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Category:Kristof Darmawikarta of Chandler AZ (US)
Pages in category "Kristof Darmawikarta of Chandler AZ (US)"
The following 82 pages are in this category, out of 82 total.
1
- 17837732. TECHNOLOGIES FOR THIN FILM RESISTORS IN VIAS simplified abstract (Intel Corporation)
- 17848624. SILICON NITRIDE LAYER UNDER A COPPER PAD simplified abstract (Intel Corporation)
- 17943915. COPPER CLAD LAMINATE (CCL) FOR PLATING PADS WITHIN A GLASS CAVITY FOR GLASS CORE APPLICATIONS simplified abstract (Intel Corporation)
- 17949857. IC PACKAGE WITH LEDS simplified abstract (Intel Corporation)
- 17955689. LAYERED GLASS ASSEMBLY WITH PRE-PATTERNED ELECTRICALLY CONDUCTIVE INTERCONNECTS simplified abstract (Intel Corporation)
- 17956338. EMBEDDED PASSIVES WITH CAVITY SIDEWALL INTERCONNECT IN GLASS CORE ARCHITECTURE simplified abstract (Intel Corporation)
- 17956384. HYBRID BONDED PASSIVE INTEGRATED DEVICES ON GLASS CORE simplified abstract (Intel Corporation)
- 17956421. DUAL SIDED EMBEDDED PASSIVES VIA PANEL LEVEL THERMAL COMPRESSION BONDING simplified abstract (Intel Corporation)
- 17957094. GLASS RECIRCULATOR FOR OPTICAL SIGNAL REROUTING ACROSS PHOTONIC INTEGRATED CIRCUITS simplified abstract (Intel Corporation)
- 17957341. DIRECTLY COUPLED OPTICAL INTERPOSER simplified abstract (Intel Corporation)
- 17957349. SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES simplified abstract (Intel Corporation)
- 17958002. MICROELECTRONICS PACKAGES WITH PHOTO-INTEGRATED GLASS INTERPOSER simplified abstract (Intel Corporation)
- 17958012. AIR GAP ARCHITECTURE FOR HIGH SPEED I/O SUBSTRATE TRACES simplified abstract (Intel Corporation)
- 18065250. APPARATUS AND METHOD FOR ELECTROLESS SURFACE FINISHING ON GLASS simplified abstract (Intel Corporation)
- 18071246. INTEGRATED OPTICAL PHASE CHANGE MATERIALS FOR RECONFIGURABLE OPTICS IN GLASS CORES simplified abstract (Intel Corporation)
- 18089471. THIN FILM CAPACITOR (TFC) ARCHITECTURES FOR PACKAGE SUBSTRATES simplified abstract (Intel Corporation)
- 18089476. THIN FILM CAPACITORS (TFCS) IN ETCHED BACK DEEP VIA simplified abstract (Intel Corporation)
- 18089483. TSV-TYPE EMBEDDED MULTI-DIE INTERCONNECT BRIDGE ENABLING WITH THERMAL COMPRESSION NON-CONDUCTIVE FILM (TC-NCF) PROCESS simplified abstract (Intel Corporation)
- 18089491. LIQUID METAL WELLS FOR INTERCONNECT ARCHITECTURES simplified abstract (Intel Corporation)
- 18089916. OPTICAL SEMICONDUCTOR PACKAGE AND METHOD simplified abstract (Intel Corporation)
- 18090305. PACKAGE SUBSTRATE EMBEDDED MULTI-LAYERED IN VIA CAPACITORS simplified abstract (Intel Corporation)
- 18090707. DIE ATTACH IN GLASS CORE PACKAGE THROUGH ORGANIC-TO-ORGANIC BONDING simplified abstract (Intel Corporation)
- 18091028. ULTRATHIN LAMINATED GLASS AND GLASS STIFFENERS FOR CORELESS PACKAGES simplified abstract (Intel Corporation)
- 18091150. ZERO MISALIGNED PAD AND VIA METALLIZATION STRUCTURES IN GLASS PACKAGE SUBSTRATES simplified abstract (Intel Corporation)
- 18091548. GLASS SUBSTRATE FABRICATION USING HYBRID BONDING simplified abstract (Intel Corporation)
- 18091555. APPARATUS AND METHOD FOR ATTACHING AN OPTICAL COMPONENT USING HYBRID BONDING simplified abstract (Intel Corporation)
- 18091616. TECHNOLOGIES FOR PACKAGE SUBSTRATES WITH ASYMMETRIC PLATING simplified abstract (Intel Corporation)
- 18120172. HIGH DENSITY PACKAGING ELECTROMIGRATION PROTECTION LAYER simplified abstract (Intel Corporation)
- 18130582. AIR-GAP TRACES AND AIR-GAP EMBEDDED BRIDGE INTEGRATED IN GLASS INTERPOSER simplified abstract (Intel Corporation)
- 18130584. EMBEDDED INTERCONNECT BRIDGE WITH INDUCTOR FOR POWER DELIVERY simplified abstract (Intel Corporation)
- 18133353. OPTICAL FIBER MOUNTS FOR PRINTED CIRCUIT BOARDS AND INTEGRATED CIRCUIT DEVICE PACKAGES simplified abstract (Intel Corporation)
- 18147503. SUBSTRATE PACKAGE-INTEGRATED OXIDE CAPACITORS AND RELATED METHODS simplified abstract (Intel Corporation)
- 18211455. SUBSTRATE PROCESS FLOW FOR ENABLING SUBSTRATE TO DIE HYBRID BONDING (Intel Corporation)
- 18216521. HYBRID METALLIZATION SURFACES FOR INTEGRATED CIRCUIT PACKAGES (Intel Corporation)
- 18344695. CARBON NANOFIBER CAPACITOR APPARATUS AND RELATED METHODS (Intel Corporation)
- 18367285. INORGANIC-BASED EMBEDDED-DIE LAYERS FOR MODULAR SEMICONDUCTIVE DEVICES simplified abstract (Intel Corporation)
- 18434347. LITHOGRAPHIC CAVITY FORMATION TO ENABLE EMIB BUMP PITCH SCALING simplified abstract (Intel Corporation)
- 18511641. PATCH ACCOMMODATING EMBEDDED DIES HAVING DIFFERENT THICKNESSES simplified abstract (Intel Corporation)
- 18513015. PATTERNABLE DIE ATTACH MATERIALS AND PROCESSES FOR PATTERNING simplified abstract (Intel Corporation)
- 18622511. LITHOGRAPHIC CAVITY FORMATION TO ENABLE EMIB BUMP PITCH SCALING simplified abstract (Intel Corporation)
I
- Intel corporation (20240105575). ELECTROLYTIC SURFACE FINISH ARCHITECTURE simplified abstract
- Intel corporation (20240105580). SURFACE FINISH WITH METAL DOME simplified abstract
- Intel corporation (20240105621). DIE INTERCONNECT SUBSTRATE, AN ELECTRICAL DEVICE AND A METHOD FOR FORMING A DIE INTERCONNECT SUBSTRATE simplified abstract
- Intel corporation (20240105625). OPEN CAVITY INTERCONNECTS FOR MIB CONNECTIONS simplified abstract
- Intel corporation (20240111090). DIRECTLY COUPLED OPTICAL INTERPOSER simplified abstract
- Intel corporation (20240111093). GLASS RECIRCULATOR FOR OPTICAL SIGNAL REROUTING ACROSS PHOTONIC INTEGRATED CIRCUITS simplified abstract
- Intel corporation (20240112972). MICROELECTRONICS PACKAGES WITH PHOTO-INTEGRATED GLASS INTERPOSER simplified abstract
- Intel corporation (20240112999). LAYERED GLASS ASSEMBLY WITH PRE-PATTERNED ELECTRICALLY CONDUCTIVE INTERCONNECTS simplified abstract
- Intel corporation (20240113000). DUAL SIDED EMBEDDED PASSIVES VIA PANEL LEVEL THERMAL COMPRESSION BONDING simplified abstract
- Intel corporation (20240113007). AIR GAP ARCHITECTURE FOR HIGH SPEED I/O SUBSTRATE TRACES simplified abstract
- Intel corporation (20240113072). SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES simplified abstract
- Intel corporation (20240114622). EMBEDDED PASSIVES WITH CAVITY SIDEWALL INTERCONNECT IN GLASS CORE ARCHITECTURE simplified abstract
- Intel corporation (20240114623). HYBRID BONDED PASSIVE INTEGRATED DEVICES ON GLASS CORE simplified abstract
- Intel corporation (20240176167). INTEGRATED OPTICAL PHASE CHANGE MATERIALS FOR RECONFIGURABLE OPTICS IN GLASS CORES simplified abstract
- Intel corporation (20240178145). LITHOGRAPHIC CAVITY FORMATION TO ENABLE EMIB BUMP PITCH SCALING simplified abstract
- Intel corporation (20240186227). INTEGRATED CIRCUIT PACKAGE ARCHITECTURES WITH CORE AND/OR BUILD-UP LAYERS COMPRISING SPIN-ON GLASS (SOG) simplified abstract
- Intel corporation (20240186228). INTEGRATED CIRCUIT PACKAGE ARCHITECTURES WITH CORE AND/OR BUILD-UP LAYERS COMPRISING SPIN-ON GLASS (SOG) simplified abstract
- Intel corporation (20240194548). APPARATUS AND METHOD FOR ELECTROLESS SURFACE FINISHING ON GLASS simplified abstract
- Intel corporation (20240213132). THIN FILM CAPACITORS (TFCS) IN ETCHED BACK DEEP VIA simplified abstract
- Intel corporation (20240213156). LIQUID METAL WELLS FOR INTERCONNECT ARCHITECTURES simplified abstract
- Intel corporation (20240213164). TSV-TYPE EMBEDDED MULTI-DIE INTERCONNECT BRIDGE ENABLING WITH THERMAL COMPRESSION NON-CONDUCTIVE FILM (TC-NCF) PROCESS simplified abstract
- Intel corporation (20240213301). THIN FILM CAPACITOR (TFC) ARCHITECTURES FOR PACKAGE SUBSTRATES simplified abstract
- Intel corporation (20240217216). ULTRATHIN LAMINATED GLASS AND GLASS STIFFENERS FOR CORELESS PACKAGES simplified abstract
- Intel corporation (20240219655). OPTICAL SEMICONDUCTOR PACKAGE AND METHOD simplified abstract
- Intel corporation (20240222018). SUBSTRATE PACKAGE-INTEGRATED OXIDE CAPACITORS AND RELATED METHODS simplified abstract
- Intel corporation (20240222035). PACKAGE SUBSTRATE EMBEDDED MULTI-LAYERED IN VIA CAPACITORS simplified abstract
- Intel corporation (20240222210). GLASS SUBSTRATE FABRICATION USING HYBRID BONDING simplified abstract
- Intel corporation (20240222243). APPARATUS AND METHOD FOR ATTACHING AN OPTICAL COMPONENT USING HYBRID BONDING simplified abstract
- Intel corporation (20240222282). ZERO MISALIGNED PAD AND VIA METALLIZATION STRUCTURES IN GLASS PACKAGE SUBSTRATES simplified abstract
- Intel corporation (20240222293). TECHNOLOGIES FOR PACKAGE SUBSTRATES WITH ASYMMETRIC PLATING simplified abstract
- Intel corporation (20240222345). DIE ATTACH IN GLASS CORE PACKAGE THROUGH ORGANIC-TO-ORGANIC BONDING simplified abstract
- Intel corporation (20240243066). LITHOGRAPHIC CAVITY FORMATION TO ENABLE EMIB BUMP PITCH SCALING simplified abstract
- Intel corporation (20240258240). DEVICE AND METHOD OF VERY HIGH DENSITY ROUTING USED WITH EMBEDDED MULTI-DIE INTERCONNECT BRIDGE simplified abstract
- Intel corporation (20240304536). HIGH DENSITY PACKAGING ELECTROMIGRATION PROTECTION LAYER simplified abstract
- Intel corporation (20240329333). CO-PACKAGING OF PHOTONIC & ELECTRONIC INTEGRATED CIRCUIT DIE simplified abstract
- Intel corporation (20240332203). MICROELECTRONIC DEVICE WITH EMBEDDED DIE SUBSTRATE ON INTERPOSER simplified abstract
- Intel corporation (20240339381). AIR-GAP TRACES AND AIR-GAP EMBEDDED BRIDGE INTEGRATED IN GLASS INTERPOSER simplified abstract
- Intel corporation (20240339412). EMBEDDED INTERCONNECT BRIDGE WITH INDUCTOR FOR POWER DELIVERY simplified abstract
- Intel corporation (20240345324). OPTICAL FIBER MOUNTS FOR PRINTED CIRCUIT BOARDS AND INTEGRATED CIRCUIT DEVICE PACKAGES simplified abstract
- Intel corporation (20240421043). SUBSTRATE PROCESS FLOW FOR ENABLING SUBSTRATE TO DIE HYBRID BONDING