Intel corporation (20250006623). FORMING POROUS DIELECTRIC STRUCTURES WITH SPATIALLY-CONTROLLED POROSITY: Difference between revisions
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==Inventor(s)== | ==Inventor(s)== | ||
[[:Category:Shuqi Lai of Phoenix AZ | [[:Category:Shuqi Lai of Phoenix AZ US|Shuqi Lai of Phoenix AZ US]][[Category:Shuqi Lai of Phoenix AZ US]] | ||
[[:Category:Jieying Kong of Chandler AZ | [[:Category:Jieying Kong of Chandler AZ US|Jieying Kong of Chandler AZ US]][[Category:Jieying Kong of Chandler AZ US]] | ||
[[:Category:Dilan Seneviratne of Phoenix AZ | [[:Category:Dilan Seneviratne of Phoenix AZ US|Dilan Seneviratne of Phoenix AZ US]][[Category:Dilan Seneviratne of Phoenix AZ US]] | ||
[[:Category:Whitney Bryks of Tempe AZ | [[:Category:Whitney Bryks of Tempe AZ US|Whitney Bryks of Tempe AZ US]][[Category:Whitney Bryks of Tempe AZ US]] | ||
==FORMING POROUS DIELECTRIC STRUCTURES WITH SPATIALLY-CONTROLLED POROSITY== | ==FORMING POROUS DIELECTRIC STRUCTURES WITH SPATIALLY-CONTROLLED POROSITY== | ||
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This abstract first appeared for US patent application 20250006623 titled 'FORMING POROUS DIELECTRIC STRUCTURES WITH SPATIALLY-CONTROLLED POROSITY | This abstract first appeared for US patent application 20250006623 titled 'FORMING POROUS DIELECTRIC STRUCTURES WITH SPATIALLY-CONTROLLED POROSITY | ||
==Original Abstract Submitted== | ==Original Abstract Submitted== | ||
Latest revision as of 02:40, 25 March 2025
FORMING POROUS DIELECTRIC STRUCTURES WITH SPATIALLY-CONTROLLED POROSITY
Organization Name
Inventor(s)
Jieying Kong of Chandler AZ US
Dilan Seneviratne of Phoenix AZ US
FORMING POROUS DIELECTRIC STRUCTURES WITH SPATIALLY-CONTROLLED POROSITY
This abstract first appeared for US patent application 20250006623 titled 'FORMING POROUS DIELECTRIC STRUCTURES WITH SPATIALLY-CONTROLLED POROSITY
Original Abstract Submitted
microelectronic integrated circuit package structures include one or more integrated circuit (ic) package metallization levels comprising metallization features. a dielectric material is adjacent to one or more of the metallization features, where the dielectric material comprises a matrix material and a surfactant. a plurality of substantially spherical pores are within the matrix material, where the substantially spherical pores are surrounded by an outer shell comprising the matrix material.
