18813593. SEMICONDUCTOR PACKAGE (ROHM CO., LTD.)
SEMICONDUCTOR PACKAGE
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Inventor(s)
SEMICONDUCTOR PACKAGE
This abstract first appeared for US patent application 18813593 titled 'SEMICONDUCTOR PACKAGE
Original Abstract Submitted
Provided is a semiconductor package including a Si substrate, a drift layer, a buffer layer, an anode electrode, a trench, a semiconductor apparatus, an anode terminal, a cathode terminal, and a sealing resin.