Patent Applications Report for 24th Nov 2023
Contents
- 1 Patent Applications Report for 24th Nov 2023
Patent Applications Report for 24th Nov 2023
Organizations to watch
Tesla, Inc.: 3 patent applications
Tesla, Inc. has applied for patents in the areas of B62D21/02 (2), H01G11/38 (2), B60R19/24 (2), G06V20/56 (2), G06T17/00 (2)
With keywords such as: driving, electrode, energy, integrated, active, hybrid, absorbing, layer, such, film in patent application abstracts.
Apple Inc.: 58 patent applications
Apple Inc. has applied for patents in the areas of G06T7/70 (10), G06T19/20 (8), G06T19/00 (6), G06N20/00 (6), G06F3/14 (5)
With keywords such as: device, user, can, electronic, based, object, data, representation, physical, some in patent application abstracts.
Top 20 organizations
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.: 267 patent applications
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. has filed patents in the areas of H01L29/66 (68 applications), H01L29/78 (48 applications), H01L29/06 (46 applications), H01L29/423 (43 applications), H01L23/00 (43 applications)
With keywords such as: layer, structure, semiconductor, substrate, gate, dielectric, device, region, forming, disposed in their patent application abstracts.
Samsung Electronics Co.,Ltd.: 102 patent applications
Samsung Electronics Co.,Ltd. has filed patents in the areas of H01L29/775 (10 applications), H10B41/27 (7 applications), H01L29/06 (7 applications), H10B43/27 (6 applications), H01L29/0673 (6 applications)
With keywords such as: device, data, layer, memory, including, semiconductor, configured, least, based, information in their patent application abstracts.
APPLE INC.: 58 patent applications
APPLE INC. has filed patents in the areas of G06T7/70 (10 applications), G06T19/20 (8 applications), G06T19/00 (6 applications), G06N20/00 (6 applications), G06F3/14 (5 applications)
With keywords such as: device, user, can, electronic, based, object, data, representation, physical, some in their patent application abstracts.
QUALCOMM Incorporated: 56 patent applications
QUALCOMM Incorporated has filed patents in the areas of H04L5/00 (12 applications), H04W72/0446 (10 applications), H04W74/08 (8 applications), H04W24/08 (8 applications), H04W72/12 (6 applications)
With keywords such as: wireless, data, based, network, least, communication, user, signal, message, entity in their patent application abstracts.
CANON KABUSHIKI KAISHA: 55 patent applications
CANON KABUSHIKI KAISHA has filed patents in the areas of G06T7/70 (6 applications), G03G15/00 (5 applications), B41J2/175 (5 applications), H04N23/52 (4 applications), H04N19/132 (4 applications)
With keywords such as: image, unit, member, configured, apparatus, portion, communication, based, object, information in their patent application abstracts.
GOOGLE LLC: 55 patent applications
GOOGLE LLC has filed patents in the areas of G06N3/08 (8 applications), G06N20/00 (6 applications), G10L15/22 (6 applications), G06V10/70 (5 applications), G06F40/284 (4 applications)
With keywords such as: device, data, user, can, media, content, based, computing, item, network in their patent application abstracts.
TOYOTA JIDOSHA KABUSHIKI KAISHA: 52 patent applications
TOYOTA JIDOSHA KABUSHIKI KAISHA has filed patents in the areas of B60W50/14 (8 applications), B60W40/08 (6 applications), G05D2201/0213 (4 applications), G05D1/00 (4 applications), B60W60/00 (4 applications)
With keywords such as: vehicle, device, portion, process, control, fuel, when, unit, configured, data in their patent application abstracts.
SAMSUNG DISPLAY CO., LTD.: 50 patent applications
SAMSUNG DISPLAY CO., LTD. has filed patents in the areas of H10K59/131 (17 applications), H10K59/122 (12 applications), H10K59/40 (12 applications), H10K71/00 (8 applications), G09G3/3233 (7 applications)
With keywords such as: layer, display, area, including, disposed, substrate, electrode, portion, light, device in their patent application abstracts.
Microsoft Technology Licensing, LLC: 50 patent applications
Microsoft Technology Licensing, LLC has filed patents in the areas of G06N20/00 (6 applications), G06N3/08 (5 applications), G06F9/455 (5 applications), G06K9/62 (4 applications), H04L67/10 (4 applications)
With keywords such as: data, device, application, based, user, code, between, computing, network, configured in their patent application abstracts.
Huawei Technologies Co., Ltd.: 45 patent applications
Huawei Technologies Co., Ltd. has filed patents in the areas of H04W24/10 (4 applications), H04W72/0453 (4 applications), H04W24/08 (4 applications), H04B7/0456 (4 applications), H04L5/0048 (3 applications)
With keywords such as: device, data, network, information, application, this, transmission, where, based, signal in their patent application abstracts.
Telefonaktiebolaget LM Ericsson (publ): 43 patent applications
Telefonaktiebolaget LM Ericsson (publ) has filed patents in the areas of H04L5/00 (6 applications), H04W36/00 (5 applications), H04W74/08 (5 applications), H04W72/21 (4 applications), H04W76/30 (4 applications)
With keywords such as: network, node, wireless, device, radio, information, comprises, data, receiving, performed in their patent application abstracts.
LG Energy Solution, Ltd.: 41 patent applications
LG Energy Solution, Ltd. has filed patents in the areas of H01M10/0525 (14 applications), H01M10/052 (11 applications), H01M50/105 (10 applications), H01M4/04 (9 applications), H01M50/46 (8 applications)
With keywords such as: electrode, battery, material, surface, layer, part, unit, cell, module, negative in their patent application abstracts.
Hyundai Motor Company: 39 patent applications
Hyundai Motor Company has filed patents in the areas of B60L58/12 (10 applications), B60K35/00 (4 applications), H04W76/14 (4 applications), H01M8/04955 (4 applications), B60W40/105 (4 applications)
With keywords such as: vehicle, configured, battery, information, fuel, control, terminal, controller, communication, cell in their patent application abstracts.
Kia Corporation: 39 patent applications
Kia Corporation has filed patents in the areas of B60L58/12 (10 applications), B60K35/00 (4 applications), H04W76/14 (4 applications), H01M8/04955 (4 applications), B60W40/105 (4 applications)
With keywords such as: in their patent application abstracts.
Mitsubishi Electric Corporation: 37 patent applications
Mitsubishi Electric Corporation has filed patents in the areas of F25B13/00 (4 applications), H02K1/02 (4 applications), F24F11/52 (4 applications), A47K10/48 (2 applications), F25B41/40 (2 applications)
With keywords such as: unit, device, information, portion, apparatus, heat, power, control, third, port in their patent application abstracts.
LG Electronics Inc.: 37 patent applications
LG Electronics Inc. has filed patents in the areas of H04N19/176 (10 applications), H04L5/00 (6 applications), H04N19/132 (6 applications), A47L9/28 (5 applications), H04N19/186 (4 applications)
With keywords such as: device, data, block, basis, mode, information, present, unit, prediction, transmitting in their patent application abstracts.
NEC Corporation: 36 patent applications
NEC Corporation has filed patents in the areas of G06T7/70 (10 applications), G06V20/52 (6 applications), G06Q10/087 (6 applications), G06V10/75 (4 applications), H04W76/27 (4 applications)
With keywords such as: unit, information, data, apparatus, means, based, image, determination, display, acquisition in their patent application abstracts.
Ford Global Technologies, LLC: 35 patent applications
Ford Global Technologies, LLC has filed patents in the areas of G06N5/04 (8 applications), B60K1/04 (4 applications), B60R22/14 (4 applications), B60R21/16 (4 applications), B60L15/20 (4 applications)
With keywords such as: vehicle, data, based, assembly, processor, electric, instructions, memory, configured, airbag in their patent application abstracts.
Micron Technology, Inc.: 33 patent applications
Micron Technology, Inc. has filed patents in the areas of G06F3/06 (9 applications), G06F3/0679 (9 applications), H01L27/11582 (8 applications), H01L27/11556 (8 applications), G06F3/0659 (5 applications)
With keywords such as: memory, material, stack, device, data, die, comprises, tiers, least, cells in their patent application abstracts.
Intel Corporation: 30 patent applications
Intel Corporation has filed patents in the areas of G06N3/045 (6 applications), G06N3/08 (4 applications), G06T15/06 (4 applications), G06N3/063 (4 applications), G06N3/04 (4 applications)
With keywords such as: device, network, interface, interconnect, based, data, bvh, apparatus, circuitry, endpoint in their patent application abstracts.
Top Collaborations between organizations/companies
Hyundai Motor Company and Kia Corporation: 39 patent applications.
DENSO CORPORATION and TOYOTA JIDOSHA KABUSHIKI KAISHA: 5 patent applications.
AutoNetworks Technologies, Ltd. and SUMITOMO WIRING SYSTEMS, LTD.: 4 patent applications.
Centre of Excellence in Wireless Technology and Indian Institute of Technology Madras: 4 patent applications.
AutoNetworks Technologies, Ltd. and Sumitomo Electric Industries, Ltd.: 4 patent applications.
SUMITOMO WIRING SYSTEMS, LTD. and Sumitomo Electric Industries, Ltd.: 4 patent applications.
MASSACHUSETTS INSTITUTE OF TECHNOLOGY and The Broad Institute, Inc.: 3 patent applications.
Kabushiki Kaisha Toshiba and TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION: 3 patent applications.
Gigaphoton Inc. and Inter-University Research Institute Corporation, National Institutes of Natural Sciences: 3 patent applications.
General Electric Company and General Electric Deutschland Holding GmbH: 3 patent applications.
BOE Technology Group Co., Ltd. and Hefei Xinsheng Optoelectronics Technology Co., Ltd.: 3 patent applications.
GD MIDEA AIR-CONDITIONING EQUIPMENT CO., LTD. and MIDEA GROUP CO., LTD.: 3 patent applications.
Disney Enterprises, Inc. and ETH Zürich (Eidgenössische Technische Hochschule Zürich): 3 patent applications.
DENSO CORPORATION and MIRISE Technologies Corporation: 3 patent applications.
Japan Display Inc. and OSAKA UNIVERSITY: 2 patent applications.
GUANGDONG BRUNP RECYCLING TECHNOLOGY CO., LTD. and HUNAN BRUNP EV RECYCLING CO., LTD.: 2 patent applications.
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. and TSMC CHINA COMPANY, LIMITED: 2 patent applications.
NANHUAN YANCHENG ENVIRONMENTAL PROTECTION TECHNOLOGY CO., LTD. and NANJING UNIVERSITY & YANCHENG ACADEMY OF ENVIRONMENTAL PROTECTION TECHNOLOGY AND ENGINEERING: 2 patent applications.
NANHUAN YANCHENG ENVIRONMENTAL PROTECTION TECHNOLOGY CO., LTD. and NANJING UNIVERSITY: 2 patent applications.
NANJING UNIVERSITY and NANJING UNIVERSITY & YANCHENG ACADEMY OF ENVIRONMENTAL PROTECTION TECHNOLOGY AND ENGINEERING: 2 patent applications.
Top 20 technology areas in patent applications
By International Patent Classification (IPC) Codes
H01L29/66: 113
Represented by applications from: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (12), UNITED MICROELECTRONICS CORP. (2), STMicroelectronics (Rousset) SAS (1), Samsung Electronics Co.,Ltd. (1)
H01L23/00: 104
Represented by applications from: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (6), Samsung Electronics Co.,Ltd. (3), The Boeing Company (2), MIRISE Technologies Corporation (1), Skyworks Solutions, Inc. (1), Intel Corporation (1), TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED (1), Tokyo Electron Limited (1), ROHM CO., LTD. (1), SONY SEMICONDUCTOR SOLUTIONS CORPORATION (1)
A61B5/00: 89
Represented by applications from: Stryker Corporation (1), InBodyFit+ Co., Ltd. (1), Bonutti Research, Inc. (1), SONY GROUP CORPORATION (1), EDWARDS LIFESCIENCES CORPORATION (1), THE JOHNS HOPKINS UNIVERSITY (1), TOYOBO CO., LTD. (1), KONINKLIJKE PHILIPS N.V. (1), Masimo Corporation (1), IpVenture, Inc. (1)
H04L9/40: 86
Represented by applications from: Cisco Technology, Inc. (4), Bank of America Corporation (3), Microsoft Technology Licensing, LLC (2), Oracle International Corporation (1), NEC Corporation (1), Paubox, Inc. (1), Wiz, Inc. (1), NTT Security (Japan) KK (1), Battelle Energy Alliance, LLC (1), HUMAN SECURITY, INC. (1)
G06N20/00: 86
Represented by applications from: International Business Machines Corporation (3), Salesforce, Inc. (2), FUJITSU LIMITED (2), Microsoft Technology Licensing, LLC (2), Mezo Inc. (1), GOOGLE LLC (1), Hewlett Packard Enterprise Development LP (1), University of Southern California (1), OneTrust LLC (1), QUALCOMM Incorporated (1)
A61P35/00: 77
Represented by applications from: The Board of Trustees of the Leland Stanford Junior University (1), Universite Paul Sabatier Toulouse III (1), NANJING KANGFUSHUN PHARMACEUTICAL CO., LTD. (1), ARRAY BIOPHARMA INC. (1)
H01L29/78: 73
Represented by applications from: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (8), ROHM CO., LTD. (2), TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED (2), Monolithic 3D Inc. (1), Kabushiki Kaisha Toshiba (1), GREE ELECTRIC APPLIANCES, INC.OF ZHUHAI (1), Mitsubishi Electric Corporation (1), Nexgen Power Systems, Inc. (1), TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (1), Samsung Electronics Co.,Ltd. (1)
H01L29/06: 71
Represented by applications from: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (7), International Business Machines Corporation (2), Samsung Electronics Co.,Ltd. (2), PANJIT INTERNATIONAL INC. (1), Taiwan Semiconductor Manufactoring Company, Ltd. (1), TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (1), Murata Manufacturing Co., Ltd. (1)
H04L5/00: 70
Represented by applications from: Indian Institute of Technology Madras (4), QUALCOMM Incorporated (4), Telefonaktiebolaget LM Ericsson (publ) (3), LG Electronics Inc. (2), BLACKPIN INC. (2), Huawei Technologies Co., Ltd. (2), Samsung Electronics Co.,Ltd. (2), TELEFONAKTIEBOLAGET LM ERICSSON(PUBL) (1), Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. (1), Sharp Kabushiki Kaisha (1)
G06T7/00: 67
Represented by applications from: CANON KABUSHIKI KAISHA (2), Smith & Nephew Asia Pacific Pte. Limited (1), SONY GROUP CORPORATION (1), PANAKEIA TECHNOLOGIES LIMITED (1), HistoWiz, Inc. (1), OneProjects Design and Innovation Ltd. (1), OXFORD UNIVERSITY INNOVATION LIMITED (1), FUJIFILM Corporation (1), BEIJING ZHENHEALTH TECHNOLOGY CO., LTD. (1), Carl Zeiss Meditec AG (1)
Top 20 inventors in patent applications
Zehua SHAO of Chengdu (CN): 10 patent applications for CHENGDU QINCHUAN IOT TECHNOLOGY CO., LTD.
Tao LUO of San Diego CA (US): 10 patent applications for QUALCOMM Incorporated
Frederick E. Shelton, IV of Hillsboro OH (US): 10 patent applications for CILAG GMBH INTERNATIONAL
Kyung Youn KIM of Gyeonggi-do (KR): 7 patent applications for Ecovance Co. Ltd.
Hoon KIM of Gyeonggi-do (KR): 7 patent applications for Ecovance Co. Ltd.
Seong Dong KIM of Gyeonggi-do (KR): 7 patent applications for Ecovance Co. Ltd.
David Phillip Taitz of Los Angeles CA (US): 6 patent applications for Snap Inc.
Thomas Szigeti of Vancouver (CA): 6 patent applications for Cisco Technology, Inc.
Jun Su BYEON of Gyeonggi-do (KR): 6 patent applications for Ecovance Co. Ltd.
Kevin M. Fiebig of Cincinnati OH (US): 6 patent applications for CILAG GMBH INTERNATIONAL
Haitang XIANG of Chengdu (CN): 6 patent applications for CHENGDU QINCHUAN IOT TECHNOLOGY CO., LTD.
Julius SCHULZ of Muenchen (DE): 5 patent applications for Bayerische Motoren Werke Aktiengesellschaft
Jeffrey SMITH of Clifton Park NY (US): 5 patent applications for Tokyo Electron Limited
Dean M. Jaradi of Macomb MI (US): 5 patent applications for Ford Global Technologies, LLC
Shahaji B. More of Hsinchu (TW): 5 patent applications for TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Yong LI of Chengdu (CN): 5 patent applications for CHENGDU QINCHUAN IOT TECHNOLOGY CO., LTD.
Mohammad Omar Faruque of Ann Arbor MI (US): 5 patent applications for Ford Global Technologies, LLC
Yee-Chia Yeo of Hsinchu (TW): 5 patent applications for TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Chen-Hua Yu of Hsinchu (TW): 5 patent applications for TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
S.M. Iskander Farooq of Novi MI (US): 5 patent applications for Ford Global Technologies, LLC
Top Patent Applications from University/College/Institutions
The Regents of the University of California: 20 patent applications.
A61K45/06 (6 applications), C12N15/113 (4 applications), A61K31/337 (4 applications), A61K35/17 (4 applications), C12N2310/14 (2 applications)
MASSACHUSETTS INSTITUTE OF TECHNOLOGY: 13 patent applications.
C12N9/22 (6 applications), C12N15/63 (4 applications), C12N15/90 (3 applications), C12N15/907 (3 applications), C12N15/102 (2 applications)
THE JOHNS HOPKINS UNIVERSITY: 12 patent applications.
C12N15/86 (4 applications), C12Q1/6883 (4 applications), A61B5/0205 (2 applications), A61P35/00 (2 applications), H01M50/121 (2 applications)
ARIZONA BOARD OF REGENTS ON BEHALF OF ARIZONA STATE UNIVERSITY: 8 patent applications.
A23L31/00 (2 applications), G16H50/20 (2 applications), G06T7/60 (2 applications), G01N33/58 (2 applications), G01N33/537 (2 applications)
Board of Regents, The University of Texas System: 7 patent applications.
A61K39/215 (2 applications), C01F7/786 (2 applications), C08L67/04 (2 applications), A61P25/04 (2 applications), A61P25/02 (2 applications)
ZHEJIANG UNIVERSITY: 7 patent applications.
F04B17/03 (2 applications), F04C9/00 (2 applications), H02K7/14 (2 applications), H02K1/2786 (2 applications), F04F1/18 (2 applications)
The Board of Trustees of the Leland Stanford Junior University: 6 patent applications.
C12N15/86 (2 applications), A61K47/32 (2 applications), F28F9/22 (2 applications), G06N10/40 (2 applications), G06F30/10 (2 applications)
NATIONAL TSING HUA UNIVERSITY: 6 patent applications.
G01P3/02 (2 applications), H01J37/244 (2 applications), G01P15/14 (2 applications), G01P15/18 (2 applications), H01P1/20 (2 applications)
The Trustees of Columbia University in the City of New York: 5 patent applications.
A61K45/06 (2 applications), G10L21/0232 (2 applications), G10L21/028 (2 applications), G06Q20/02 (2 applications), G06F3/01 (2 applications)
UNIVERSITY OF MASSACHUSETTS: 5 patent applications.
C12N9/22 (4 applications), C12N15/113 (3 applications), G06F40/40 (2 applications), A61K35/761 (2 applications), C07K14/005 (2 applications)
The University of North Carolina at Chapel Hill: 4 patent applications.
C12N15/86 (4 applications), A61F5/58 (2 applications), G09B19/04 (2 applications), G01N23/046 (2 applications), A61P21/00 (2 applications)
Duke University: 4 patent applications.
A61P25/28 (2 applications), G01N33/92 (2 applications), A61P25/24 (2 applications), A61M60/122 (2 applications), A61K45/06 (2 applications)
The Trustees of the University of Pennsylvania: 4 patent applications.
C07K14/605 (2 applications), H02N13/00 (2 applications), B33Y10/00 (2 applications), A61K45/06 (2 applications), C12N15/86 (2 applications)
Iowa State University Research Foundation, Inc.: 4 patent applications.
A61K39/145 (2 applications), C07C61/24 (2 applications), A61P31/16 (2 applications), B01D61/46 (2 applications), C07C51/353 (2 applications)
Indian Institute of Technology Madras: 4 patent applications.
H04W72/23 (8 applications), H04L5/00 (4 applications), H04L5/0048 (4 applications)
OSAKA UNIVERSITY: 4 patent applications.
C09K19/36 (2 applications), C09K19/54 (2 applications), A61P11/00 (2 applications), C12N7/02 (2 applications), C12N5/10 (2 applications)
Imam Abdulrahman Bin Faisal University: 4 patent applications.
A61K6/70 (2 applications), A61K33/243 (2 applications), C02F3/04 (2 applications), C02F3/30 (2 applications), C02F1/40 (2 applications)
Regents of the University of Minnesota: 3 patent applications.
C12N15/86 (4 applications), C11D3/386 (2 applications), C07K14/775 (2 applications), C07K14/435 (2 applications), C11D3/43 (2 applications)
Northwestern University: 3 patent applications.
H01L31/032 (2 applications), A61K47/62 (2 applications), A61P35/00 (2 applications), A61L15/54 (2 applications), A61L15/18 (2 applications)
President and Fellows of Harvard College: 3 patent applications.
A61K35/74 (2 applications), C12N9/22 (2 applications), A61K45/06 (2 applications), A61K39/245 (2 applications), C12N7/00 (2 applications)
- Tesla, Inc.
- Apple Inc.
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Samsung Electronics Co.,Ltd.
- APPLE INC.
- QUALCOMM Incorporated
- CANON KABUSHIKI KAISHA
- GOOGLE LLC
- TOYOTA JIDOSHA KABUSHIKI KAISHA
- SAMSUNG DISPLAY CO., LTD.
- Microsoft Technology Licensing, LLC
- Huawei Technologies Co., Ltd.
- Telefonaktiebolaget LM Ericsson (publ)
- LG Energy Solution, Ltd.
- Hyundai Motor Company
- Kia Corporation
- Mitsubishi Electric Corporation
- LG Electronics Inc.
- NEC Corporation
- Ford Global Technologies, LLC
- Micron Technology, Inc.
- Intel Corporation
- Zehua SHAO of Chengdu (CN)
- Tao LUO of San Diego CA (US)
- Frederick E. Shelton, IV of Hillsboro OH (US)
- Kyung Youn KIM of Gyeonggi-do (KR)
- Hoon KIM of Gyeonggi-do (KR)
- Seong Dong KIM of Gyeonggi-do (KR)
- David Phillip Taitz of Los Angeles CA (US)
- Thomas Szigeti of Vancouver (CA)
- Jun Su BYEON of Gyeonggi-do (KR)
- Kevin M. Fiebig of Cincinnati OH (US)
- Haitang XIANG of Chengdu (CN)
- Julius SCHULZ of Muenchen (DE)
- Jeffrey SMITH of Clifton Park NY (US)
- Dean M. Jaradi of Macomb MI (US)
- Shahaji B. More of Hsinchu (TW)
- Yong LI of Chengdu (CN)
- Mohammad Omar Faruque of Ann Arbor MI (US)
- Yee-Chia Yeo of Hsinchu (TW)
- Chen-Hua Yu of Hsinchu (TW)
- S.M. Iskander Farooq of Novi MI (US)
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