Patent Applications Report for 3rd Mar 2023

Patent Applications Report for 3rd Mar 2023

Organizations to watch

Tesla, Inc.: 2 patent applications

Tesla, Inc. has applied for patents in the areas of H01M10/0567 (2), H01M10/0525 (2), H01M10/0568 (2), B32B27/08 (2), B32B7/12 (2)

With keywords such as: difluorophosphate, glass, multilayer, stack, layer, lfo, include, described, additive, not in patent application abstracts.

Apple Inc.: 73 patent applications

Apple Inc. has applied for patents in the areas of H04W24/08 (8), G06F1/3206 (8), H04W24/10 (8), A61B5/00 (7), H04W12/06 (6)

With keywords such as: device, configured, circuit, memory, based, data, power, cache, wireless, user in patent application abstracts.

NVIDIA Corporation: 25 patent applications

NVIDIA Corporation has applied for patents in the areas of G06T15/06 (10), G06N3/08 (7), G06T15/10 (4), G06K9/62 (4), H04N19/176 (4)

With keywords such as: can, image, data, least, state, surface, embodiment, such, information, code in patent application abstracts.

Technologies to watch

Patent Applications for Photogrammetry

Number of patent applications containing 'Photogrammetry' or its variations: 2

20230064228. RECORDING MEDIUM, AND SYSTEM simplified abstract (Topcon Corporation)

Inventor(s): Satoshi WADA of Wako-shi, Saitama (JP) for Topcon Corporation, Atsushi SHINJO of Wako-shi, Saitama (JP) for Topcon Corporation, Takayo OGAWA of Wako-shi, Saitama (JP) for Topcon Corporation, Takeharu MURAKAMI of Wako-shi, Saitama (JP) for Topcon Corporation, Yasufumi FUKUMA of Wako-shi, Saitama (JP) for Topcon Corporation, Zaxing MAO of Itabashi-ku, Tokyo (JP) for Topcon Corporation, Satoshi YANOBE of Itabashi-ku, Tokyo (JP) for Topcon Corporation, Toshio YAMADA of Itabashi-ku, Tokyo (JP) for Topcon Corporation

IPC Code(s): G06F30/13, G01C11/02

20230069019. REALITY MODEL OBJECT RECOGNITION USING CROSS-SECTIONS simplified abstract (SKYYFISH LLC)

Inventor(s): Orest Jacob Pilskalns of Missoula MT (US) for SKYYFISH LLC

IPC Code(s): G06T7/50, G01B11/25

Top 20 organizations

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.: 352 patent applications

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. has filed patents in the areas of H01L29/66 (72 applications), H01L29/06 (57 applications), H01L21/768 (56 applications), H01L23/00 (54 applications), H01L29/423 (47 applications)

With keywords such as: layer, structure, semiconductor, substrate, conductive, device, dielectric, gate, disposed, portion in their patent application abstracts.

SAMSUNG ELECTRONICS CO., LTD.: 200 patent applications

SAMSUNG ELECTRONICS CO., LTD. has filed patents in the areas of H01L23/00 (15 applications), H01L23/498 (14 applications), H01L23/528 (13 applications), H01L27/11582 (12 applications), H01L23/49816 (12 applications)

With keywords such as: device, layer, based, configured, semiconductor, substrate, including, least, data, electronic in their patent application abstracts.

Micron Technology, Inc.: 160 patent applications

Micron Technology, Inc. has filed patents in the areas of G06F3/06 (60 applications), G06F3/0679 (44 applications), G06F3/0659 (36 applications), G06F3/0604 (35 applications), G11C16/26 (20 applications)

With keywords such as: memory, device, data, access, command, can, semiconductor, die, material, devices in their patent application abstracts.

International Business Machines Corporation: 136 patent applications

International Business Machines Corporation has filed patents in the areas of G06N20/00 (18 applications), G06N5/04 (11 applications), H01L29/78 (9 applications), G06N3/08 (9 applications), H01L29/66 (7 applications)

With keywords such as: data, based, computer, device, user, include, processor, memory, processing, input in their patent application abstracts.

QUALCOMM Incorporated: 117 patent applications

QUALCOMM Incorporated has filed patents in the areas of H04W72/04 (39 applications), H04L5/00 (33 applications), H04W24/10 (24 applications), H04W72/042 (15 applications), H04W24/08 (14 applications)

With keywords such as: wireless, communication, based, control, transmission, base, information, device, station, least in their patent application abstracts.

CANON KABUSHIKI KAISHA: 115 patent applications

CANON KABUSHIKI KAISHA has filed patents in the areas of G06F3/12 (15 applications), H04N1/00 (13 applications), G06T7/00 (7 applications), H04N19/119 (6 applications), H04W48/16 (6 applications)

With keywords such as: unit, image, information, apparatus, configured, processing, communication, data, portion, member in their patent application abstracts.

TOYOTA JIDOSHA KABUSHIKI KAISHA: 86 patent applications

TOYOTA JIDOSHA KABUSHIKI KAISHA has filed patents in the areas of B60W30/06 (10 applications), H02J7/00 (10 applications), B60W50/14 (10 applications), G02C7/04 (8 applications), B60K35/00 (8 applications)

With keywords such as: vehicle, power, device, control, configured, information, unit, when, battery, supply in their patent application abstracts.

Apple Inc.: 73 patent applications

Apple Inc. has filed patents in the areas of H04W24/08 (8 applications), G06F1/3206 (8 applications), H04W24/10 (8 applications), A61B5/00 (7 applications), H04W12/06 (6 applications)

With keywords such as: device, configured, circuit, memory, based, data, power, cache, wireless, user in their patent application abstracts.

Samsung Display Co., LTD.: 73 patent applications

Samsung Display Co., LTD. has filed patents in the areas of H01L27/32 (22 applications), H01L51/52 (17 applications), H01L51/56 (17 applications), H01L33/62 (16 applications), H01L33/38 (13 applications)

With keywords such as: layer, electrode, display, light, disposed, area, including, emitting, substrate, insulating in their patent application abstracts.

LG ELECTRONICS INC.: 69 patent applications

LG ELECTRONICS INC. has filed patents in the areas of H04N19/176 (14 applications), H04N19/132 (12 applications), H04N19/70 (10 applications), H04L5/00 (10 applications), H04W72/04 (10 applications)

With keywords such as: information, device, present, resource, wireless, body, according, disposed, configured, base in their patent application abstracts.

HUAWEI TECHNOLOGIES CO., LTD.: 67 patent applications

HUAWEI TECHNOLOGIES CO., LTD. has filed patents in the areas of H04L5/00 (8 applications), H04W72/04 (7 applications), H04N19/172 (6 applications), H04W48/16 (4 applications), H04L43/04 (4 applications)

With keywords such as: device, data, information, network, based, terminal, application, where, apparatus, this in their patent application abstracts.

Hyundai Motor Company: 65 patent applications

Hyundai Motor Company has filed patents in the areas of B62D25/04 (6 applications), H04L67/12 (6 applications), B60H1/00 (5 applications), B60K35/00 (4 applications), B60L58/12 (4 applications)

With keywords such as: vehicle, configured, unit, information, control, cell, based, fuel, connected, side in their patent application abstracts.

Kia Corporation: 64 patent applications

Kia Corporation has filed patents in the areas of H04L67/12 (6 applications), B62D25/04 (6 applications), B60H1/00 (5 applications), B60K35/00 (4 applications), H04W4/46 (4 applications)

With keywords such as: in their patent application abstracts.

FUJIFILM Business Innovation Corp.: 58 patent applications

FUJIFILM Business Innovation Corp. has filed patents in the areas of G03G15/16 (13 applications), G03G15/20 (12 applications), G03G15/00 (12 applications), G03G15/2028 (8 applications), G03G15/6529 (6 applications)

With keywords such as: image, member, medium, recording, portion, forming, unit, direction, transfer, apparatus in their patent application abstracts.

TEXAS INSTRUMENTS INCORPORATED: 51 patent applications

TEXAS INSTRUMENTS INCORPORATED has filed patents in the areas of H03F3/04 (4 applications), H01L23/00 (4 applications), H01L29/66 (4 applications), H02M3/158 (4 applications), H01L21/48 (4 applications)

With keywords such as: coupled, output, circuit, input, current, configured, device, layer, signal, semiconductor in their patent application abstracts.

SEIKO EPSON CORPORATION: 45 patent applications

SEIKO EPSON CORPORATION has filed patents in the areas of B29C64/209 (12 applications), B33Y30/00 (9 applications), B29C64/232 (8 applications), B29C64/393 (6 applications), H01R24/62 (6 applications)

With keywords such as: circuit, unit, configured, drive, heat, connector, surface, device, liquid, shaping in their patent application abstracts.

Intel Corporation: 44 patent applications

Intel Corporation has filed patents in the areas of G06N3/04 (9 applications), G06F9/30 (9 applications), G06T1/20 (8 applications), G06N3/063 (7 applications), G06N20/00 (6 applications)

With keywords such as: data, layer, memory, device, including, structure, substrate, source, element, semiconductor in their patent application abstracts.

Taiwan Semiconductor Manufacturing Company Limited: 43 patent applications

Taiwan Semiconductor Manufacturing Company Limited has filed patents in the areas of H01L25/065 (9 applications), H01L23/00 (8 applications), H01L23/522 (7 applications), H01G4/35 (6 applications), H01L25/0657 (6 applications)

With keywords such as: layer, structure, semiconductor, substrate, material, dielectric, memory, die, bonding, including in their patent application abstracts.

Robert Bosch GmbH: 42 patent applications

Robert Bosch GmbH has filed patents in the areas of B60W60/00 (5 applications), H04L67/12 (4 applications), H05K3/12 (4 applications), B60W50/04 (4 applications), H01M10/613 (4 applications)

With keywords such as: data, least, cooling, surface, stencil, image, input, device, into, paste in their patent application abstracts.

Panasonic Intellectual Property Management Co., Ltd.: 41 patent applications

Panasonic Intellectual Property Management Co., Ltd. has filed patents in the areas of H01M10/0525 (8 applications), H01M50/107 (6 applications), A01D46/30 (6 applications), H01M50/502 (4 applications), H01M10/0585 (4 applications)

With keywords such as: surface, unit, electrode, information, portion, body, least, part, layer, terminal in their patent application abstracts.

Top Collaborations between organizations/companies

Hyundai Motor Company and Kia Corporation: 64 patent applications.

BEIJING SUPERSTRING ACADEMY OF MEMORY TECHNOLOGY and CHANGXIN MEMORY TECHNOLOGIES, INC.: 13 patent applications.

Monsanto Technology LLC and Stine Seed Farm, Inc.: 9 patent applications.

BOE TECHNOLOGY GROUP CO., LTD. and Chengdu BOE Optoelectronics Technology Co., Ltd.: 9 patent applications.

Beijing Bytedance Network Technology Co., Ltd. and Bytedance Inc.: 8 patent applications.

KABUSHIKI KAISHA TOSHIBA and TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION: 7 patent applications.

DENSO CORPORATION and TOYOTA JIDOSHA KABUSHIKI KAISHA: 5 patent applications.

DENSO CORPORATION and MIRISE Technologies Corporation: 4 patent applications.

SHANGHAI JINKO GREEN ENERGY ENTERPRISE MANAGEMENT CO., LTD. and ZHEJIANG JINKO SOLAR CO., LTD.: 4 patent applications.

MIRISE Technologies Corporation and TOYOTA JIDOSHA KABUSHIKI KAISHA: 4 patent applications.

BASF SE and COLORADO STATE UNIVERSITY RESEARCH FOUNDATION: 3 patent applications.

Fujiwa Denki Co., Ltd. and SINTOKOGIO, LTD.: 3 patent applications.

DAIKIN INDUSTRIES, LTD. and MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC: 3 patent applications.

Smith & Nephew Asia Pacific Pte. Limited and Smith & Nephew Orthopaedics AG: 3 patent applications.

Smith & Nephew Orthopaedics AG and Smith & Nephew, Inc.: 3 patent applications.

Smith & Nephew Asia Pacific Pte. Limited and Smith & Nephew, Inc.: 3 patent applications.

Bayer Aktiengesellschaft and Bayer Pharma Aktiengesellschaft: 3 patent applications.

NATIONAL TAIWAN UNIVERSITY and TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.: 3 patent applications.

Hyundai Motor Company and SEGOS: 2 patent applications.

KAWASAKI JUKOGYO KABUSHIKI KAISHA and MEDICAROID CORPORATION: 2 patent applications.

Top 20 technology areas in patent applications

By International Patent Classification (IPC) Codes

H01L29/66: 156

Represented by applications from: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (15), INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES (2), International Business Machines Corporation (2), Brookhaven Science Associates, LLC (1), Hangzhou Silicon-Magic Semiconductor Technology Co., Ltd. (1), UNITED MICROELECTRONICS CORP. (1), NATIONAL TAIWAN UNIVERSITY (1), TEXAS INSTRUMENTS INCORPORATED (1), HON HAI PRECISION INDUSTRY CO., LTD. (1), Taiwan Semiconductor Manufacturing Company Limited (1)

H01L23/00: 151

Represented by applications from: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (22), YANGTZE MEMORY TECHNOLOGIES CO., LTD. (7), Micron Technology, Inc. (7), SAMSUNG ELECTRONICS CO., LTD. (4), KIOXIA CORPORATION (4), Taiwan Semiconductor Manufacturing Company Limited (4), Intel Corporation (2), NANYA TECHNOLOGY CORPORATION (2), TEXAS INSTRUMENTS INCORPORATED (2), NXP USA, Inc. (2)

G06N20/00: 139

Represented by applications from: International Business Machines Corporation (5), Capital One Services, LLC (4), Google LLC (2), SAMSUNG ELECTRONICS CO., LTD. (2), HUAWEI TECHNOLOGIES CO., LTD. (1), Cisco Technology, Inc. (1), Wistron Corporation (1), UVUE LIMITED (1), RIIID INC. (1), Microsoft Technology Licensing, LLC (1)

G06F3/06: 129

Represented by applications from: Micron Technology, Inc. (47), SK hynix Inc. (6), Western Digital Technologies, Inc. (6), SAMSUNG ELECTRONICS CO., LTD. (6), International Business Machines Corporation (4), FUJIFILM Corporation (3), KIOXIA CORPORATION (2), Winbond Electronics Corp. (2), Hitachi, Ltd. (2), Apple Inc. (2)

H04W72/04: 117

Represented by applications from: QUALCOMM Incorporated (13), HUAWEI TECHNOLOGIES CO., LTD. (3), LG ELECTRONICS INC. (3), SHARP KABUSHIKI KAISHA (2), Telefonaktiebolaget LM Ericsson (PUBL) (2), Lenovo (Singapore) Pte. Ltd. (2), DATANG MOBILE COMMUNICATIONS EQUIPMENT CO., LTD. (1), CANON KABUSHIKI KAISHA (1), IDAC Holdings, Inc. (1), Lenovo (Beijing) Limited (1)

G06K9/62: 107

Represented by applications from: Footprintku Inc. (2), TDK Corporation (2), UnitedHealth Group Incorporated (2), EMC IP Holding Company LLC (2), KWAI INC. (1), HUAWEI TECHNOLOGIES CO., LTD. (1), NVIDIA CORPORATION (1), Royal Bank of Canada (1), Rivian IP Holdings, LLC (1), Medidata Solutions, Inc. (1)

A61B5/00: 105

Represented by applications from: Apple Inc. (3), Covidien LP (2), The Johns Hopkins University (1), Konica Minolta, Inc. (1), Bilibaby, LLC (1), Bruin Biometrics, LLC (1), Sanofi (1), NIHON KOHDEN CORPORATION (1), BioLink Systems, LLC (1), Pacesetter, Inc. (1)

H04L5/00: 103

Represented by applications from: QUALCOMM Incorporated (13), Telefonaktiebolaget LM Ericsson (PUBL) (3), HUAWEI TECHNOLOGIES CO., LTD. (3), LG ELECTRONICS INC. (3), ZTE CORPORATION (3), VIVO MOBILE COMMUNICATION CO., LTD. (2), DATANG MOBILE COMMUNICATIONS EQUIPMENT CO., LTD. (1), Senscomm Semiconductor Co., Ltd. (1), Apple Inc. (1), SAMSUNG ELECTRONICS CO., LTD. (1)

H01L21/768: 101

Represented by applications from: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (18), Applied Materials, Inc. (2), TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (2), YANGTZE MEMORY TECHNOLOGIES CO., LTD. (2), CANON KABUSHIKI KAISHA (1), BEIJING SUPERSTRING ACADEMY OF MEMORY TECHNOLOGY (1), CHANGXIN MEMORY TECHNOLOGIES, INC. (1), Intel Corporation (1), NANYA TECHNOLOGY CORPORATION (1), Micron Technology, Inc. (1)

H01L29/06: 98

Represented by applications from: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (10), International Business Machines Corporation (3), SAMSUNG ELECTRONICS CO., LTD. (2), TEXAS INSTRUMENTS INCORPORATED (1), Hyundai Motor Company (1), DB HiTek Co., Ltd. (1), Search For The Next, LTD (1), YANGTZE MEMORY TECHNOLOGIES CO., LTD. (1), INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES (1), IceMos Technology Limited (1)

Top 20 inventors in patent applications

Tao LUO of San Diego CA (US): 23 patent applications for QUALCOMM Incorporated

Ruilong Xie of Niskayuna NY (US): 14 patent applications for International Business Machines Corporation

Fangfang Zhu of San Jose CA (US): 14 patent applications for Micron Technology, Inc.

Jiangli Zhu of San Jose CA (US): 12 patent applications for Micron Technology, Inc.

Judson R. Holt of Ballston Lake NY (US): 12 patent applications for GlobalFoundries U.S. Inc.

Shih-Yao Lin of New Taipei City (TW): 11 patent applications for TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Xiaoxia ZHANG of San Diego CA (US): 11 patent applications for QUALCOMM Incorporated

Sarbajit K. Rakshit of Kolkata (IN): 11 patent applications for International Business Machines Corporation

Jagar Singh of Clifton Park NY (US): 10 patent applications for GlobalFoundries U.S. Inc.

Shau-Lin SHUE of Hsinchu (TW): 10 patent applications for TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Junyi LI of Fairless Hills PA (US): 9 patent applications for QUALCOMM Incorporated

Wanshi CHEN of San Diego CA (US): 9 patent applications for QUALCOMM Incorporated

Wei Liu of Wuhan (CN): 9 patent applications for YANGTZE MEMORY TECHNOLOGIES CO., LTD.

Yan ZHOU of San Diego CA (US): 9 patent applications for QUALCOMM Incorporated

Zehua SHAO of Chengdu (CN): 9 patent applications for CHENGDU QINCHUAN IOT TECHNOLOGY CO., LTD.

William H. Eby of Panora IA (US): 9 patent applications for Monsanto Technology LLC

Shin-Puu Jeng of Hsinchu (TW): 9 patent applications for TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Lan Yao of Wuhan (CN): 8 patent applications for YANGTZE MEMORY TECHNOLOGIES CO., LTD.

Takuto KITA of Kariya-city (JP): 8 patent applications for DENSO CORPORATION

Chin-Hua WANG of New Taipei City (TW): 8 patent applications for TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Top Patent Applications from University/College/Institutions

THE REGENTS OF THE UNIVERSITY OF CALIFORNIA: 12 patent applications.

A61P35/00 (4 applications), A61K45/06 (2 applications), C09D7/43 (2 applications), A61K31/517 (2 applications), A61K31/444 (2 applications)

THE BOARD OF TRUSTEES OF THE LELAND STANFORD JUNIOR UNIVERSITY: 9 patent applications.

A61P35/00 (5 applications), C08L9/00 (2 applications), A61K31/12 (2 applications), C12P21/02 (2 applications), A61K2039/505 (2 applications)

City University of Hong Kong: 8 patent applications.

F25B15/02 (2 applications), B03C3/41 (2 applications), D21H25/02 (2 applications), B03C3/155 (2 applications), B03C3/32 (2 applications)

BOARD OF REGENTS, THE UNIVERSITY OF TEXAS SYSTEM: 7 patent applications.

C12N7/00 (4 applications), C08B16/00 (2 applications), A61K39/39 (2 applications), A61L15/28 (2 applications), D21H27/00 (2 applications)

The Regents of the University of Michigan: 6 patent applications.

A61P43/00 (2 applications), A61K31/19 (2 applications), C07K16/18 (2 applications), G01N33/86 (2 applications), H04B10/116 (2 applications)

COLORADO STATE UNIVERSITY RESEARCH FOUNDATION: 5 patent applications.

A01N57/20 (6 applications), A01P13/02 (4 applications), F23Q7/04 (2 applications), A01N25/04 (2 applications), A01N43/84 (2 applications)

Imam Abdulrahman Bin Faisal University: 5 patent applications.

A61K36/71 (2 applications), A61K49/08 (2 applications), A61P9/00 (2 applications), A61K45/06 (2 applications), H01G11/56 (2 applications)

KING FAHD UNIVERSITY OF PETROLEUM AND MINERALS: 4 patent applications.

C25B1/04 (4 applications), C09D183/08 (2 applications), C25B11/00 (2 applications), C25B1/55 (2 applications), E21B43/26 (2 applications)

ZHEJIANG UNIVERSITY: 4 patent applications.

A23K40/30 (2 applications), G01S7/03 (2 applications), A23K20/147 (2 applications), A23K20/158 (2 applications), A23K20/163 (2 applications)

Tianjin University: 4 patent applications.

C07D407/06 (2 applications), C10L5/40 (2 applications), C12N9/86 (2 applications), C12N9/80 (2 applications), C12N9/14 (2 applications)

Kyoto University: 4 patent applications.

G01R33/3415 (2 applications), C12N9/22 (2 applications), C07H1/00 (2 applications), C07H3/10 (2 applications), G01R33/385 (2 applications)

National Yang Ming Chiao Tung University: 4 patent applications.

H03B5/32 (2 applications), H01L41/29 (2 applications), G11C11/419 (2 applications), G11C11/418 (2 applications), G11C11/412 (2 applications)

Industry Academy Cooperation Foundation of Sejong University: 4 patent applications.

H04N19/176 (4 applications), H04L67/12 (4 applications), H04L67/60 (2 applications), H04L65/1073 (2 applications), H04L65/1069 (2 applications)

Rutgers, The State University of New Jersey: 4 patent applications.

A61K38/22 (2 applications), A61P15/08 (2 applications), A01N63/22 (2 applications), A01N63/25 (2 applications), A01N65/36 (2 applications)

REGENTS OF THE UNIVERSITY OF MINNESOTA: 4 patent applications.

A61N7/00 (2 applications), C12N1/20 (2 applications), H04W24/08 (2 applications), H04W24/02 (2 applications), C07K14/245 (2 applications)

RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY: 4 patent applications.

C08J3/075 (2 applications), H01L27/11519 (2 applications), C08K3/22 (2 applications), H01L29/86 (2 applications), C08K3/26 (2 applications)

The Johns Hopkins University: 4 patent applications.

C08F130/06 (2 applications), G01R33/34 (2 applications), C08F212/32 (2 applications), C08F212/10 (2 applications), C12N7/00 (2 applications)

SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION: 4 patent applications.

G11C15/04 (2 applications), A61F7/12 (2 applications), H01F7/122 (2 applications), G06F3/045 (2 applications), H02N1/04 (2 applications)

Vanderbilt University: 3 patent applications.

C07K16/10 (4 applications), A61P31/14 (4 applications), G01N33/569 (2 applications), G01N33/56983 (2 applications), A61K31/137 (2 applications)

Asia University: 3 patent applications.

A63B22/06 (3 applications), A63B22/0605 (3 applications), A61M21/00 (2 applications), A61M2021/0027 (2 applications), A61M21/02 (2 applications)