Power Distribution Network

Organization Name

taiwan semiconductor manufacturing company, ltd.

Inventor(s)

Power Distribution Network - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240266346 titled 'Power Distribution Network

The abstract describes an integrated circuit with power rails, conductive lines, and active areas arranged in different layers.

The integrated circuit includes a first pair of power rails and a second pair of power rails in a first layer.
Conductive lines are in a second layer above the first layer.
A first active area is in a third layer above the second layer, overlapping the first pair of power rails.
The first active area is connected to the first pair of power rails through a first line and a first group of vias.
The first active area is also connected to the second pair of power rails through at least one second line and a second group of vias.

Potential Applications: - This technology can be used in various electronic devices such as smartphones, tablets, and computers. - It can also be applied in automotive electronics, industrial control systems, and communication devices.

Problems Solved: - Provides efficient power distribution within the integrated circuit. - Enables compact design and layout optimization for better performance.

Benefits: - Improved power management and distribution. - Enhanced overall performance and reliability of the integrated circuit.

Commercial Applications: Title: Power-efficient Integrated Circuits for Electronics Industry This technology can be utilized in the semiconductor industry to develop advanced integrated circuits for various electronic applications, leading to more energy-efficient and high-performance devices.

Questions about the technology: 1. How does the integration of power rails and active areas improve the efficiency of the integrated circuit? 2. What are the key advantages of using conductive lines in different layers for power distribution in the circuit?

Original Abstract Submitted

an integrated circuit includes a first pair of power rails and a second pair of power rails that are disposed in a first layer, conductive lines disposed in a second layer above the first layer, and a first active area disposed in a third layer above the second layer. the first active area is arranged to overlap the first pair of power rails. the first active area is coupled to the first pair of power rails through a first line of the conductive lines and a first group of vias, and the first active area is coupled to the second pair of power rails through at least one second line of the conductive lines and a second group of vias different from the first group of vias.