06|H01L29/06]] (14 applications)
    46 KB (5,558 words) - 04:10, 9 February 2024
  • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on April 4th, 2024
    IPC Code(s): H01L21/56, H01L21/306, H01L21/768, H01L21/78, H01L23/522, H01L23/538 ...tegory:H01L21/768]][[Category:H01L21/78]][[Category:H01L23/522]][[Category:H01L23/538]][[Category:taiwan semiconductor manufacturing company, ltd.]]
    93 KB (13,424 words) - 08:20, 11 April 2024
  • Patent Applications Report for 26th Jan 2024
    ...CTRONICS CO., LTD. has filed patents in the areas of [[:Category:H01L23/00|H01L23/00]] (13 applications), [[:Category:H01L24/16|H01L24/16]] (12 applications) ...[:Category:G06N3/084|G06N3/084]] (6 applications), [[:Category:H01L23/5386|H01L23/5386]] (5 applications), [[:Category:H01L24/16|H01L24/16]] (5 applications)
    45 KB (5,610 words) - 10:14, 30 January 2024
  • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on March 28th, 2024
    IPC Code(s): G11C11/412, H01L23/48, H10B10/00 ...cture of the second pull-down transistor.[[Category:G11C11/412]][[Category:H01L23/48]][[Category:H10B10/00]][[Category:taiwan semiconductor manufacturing com
    105 KB (15,276 words) - 04:53, 11 April 2024
  • Patent Applications Report for 2nd Feb 2024
    ...[[:Category:H10B80/00|H10B80/00]] (26 applications), [[:Category:H01L23/00|H01L23/00]] (14 applications), [[:Category:H10B41/27|H10B41/27]] (10 applications) ...[:Category:H01L21/78|H01L21/78]] (10 applications), [[:Category:H01L23/522|H01L23/522]] (9 applications)
    46 KB (5,621 words) - 06:41, 2 February 2024
  • HUAWEI TECHNOLOGIES CO., LTD. patent applications on June 13th, 2024
    IPC Code(s): H01L23/42, H01L21/48, H01L23/31, H01L23/538 CPC Code(s): H01L23/42
    62 KB (9,608 words) - 04:56, 14 June 2024
  • Patent Applications Report for 5th Apr 2024
    ...Category:H01L27/088|H01L27/088]] (19 applications), [[:Category:H01L23/498|H01L23/498]] (18 applications), [[:Category:H01L21/48|H01L21/48]] (15 applications ...[[:Category:H04W72/23|H04W72/23]] (9 applications), [[:Category:H01L23/00|H01L23/00]] (8 applications), [[:Category:H04L5/00|H04L5/00]] (7 applications), [[
    48 KB (5,854 words) - 07:18, 12 April 2024
  • Patent Applications Report for 28th Apr 2023
    ...:Category:H01L51/00|H01L51/00]] (9 applications), [[:Category:H01L23/49838|H01L23/49838]] (9 applications), [[:Category:H01L24/16|H01L24/16]] (9 applications ...Category:A01H5/10|A01H5/10]] (78 applications), [[:Category:A01H6/46|A01H6/46]] (39 applications), [[:Category:A01H6/4684|A01H6/4684]] (39 applications),
    35 KB (4,354 words) - 01:42, 3 January 2024

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