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Category:Jiann-Tyng Tzeng of Hsinchu (TW)
Pages in category "Jiann-Tyng Tzeng of Hsinchu (TW)"
The following 37 pages are in this category, out of 37 total.
1
- 17819482. POWER VIAS FOR BACKSIDE POWER DISTRIBUTION NETWORK simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17886145. SEMICONDUCTOR DEVICE HAVING MIXED CMOS ARCHITECTURE AND METHOD OF MANUFACTURING SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18156752. MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18327998. Front Side to Backside Interconnection for CFET Devices simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18345070. TRANSISTOR CONTACTS AND METHODS OF FORMING THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18362842. PIN ACCESS HYBRID CELL HEIGHT DESIGN AND SYSTEM simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18421552. DIAGONAL VIA MANUFACTURING METHOD simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18429926. LAYOUT DESIGNS OF INTEGRATED CIRCUITS HAVING BACKSIDE ROUTING TRACKS simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18446744. POWER DISTRIBUTION STRUCTURE, MANUFACTURING METHOD, AND LAYOUT METHOD simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18448101. INTEGRATED CIRCUIT, SYSTEM AND METHOD OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18448136. INTEGRATED CIRCUIT HAVING HYBRID SHEET STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18465686. DEVICE HAVING CFET WITH POWER GRID RAILS IN SECOND METALLIZATION LAYER AND METHOD OF MANUFACTURING SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18526445. SEMICONDUCTOR DEVICES WITH BACKSIDE ROUTING AND METHOD OF FORMING SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18606944. DECOUPLING CAPACITORS WITH BACK SIDE POWER RAILS simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18615462. BACKSIDE CONDUCTING LINES IN INTEGRATED CIRCUITS simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18639465. Power Distribution Network simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
T
- Taiwan semiconductor manufacturing co., ltd. (20240096805). SEMICONDUCTOR DEVICES WITH BACKSIDE ROUTING AND METHOD OF FORMING SAME simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240162142). DIAGONAL VIA MANUFACTURING METHOD simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240186241). INTEGRATED CIRCUIT WITH FRONTSIDE AND BACKSIDE CONDUCTIVE LAYERS AND EXPOSED BACKSIDE SUBSTRATE simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240222264). DECOUPLING CAPACITORS WITH BACK SIDE POWER RAILS simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240429167). CIRCUIT CELLS HAVING POWER STUBS
- Taiwan semiconductor manufacturing company, ltd. (20240104288). INTEGRATED CIRCUIT AND METHOD OF MANUFACTURING SAME simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240105601). DEEP LINES AND SHALLOW LINES IN SIGNAL CONDUCTING PATHS simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240178214). LAYOUT DESIGNS OF INTEGRATED CIRCUITS HAVING BACKSIDE ROUTING TRACKS simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240258311). SEMICONDUCTOR DEVICE HAVING NANOSHEETS simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240266345). BACKSIDE CONDUCTING LINES IN INTEGRATED CIRCUITS simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240266346). Power Distribution Network simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240282671). Front Side to Backside Interconnection for CFET Devices simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240290719). INTEGRATED CIRCUIT DEVICE, SYSTEM AND METHOD simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240303407). POWER DISTRIBUTION STRUCTURE, MANUFACTURING METHOD, AND LAYOUT METHOD simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240304521). DEVICE HAVING CFET WITH POWER GRID RAILS IN SECOND METALLIZATION LAYER AND METHOD OF MANUFACTURING SAME simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240304685). TRANSISTOR CONTACTS AND METHODS OF FORMING THEREOF simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240378361). SEMICONDUCTOR DEVICE LAYOUT simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379854). Metal Rail Conductors For Non-Planar Semiconductor Devices simplified abstract
U
- US Patent Application 18232713. Semiconductor Devices With Backside Power Distribution Network And Frontside Through Silicon Via simplified abstract
- US Patent Application 18358321. Buried Metal for FinFET Device and Method simplified abstract
- US Patent Application 18362889. IC DEVICE LAYOUT METHOD simplified abstract