There is currently no text in this page. You can search for this page title in other pages, or search the related logs, but you do not have permission to create this page.
Category:H01L27/08
Jump to navigation
Jump to search
Subcategories
This category has the following 13 subcategories, out of 13 total.
B
C
H
J
M
R
W
Y
Pages in category "H01L27/08"
The following 65 pages are in this category, out of 65 total.
1
- 17575145. METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR DEVICE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18098710. Layout pattern of semiconductor varactor and forming method thereof simplified abstract (UNITED MICROELECTRONICS CORP.)
- 18150912. SEMICONDUCTOR DEVICE WITH INDUCTIVE COMPONENT AND METHOD OF FORMING simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18244689. PACKAGED SEMICONDUCTOR DIE WITH BUMPLESS DIE-PACKAGE INTERFACE FOR BUMPLESS BUILD-UP LAYER (BBUL) PACKAGES simplified abstract (Intel Corporation)
- 18318854. SEMICONDUCTOR DEVICE AND METHODS OF FORMING PATTERNS simplified abstract (Samsung Electronics Co., Ltd.)
- 18321817. INTEGRATED CIRCUIT simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18396922. DECOUPLING CAPACITORS BASED ON DUMMY THROUGH-SILICON-VIAS simplified abstract (Intel Corporation)
- 18407705. RESISTOR STRUCTURE WITH CAPPING STRUCTURE ON TFR LAYER (Taiwan Semiconductor Manufacturing Company, LTD.)
- 18432985. STRUCTURE AND METHOD FOR VERTICAL TUNNELING FIELD EFFECT TRANSISTOR WITH LEVELED SOURCE AND DRAIN simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18465376. CIRCULAR-SHAPED RESISTOR (International Business Machines Corporation)
- 18478056. SEMICONDUCTOR PACKAGE WITH REDISTRIBUTION SUBSTRATE HAVING EMBEDDED PASSIVE DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18515524. ELECTROSTATIC DISCHARGE PROTECTION DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18533315. INTEGRATED DEVICE, SEMICONDUCTOR DEVICE, AND INTEGRATED DEVICE MANUFACTURING METHOD simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.)
- 18594011. METHOD OF FORMING ELECTRICAL FUSE MATRIX simplified abstract (NANYA TECHNOLOGY CORPORATION)
- 18624264. REDUCED SURFACE FIELD LAYER IN VARACTOR simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18650124. SEMICONDUCTOR DEVICE simplified abstract (SK hynix Inc.)
- 18757744. SEMICONDUCTOR DEVICE HAVING CAPACITOR AND MANUFACTURING METHOD THEREOF simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18944589. CAPACITOR CELL AND STRUCTURE THEREOF (Taiwan Semiconductor Manufacturing Company, LTD.)
- 18973267. MIM CAPACITOR WITH A SYMMETRICAL CAPACITOR INSULATOR STRUCTURE (Taiwan Semiconductor Manufacturing Co., Ltd.)
H
I
- Intel corporation (20240128023). DECOUPLING CAPACITORS BASED ON DUMMY THROUGH-SILICON-VIAS simplified abstract
- Intel Corporation patent applications on April 18th, 2024
- International business machines corporation (20250089347). CIRCULAR-SHAPED RESISTOR
- International Business Machines Corporation patent applications on March 13th, 2025
M
- Micron technology, inc. (20240128163). SUBSTRATES FOR SEMICONDUCTOR PACKAGES, INCLUDING HYBRID SUBSTRATES FOR DECOUPLING CAPACITORS, AND ASSOCIATED DEVICES, SYSTEMS, AND METHODS simplified abstract
- Micron Technology, Inc. patent applications on April 18th, 2024
- Murata manufacturing co., ltd. (20240186314). TRANSIENT VOLTAGE ABSORPTION ELEMENT simplified abstract
- Murata Manufacturing Co., Ltd. patent applications on June 6th, 2024
N
S
- Samsung electronics co., ltd. (20240162225). SEMICONDUCTOR DEVICE AND METHODS OF FORMING PATTERNS simplified abstract
- Samsung electronics co., ltd. (20240312985). ELECTROSTATIC DISCHARGE PROTECTION DEVICE simplified abstract
- Samsung electronics co., ltd. (20240332198). SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract
- Samsung Electronics Co., Ltd. patent applications on January 18th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on March 14th, 2024
- Samsung Electronics Co., Ltd. patent applications on May 16th, 2024
- Samsung Electronics Co., Ltd. patent applications on October 3rd, 2024
- Samsung Electronics Co., Ltd. patent applications on September 19th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on September 19th, 2024
- Sk hynix inc. (20240282768). SEMICONDUCTOR DEVICE simplified abstract
- SK hynix Inc. patent applications on August 22nd, 2024
T
- Taiwan semiconductor manufacturing co., ltd. (20240128261). Passive Device Dies With Measurement Structures simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240250188). REDUCED SURFACE FIELD LAYER IN VARACTOR simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20250105137). MIM CAPACITOR WITH A SYMMETRICAL CAPACITOR INSULATOR STRUCTURE
- Taiwan Semiconductor manufacturing Co., Ltd. patent applications on April 18th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on July 25th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on March 27th, 2025
- Taiwan semiconductor manufacturing company, ltd. (20240178303). STRUCTURE AND METHOD FOR VERTICAL TUNNELING FIELD EFFECT TRANSISTOR WITH LEVELED SOURCE AND DRAIN simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240234481). SEMICONDUCTOR DEVICE WITH INDUCTIVE COMPONENT AND METHOD OF FORMING simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240347579). SEMICONDUCTOR DEVICE HAVING CAPACITOR AND MANUFACTURING METHOD THEREOF simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379734). METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20250072013). RESISTOR STRUCTURE WITH CAPPING STRUCTURE ON TFR LAYER
- Taiwan semiconductor manufacturing company, ltd. (20250072108). CAPACITOR CELL AND STRUCTURE THEREOF
- Taiwan Semiconductor Manufacturing Company, LTD. patent applications on February 27th, 2025
- Taiwan Semiconductor Manufacturing Company, LTD. patent applications on February 6th, 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on July 11th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on May 30th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on November 14th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on October 17th, 2024
- Texas instruments incorporated (20250006408). THERMISTOR INTEGRATED WITH A BIAS RESISTOR
- Texas instruments incorporated (20250006776). THERMISTOR INTEGRATED WITH A THIN-FILM BIAS RESISTOR
- Texas Instruments Incorporated patent applications on January 2nd, 2025
