18437428. PACKAGE STRUCTURE AND ELECTRONIC APPARATUS simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.)
PACKAGE STRUCTURE AND ELECTRONIC APPARATUS
Organization Name
Inventor(s)
Zhiqiang Xiang of Shenzhen (CN)
PACKAGE STRUCTURE AND ELECTRONIC APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18437428 titled 'PACKAGE STRUCTURE AND ELECTRONIC APPARATUS
Simplified Explanation
The patent application describes a package structure and an electronic apparatus that includes a power semiconductor device, a wire, and a shape memory object. The wire is connected to the power semiconductor device, and the shape memory object is in contact with the wire. The shape memory object is designed to deform when its temperature reaches a certain threshold, which allows the current in the wire to be cut off or reduced. This helps reduce the impact of high temperatures generated by the power semiconductor device during an overcurrent situation, thereby protecting the printed circuit board from damage and enhancing the self-protection capability of the package structure.
- Power semiconductor device
- Wire connected to the power semiconductor device
- Shape memory object in contact with the wire
- Shape memory object deforms at a preset temperature to cut off or reduce current in the wire
- Reduces impact of high temperatures during overcurrent situations
- Protects printed circuit board from damage
- Enhances self-protection capability of the package structure
Potential Applications
The technology described in this patent application could be applied in various electronic devices and systems where power semiconductor devices are used, such as in power supplies, motor control systems, and inverters.
Problems Solved
This technology helps address the issue of high temperatures generated by power semiconductor devices during overcurrent situations, which can lead to damage to the printed circuit board. By cutting off or reducing the current in the wire through the deformation of the shape memory object, the technology helps protect the circuit board and enhance the overall reliability of the electronic apparatus.
Benefits
- Reduces the impact of high temperatures on the printed circuit board - Enhances the self-protection capability of the package structure - Improves the reliability and longevity of the electronic apparatus
Potential Commercial Applications
"Enhancing Overcurrent Self-Protection in Electronic Devices with Shape Memory Technology"
Possible Prior Art
There are existing technologies that use thermal protection mechanisms in electronic devices to prevent damage from overcurrent situations. However, the specific use of a shape memory object to cut off or reduce current in a wire is a unique aspect of this patent application.
Unanswered Questions
How does the shape memory object deform at the preset temperature?
The patent application does not provide detailed information on the mechanism by which the shape memory object deforms at the preset temperature. Further research or experimentation may be needed to understand this process better.
What materials are used in the shape memory object?
The patent application does not specify the materials used in the shape memory object. Understanding the composition of the shape memory object could provide insights into its performance and durability.
Original Abstract Submitted
A package structure and an electronic apparatus includes a power semiconductor device, a wire, and a shape memory object. The wire is electrically connected to the power semiconductor device, the shape memory object is in contact with the wire, and the shape memory object is configured to deform when temperature of the shape memory object is not less than preset temperature, to enable a current in the wire to be cut off or reduced. In this way, impact of high temperature generated by the power semiconductor device when an overcurrent occurs in the power semiconductor device on the printed circuit board is reduced, a possibility that a printed circuit board is damaged is greatly reduced, and an overcurrent self-protection capability of the package structure is implemented.