Intel corporation (20240111090). DIRECTLY COUPLED OPTICAL INTERPOSER simplified abstract
DIRECTLY COUPLED OPTICAL INTERPOSER
Organization Name
Inventor(s)
Robert A. May of Chandler AZ (US)
Shriya Seshadri of Chandler AZ (US)
Kristof Darmawikarta of Chandler AZ (US)
Hiroki Tanaka of Gilbert AZ (US)
Changhua Liu of Chandler AZ (US)
Srinivas Pietambaram of Chandler AZ (US)
Zhichao Zhang of Chandler AZ (US)
Yosuke Kanaoka of Chandler AZ (US)
Robin Mcree of Chandler AZ (US)
DIRECTLY COUPLED OPTICAL INTERPOSER - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240111090 titled 'DIRECTLY COUPLED OPTICAL INTERPOSER
Simplified Explanation
The device described in the abstract is a substrate with an integrated optical waveguide and a hole that houses an IC die, potentially a photonic IC. The optical waveguide runs parallel to the first surface of the substrate and extends to the first sidewall of the hole, where it aligns with an optical port on the IC die. The substrate may also have a recess to accommodate another device with a socket.
- Substrate with integrated optical waveguide and hole for IC die
- Optical waveguide parallel to substrate surface, extending to hole sidewall
- IC die with optical port aligned with waveguide end
- Substrate may have recess for additional device with socket
Potential Applications
The technology could be used in:
- High-speed data communication systems
- Optical sensing devices
- Photonic integrated circuits
Problems Solved
- Efficient optical signal transmission
- Compact design for integrated photonics
- Alignment of optical components
Benefits
- Improved data transfer speeds
- Space-saving design
- Enhanced optical performance
Potential Commercial Applications
Optical networking equipment for:
- Data centers
- Telecommunication networks
- Aerospace and defense industries
Possible Prior Art
One possible prior art could be the integration of optical waveguides with IC dies in a similar manner, but without the specific alignment features described in this patent application.
Unanswered Questions
How does this technology compare to existing optical interconnect solutions in terms of performance and cost?
This article does not provide a direct comparison with existing optical interconnect solutions in terms of performance and cost. It would be beneficial to understand how this technology stacks up against current industry standards.
What are the potential challenges in manufacturing and scaling up production of devices using this technology?
The article does not address the potential challenges in manufacturing and scaling up production of devices using this technology. It would be important to consider the feasibility of mass production and any obstacles that may arise in the manufacturing process.
Original Abstract Submitted
a device comprises a substrate and an ic die, which may be a photonic ic. the substrate comprises a first surface, a second surface opposite the first surface, an optical waveguide integral with the substrate, and a hole extending from the first surface to the second surface. the hole comprises a first sidewall. the optical waveguide is between the first surface and the second surface, parallel to the first surface, and comprises a first end which extends to the first sidewall. the ic die is within the hole and comprises a second sidewall and an optical port at the second sidewall. the second sidewall is proximate to the first sidewall and the first end of the optical waveguide is proximate to and aligned with the optical port. the substrate may include a recess to receive another device comprising a socket.
- Intel corporation
- Robert A. May of Chandler AZ (US)
- Tarek Ibrahim of Mesa AZ (US)
- Shriya Seshadri of Chandler AZ (US)
- Kristof Darmawikarta of Chandler AZ (US)
- Hiroki Tanaka of Gilbert AZ (US)
- Changhua Liu of Chandler AZ (US)
- Bai Nie of Chandler AZ (US)
- Lilia May of Chandler AZ (US)
- Srinivas Pietambaram of Chandler AZ (US)
- Zhichao Zhang of Chandler AZ (US)
- Duye Ye of Phoenix AZ (US)
- Yosuke Kanaoka of Chandler AZ (US)
- Robin Mcree of Chandler AZ (US)
- G02B6/12
- G02B6/13
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