Applied materials, inc. (20250069921). IN-SITU SEMICONDUCTOR PROCESSING CHAMBER TEMPERATURE APPARATUS: Difference between revisions
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==Inventor(s)== | |||
[[:Category:Andrew Nguyen of San Jose CA (US)|Andrew Nguyen of San Jose CA (US)]][[Category:Andrew Nguyen of San Jose CA (US)]] | |||
[[:Category:Yogananda Sarode of Bangalore (IN)|Yogananda Sarode of Bangalore (IN)]][[Category:Yogananda Sarode of Bangalore (IN)]] | |||
[[:Category:Xue Chang of San Jose CA (US)|Xue Chang of San Jose CA (US)]][[Category:Xue Chang of San Jose CA (US)]] | |||
[[:Category:Kartik Ramaswamy of San Jose CA (US)|Kartik Ramaswamy of San Jose CA (US)]][[Category:Kartik Ramaswamy of San Jose CA (US)]] | |||
==IN-SITU SEMICONDUCTOR PROCESSING CHAMBER TEMPERATURE APPARATUS== | |||
This abstract first appeared for US patent application 20250069921 titled 'IN-SITU SEMICONDUCTOR PROCESSING CHAMBER TEMPERATURE APPARATUS | |||
==Original Abstract Submitted== | |||
methods and systems for in-situ temperature control are provided. the system includes a temperature-sensing dis. the temperature-sensing disc has a body, a front surface and a back surface opposing the front surface. one or more cameras are positioned on the front surface, the back surface, or both the front surface and the back surface. the one or more cameras are configured for performing infrared-based imaging of a surface of a processing chamber. | |||
[[Category:H01L21/67]] | |||
[[Category:C23C16/455]] | |||
[[Category:H01J37/32]] | |||
[[Category:H10N10/13]] | |||
[[Category:CPC_H01L21/67248]] | |||
Latest revision as of 08:36, 17 March 2025
IN-SITU SEMICONDUCTOR PROCESSING CHAMBER TEMPERATURE APPARATUS
Organization Name
Inventor(s)
Andrew Nguyen of San Jose CA (US)
Yogananda Sarode of Bangalore (IN)
Kartik Ramaswamy of San Jose CA (US)
IN-SITU SEMICONDUCTOR PROCESSING CHAMBER TEMPERATURE APPARATUS
This abstract first appeared for US patent application 20250069921 titled 'IN-SITU SEMICONDUCTOR PROCESSING CHAMBER TEMPERATURE APPARATUS
Original Abstract Submitted
methods and systems for in-situ temperature control are provided. the system includes a temperature-sensing dis. the temperature-sensing disc has a body, a front surface and a back surface opposing the front surface. one or more cameras are positioned on the front surface, the back surface, or both the front surface and the back surface. the one or more cameras are configured for performing infrared-based imaging of a surface of a processing chamber.
