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Category:H01L29/868
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This category has only the following subcategory.
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Pages in category "H01L29/868"
The following 11 pages are in this category, out of 11 total.
1
- 18432923. METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Mitsubishi Electric Corporation)
- 18467293. SEMICONDUCTOR POWER DEVICE WITH IMPROVED RUGGEDNESS simplified abstract (NEXPERIA B.V.)
- 18492162. ELECTRICAL INTERCONNECTION STRUCTURES FOR PREVENTING FIXED POSITIVE CHARGES IN DIODE STRUCTURES (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18492295. DOPED REGIONS FOR NEUTRALIZING ELECTRONS IN DIODE STRUCTURES (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18603426. ELECTROSTATIC DISCHARGE PROTECTION DEVICE simplified abstract (MEDIATEK INC.)
- 18813593. SEMICONDUCTOR PACKAGE (ROHM CO., LTD.)
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- Taiwan semiconductor manufacturing company, ltd. (20250132250). ELECTRICAL INTERCONNECTION STRUCTURES FOR PREVENTING FIXED POSITIVE CHARGES IN DIODE STRUCTURES
- Taiwan semiconductor manufacturing company, ltd. (20250133756). DOPED REGIONS FOR NEUTRALIZING ELECTRONS IN DIODE STRUCTURES
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on April 24th, 2025