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Category:H01L23/50
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This category has the following 6 subcategories, out of 6 total.
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Pages in category "H01L23/50"
The following 87 pages are in this category, out of 87 total.
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- 18068123. SEMICONDUCTOR DEVICE WITH POWER SUPPLY DISTRIBUTION NETWORKS ON FRONTSIDE AND BACKSIDE OF A CIRCUIT simplified abstract (International Business Machines Corporation)
- 18106540. INTEGRATED CIRCUIT DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18122891. VOLTAGE REGULATOR MODULE HAVING A POWER STAGE simplified abstract (Infineon Technologies Austria AG)
- 18145003. FORK SHEET DEVICE WITH WRAPPED SOURCE AND DRAIN CONTACT TO PREVENT NFET TO PFET CONTACT SHORTAGE IN A TIGHT SPACE simplified abstract (International Business Machines Corporation)
- 18155914. CELL HAVING STACKED PICK-UP REGION simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18174865. SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18187180. PROCESSOR PACKAGE SUBSTRATE WITH HIGH-SPEED TOP-SURFACE CONNECTION TO CABLE INTERCONNECT simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18211084. BACKSIDE CONTACT BASED DIE EDGE GUARD RINGS (Intel Corporation)
- 18299368. BONDING LAYER BETWEEN STACKED INTEGRATED CIRCUITS simplified abstract (HONEYWELL INTERNATIONAL INC.)
- 18336413. MIM Capacitor in IC Heterogenous Integration (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18393092. INTEGRATED CIRCUIT INCLUDING SWITCH CELL AREA simplified abstract (Samsung Electronics Co., Ltd.)
- 18398680. SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS OF EXTERNAL ELECTRODES simplified abstract (ROHM CO., LTD.)
- 18432614. SEMICONDUCTOR MODULE simplified abstract (Rohm Co., Ltd.)
- 18447788. CELL STRUCTURES AND POWER ROUTING FOR INTEGRATED CIRCUITS simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18498188. PASSIVE COMPONENT MODULE simplified abstract (Texas Instruments Incorporated)
- 18511533. INTEGRATED CIRCUIT DEVICE INCLUDING A POWER SUPPLY LINE AND METHOD OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18517232. PACKAGES WITH METAL LINE CRACK PREVENTION DESIGN simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18587407. SEMICONDUCTOR PACKAGE AND METHOD simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18652868. PASSIVATION SCHEME FOR PAD OPENINGS AND TRENCHES simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18672083. METHOD AND IC DESIGN WITH NON-LINEAR POWER RAILS simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18676537. SEMICONDUCTOR DEVICE INCLUDING STANDARD CELL HAVING SPLIT PORTIONS simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.)
- 18749274. HIGH DENSITY SUBSTRATE ROUTING IN PACKAGE simplified abstract (Intel Corporation)
- 18777726. Multi-Die Fine Grain Integrated Voltage Regulation (Apple Inc.)
- 18808934. SEMICONDUCTOR DEVICE (SAMSUNG ELECTRONICS CO., LTD.)
- 18816500. POWER MODULE AND METHOD OF FABRICATING THE SAME (Infineon Technologies AG)
- 18818430. POWER MANAGEMENT INTEGRATED CIRCUIT WITH BLEED CIRCUIT CONTROL (Lodestar Licensing Group LLC)
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- Intel corporation (20240105582). LOW TEMPERATURE CAPACITIVELY COUPLED DEVICE FOR LOW NOISE CIRCUITS simplified abstract
- Intel corporation (20240339428). HIGH DENSITY SUBSTRATE ROUTING IN PACKAGE simplified abstract
- Intel corporation (20240355725). POWER DELIVERY STRUCTURES simplified abstract
- Intel corporation (20240355819). INTEGRATED CIRCUIT STRUCTURE WITH FRONT SIDE SIGNAL LINES AND BACKSIDE POWER DELIVERY simplified abstract
- Intel corporation (20240421101). BACKSIDE CONTACT BASED DIE EDGE GUARD RINGS
- Intel Corporation patent applications on December 19th, 2024
- Intel Corporation patent applications on January 18th, 2024
- Intel Corporation patent applications on January 23rd, 2025
- Intel Corporation patent applications on March 28th, 2024
- Intel Corporation patent applications on October 10th, 2024
- Intel Corporation patent applications on October 24th, 2024
- International business machines corporation (20240203880). SEMICONDUCTOR DEVICE WITH POWER SUPPLY DISTRIBUTION NETWORKS ON FRONTSIDE AND BACKSIDE OF A CIRCUIT simplified abstract
- International business machines corporation (20240213243). FORK SHEET DEVICE WITH WRAPPED SOURCE AND DRAIN CONTACT TO PREVENT NFET TO PFET CONTACT SHORTAGE IN A TIGHT SPACE simplified abstract
- International business machines corporation (20240321802). PROCESSOR PACKAGE SUBSTRATE WITH HIGH-SPEED TOP-SURFACE CONNECTION TO CABLE INTERCONNECT simplified abstract
- International Business Machines Corporation patent applications on June 20th, 2024
- International Business Machines Corporation patent applications on June 27th, 2024
- INTERNATIONAL BUSINESS MACHINES CORPORATION patent applications on September 26th, 2024
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- Nec corporation (20240429309). QUANTUM DEVICE AND QUANTUM DEVICE MANUFACTURING METHOD
- NEC Corporation patent applications on December 26th, 2024
- Nvidia corporation (20240332223). Chip Die Substrate with Edge-Mounted Capacitors simplified abstract
- NVIDIA Corporation patent applications on October 3rd, 2024
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- Samsung electronics co., ltd. (20240234294). INTEGRATED CIRCUIT INCLUDING SWITCH CELL AREA simplified abstract
- Samsung electronics co., ltd. (20240413151). SEMICONDUCTOR DEVICE
- Samsung Electronics Co., Ltd. patent applications on December 12th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on December 12th, 2024
- Samsung Electronics Co., Ltd. patent applications on February 29th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on February 8th, 2024
- Samsung Electronics Co., Ltd. patent applications on July 11th, 2024
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- Taiwan semiconductor manufacturing co., ltd. (20240194611). SEMICONDUCTOR PACKAGE AND METHOD simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240312838). METHOD AND IC DESIGN WITH NON-LINEAR POWER RAILS simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240421063). MIM Capacitor in IC Heterogenous Integration
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on December 19th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on January 25th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on June 13th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. patent applications on September 19th, 2024
- Taiwan semiconductor manufacturing company, ltd. (20240282728). PASSIVATION SCHEME FOR PAD OPENINGS AND TRENCHES simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379527). INTEGRATED CHIP HAVING A BACK-SIDE POWER RAIL simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379738). STRUCTURE AND FORMATION METHOD OF INTEGRATED CHIPS PACKAGE WITH CAPACITOR simplified abstract
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on August 22nd, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on February 15th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on March 14th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on November 14th, 2024
- Texas instruments incorporated (20240297112). PASSIVE COMPONENT MODULE simplified abstract
- Texas Instruments Incorporated patent applications on February 29th, 2024
- Texas Instruments Incorporated patent applications on September 5th, 2024
