Samsung electronics co., ltd. (20250062212). SEMICONDUCTOR PACKAGES AND ELECTRONIC DEVICES INCLUDING THE SAME
SEMICONDUCTOR PACKAGES AND ELECTRONIC DEVICES INCLUDING THE SAME
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SEMICONDUCTOR PACKAGES AND ELECTRONIC DEVICES INCLUDING THE SAME
This abstract first appeared for US patent application 20250062212 titled 'SEMICONDUCTOR PACKAGES AND ELECTRONIC DEVICES INCLUDING THE SAME
Original Abstract Submitted
there is provided a semiconductor package comprising: a substrate that includes a first surface and a second surface, wherein the second surface is opposite to the first surface; a first connection member and a second connection member on the second surface of the substrate; an upper pad on the first surface of the substrate, wherein the upper pad is electrically connected to the first connection member; a circuit pattern on the first surface of the substrate, wherein the circuit pattern is electrically connected to the second connection member; an upper passivation film on the first surface of the substrate, wherein the upper passivation film at least partially exposes the upper pad and the circuit pattern; a bump on the upper pad; and a semiconductor chip on the bump, wherein the circuit pattern is electrically separated from the semiconductor chip.
