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Category:H01L23/46
Subcategories
This category has the following 2 subcategories, out of 2 total.
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Pages in category "H01L23/46"
The following 37 pages are in this category, out of 37 total.
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- 17570647. Temperature Control Element Utilized in Device Die Packages simplified abstract (GOOGLE LLC)
- 17846129. PACKAGE ARCHITECTURE WITH VERTICALLY STACKED BRIDGE DIES HAVING PLANARIZED EDGES simplified abstract (Intel Corporation)
- 18016411. CHIP HEAT SINK AND NUCLEIC ACID EXTRACTION DEVICE simplified abstract (Beijing BOE Technology Development Co., Ltd.)
- 18016411. CHIP HEAT SINK AND NUCLEIC ACID EXTRACTION DEVICE simplified abstract (BOE Technology Group Co., Ltd.)
- 18092136. HETEROGENEOUS INTEGRATED MULTI-CHIP COOLER MODULE simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18099697. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18118736. ELECTRONIC PACKAGE STRUCTURE simplified abstract (Advanced Semiconductor Engineering, Inc.)
- 18361099. SEMICONDUCTOR PACKAGE STRUCTURE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18393221. MICRO-ELECTRONIC COMPONENT COMBINING POWER DELIVERY AND COOLING FROM THE BACK SIDE simplified abstract (IMEC VZW)
- 18403763. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18453713. SEMICONDUCTOR DEVICE simplified abstract (FUJI ELECTRIC CO., LTD.)
- 18505670. HEAT DISSIPATION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18510599. SEMICONDUCTOR DEVICE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18639595. HEAT DISSIPATION FOR SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18810466. SEMICONDUCTOR DEVICE (Mitsubishi Electric Corporation)
- 18986384. COOLER AND COOLING STRUCTURE FOR SEMICONDUCTOR DEVICE (ROHM CO., LTD.)
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- Taiwan semiconductor manufacturing company, ltd. (20240112983). SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240136251). SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240266285). HEAT DISSIPATION FOR SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE simplified abstract
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on April 25th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on April 4th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on August 8th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on March 14th, 2024