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Category:H01L23/62
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This category has the following 6 subcategories, out of 6 total.
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Pages in category "H01L23/62"
The following 25 pages are in this category, out of 25 total.
1
- 17957257. EMBEDDED THIN FILM VARISTOR IN THROUGH GLASS VIAS simplified abstract (Intel Corporation)
- 18435938. SEMICONDUCTOR DEVICE HAVING MULTIPLE ELECTROSTATIC DISCHARGE (ESD) PATHS simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18437428. PACKAGE STRUCTURE AND ELECTRONIC APPARATUS simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.)
- 18470655. BACKSIDE FUSE CONNECTED TO BACKSIDE BACK END OF THE LINE NETWORK (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18486526. ELECTRICAL FUSE STRUCTURE (International Business Machines Corporation)
- 18605645. SEMICONDUCTOR DEVICE HAVING MULTIPLE ELECTROSTATIC DISCHARGE (ESD) PATHS simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18614266. RESISTOR-CAPACITOR COMPONENT FOR HIGH-VOLTAGE APPLICATIONS AND METHOD FOR MANUFACTURING THEREOF simplified abstract (Murata Manufacturing Co., Ltd.)
H
I
- Intel corporation (20240113046). EMBEDDED THIN FILM VARISTOR IN THROUGH GLASS VIAS simplified abstract
- Intel Corporation patent applications on April 4th, 2024
- International business machines corporation (20250096126). BACKSIDE FUSE CONNECTED TO BACKSIDE BACK END OF THE LINE NETWORK
- International business machines corporation (20250125285). ELECTRICAL FUSE STRUCTURE
- International Business Machines Corporation patent applications on April 17th, 2025
- International Business Machines Corporation patent applications on February 20th, 2025
- INTERNATIONAL BUSINESS MACHINES CORPORATION patent applications on March 20th, 2025
M
S
T
- Taiwan semiconductor manufacturing co., ltd. (20240222363). SEMICONDUCTOR DEVICE HAVING MULTIPLE ELECTROSTATIC DISCHARGE (ESD) PATHS simplified abstract
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on July 4th, 2024
- Taiwan semiconductor manufacturing company, ltd. (20240178216). SEMICONDUCTOR DEVICE HAVING MULTIPLE ELECTROSTATIC DISCHARGE (ESD) PATHS simplified abstract
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on May 30th, 2024