Mitsubishi Electric Corporation patent applications on May 1st, 2025
Patent Applications by Mitsubishi Electric Corporation on May 1st, 2025
Mitsubishi Electric Corporation: 26 patent applications
Mitsubishi Electric Corporation has applied for patents in the areas of H01L23/00 (3), B60W30/095 (2), B60W60/00 (2), H01L23/495 (2), H01L29/739 (2) B60Q1/085 (1), H01L24/78 (1), H10D64/605 (1), H10D12/481 (1), H04W68/02 (1)
With keywords such as: unit, semiconductor, layer, vehicle, surface, voltage, information, portion, control, and element in patent application abstracts.
Patent Applications by Mitsubishi Electric Corporation
Inventor(s): Mitsuo SHIMOTANI of Tokyo JP for mitsubishi electric corporation, Satoru INOUE of Tokyo JP for mitsubishi electric corporation, Yoshitaka ONISHI of Tokyo JP for mitsubishi electric corporation, Hiroki NAKAMOTO of Tokyo JP for mitsubishi electric corporation
IPC Code(s): B60Q1/08, B60Q1/00
CPC Code(s): B60Q1/085
Abstract: a light distribution control device includes processing circuitry configured to receive environment information indicating an environment in which a host vehicle is placed; receive an instruction from a driver of the host vehicle to switch an irradiation lamp of the host vehicle; perform estimation of whether or not the driver has an intention to switch the irradiation lamp on a basis of an action of the driver; switch the irradiation lamp of the host vehicle on a basis of the environment information; and learn a driving scene in which the irradiation lamp of the host vehicle is to be switched by using the received environment information at a second time point at which the intention is estimated to be present, the second time point being prior to a first time point at which the instruction is received.
Inventor(s): Atsuhiro YAMADA of Tokyo JP for mitsubishi electric corporation, Takumi TAKEI of Tokyo JP for mitsubishi electric corporation
IPC Code(s): B60Q9/00, G01S13/04
CPC Code(s): B60Q9/00
Abstract: an occupant-left-unattended warning device includes: a transmitter/receiver to transmit an electromagnetic wave in an interior, and receive a reception signal; an estimating unit to estimate whether an occupant in the interior is a warning-necessitating occupant using a first method, assess whether it is possible to confirm that the occupant is a warning-necessitating occupant; a supplementary assessing unit to supplementarily assess whether the occupant is a warning-necessitating occupant using a second method in a case where it is not possible to confirm that the occupant is a warning-necessitating occupant; a warning necessity/unnecessity assessing unit to assess whether an occupant-left-unattended warning is necessary or unnecessary on a basis of the assessment or supplementary assessment result; and a control unit to control an output device to give a warning in a case where it is assessed that the occupant-left-unattended warning is necessary.
Inventor(s): Masahiro ABUKAWA of Tokyo JP for mitsubishi electric corporation, Naoyuki TSUSHIMA of Tokyo JP for mitsubishi electric corporation
IPC Code(s): B60W30/09, B60W30/095, B60W50/00, G06V20/56
CPC Code(s): B60W30/09
Abstract: a vehicle control unit includes: a sensor-signal processing unit that acquires sensor signals from multiple sensors detecting physical quantities related to the surrounding environment of a vehicle and acquires, from at least one camera capturing images of the surrounding of the vehicle, image data indicating the captured images; a human-vision calculating unit that uses a human visual model calculated in advance calculates a visibility repulsive potential affected by vision of a human recognizing the images; and a potential-risk-prediction-model processing unit that uses a potential-risk prediction model for predicting a potential risk from characteristic quantities of the surrounding environment of a target vehicle to calculate a physical repulsive potential caused by the surrounding environment of the target vehicle on the basis of the physical quantities and the images, and calculates an integrated repulsive potential obtained by correcting the physical repulsive potential with the visibility repulsive potential.
20250136127. MOBILE-BODY CONTROL SYSTEM_simplified_abstract_(mitsubishi electric corporation)
Inventor(s): Tomokazu SAITO of Tokyo JP for mitsubishi electric corporation, Yuta WADA of Tokyo JP for mitsubishi electric corporation
IPC Code(s): B60W50/029, B60W60/00
CPC Code(s): B60W50/029
Abstract: in a management apparatus, a mobile-body control system has an instruction unit that transmits a command of making a vehicle move to a waiting state from automatic driving; in the case where a state-transition determination unit determines that a state of the vehicle satisfies a predetermined condition and the vehicle receives the foregoing command from the management apparatus, the vehicle is made to move to the waiting state by a state-transition execution unit, so that loss in the function of a battery is suppressed.
20250136146. AUTOMATED DRIVING SYSTEM_simplified_abstract_(mitsubishi electric corporation)
Inventor(s): Michitoshi AZUMA of Tokyo JP for mitsubishi electric corporation, Toru Higuchi of Tokyo JP for mitsubishi electric corporation, Takayuki Tanaka of Tokyo JP for mitsubishi electric corporation, Kohei Mori of Tokyo JP for mitsubishi electric corporation
IPC Code(s): B60W60/00, B60W30/095, B60W30/18, G08G1/01, G08G1/056, G08G1/0967, G08G1/16, H04W4/44
CPC Code(s): B60W60/001
Abstract: this automated driving system includes a vehicle having a target traveling path for performing automated traveling, the automated driving system being configured to acquire a position and an azimuth of the vehicle and a measurement reliability therefor. the vehicle includes an automated traveling restart determination unit for switching from a stopped state to automated traveling. in a case where the measurement reliability is equal to or greater than a predetermined first threshold, restart of automated traveling of the vehicle is permitted when an absolute value of a first position deviation between the target traveling path and the position of the vehicle is equal to or smaller than a predetermined second threshold and an absolute value of an angle deviation between an azimuth of the target traveling path and the azimuth of the vehicle is equal to or smaller than a predetermined third threshold.
20250137680. AIR CONDITIONER_simplified_abstract_(mitsubishi electric corporation)
Inventor(s): Shun MIYAMORI of Tokyo JP for mitsubishi electric corporation, Ikumi HOSHINO of Tokyo JP for mitsubishi electric corporation
IPC Code(s): F24F11/88
CPC Code(s): F24F11/88
Abstract: an air conditioner includes an indoor unit and an outdoor unit. the air conditioner includes a relay that is in one of a short-circuit state or a released state according to a switching signal to be supplied, a voltage detection circuit that detects a voltage, and a relay switching circuit that outputs a switching signal for causing the relay to be in the released state in a case where a value of the voltage detected by the voltage detection circuit is larger than a predetermined first threshold, to the relay. the relay, the voltage detection circuit, and the relay switching circuit are disposed in the indoor unit or the outdoor unit.
20250137992. NON-INVASIVE SUBSTANCE ANALYZER_simplified_abstract_(mitsubishi electric corporation)
Inventor(s): Shusaku HAYASHI of Chiyoda-ku, Tokyo JP for mitsubishi electric corporation, Koichi AKIYAMA of Chiyoda-ku, Tokyo JP for mitsubishi electric corporation, Yuki TSUDA of Chiyoda-ku, Tokyo JP for mitsubishi electric corporation
IPC Code(s): G01N33/49, G01N21/17, G01N21/3577, G01N21/41
CPC Code(s): G01N33/49
Abstract: the non-invasive substance analyzer includes an optical waveguide circuit, a probe light source, and a light intensity detector. the optical waveguide circuit has a sample mounting region. the probe light source emits probe light. the optical waveguide circuit includes a first optical waveguide to which the probe light is incident, a waveguide-type ring resonator, and a second optical waveguide. the light intensity detector detects an intensity of first light which is a part of the probe light and is optically coupled to the second optical waveguide.
Inventor(s): Hiroyasu SANO of Tokyo JP for mitsubishi electric corporation, Shusaku UMEDA of Tokyo JP for mitsubishi electric corporation, Akira KURITA of Tokyo JP for mitsubishi electric corporation
IPC Code(s): G01S5/14
CPC Code(s): G01S5/14
Abstract: a mobile station that is a position estimation device that estimates a position of the mobile station based on a plurality of distance measurement results measured between each of a plurality of fixed stations and the mobile station using wireless communication includes: a positioning calculation unit that calculates a coordinate-axial position of the mobile station for each coordinate axis using a position of the fixed stations and the distance measurement results in order from a coordinate axis having a largest coordinate-axial distance between the plurality of fixed stations; and a position estimation result generation unit that generates a position estimation result indicating a three-dimensional position of the mobile station based on a calculation result of the coordinate-axial position.
Inventor(s): Yoshitaka KAJIYAMA of Chiyoda-ku, Tokyo JP for mitsubishi electric corporation, Yasuhisa SHIMAKURA of Chiyoda-ku, Tokyo JP for mitsubishi electric corporation, Yoshiaki HIRATA of Chiyoda-ku, Tokyo JP for mitsubishi electric corporation, Akihiro FUJIE of Chiyoda-ku, Tokyo JP for mitsubishi electric corporation
IPC Code(s): G01S7/52, A61B8/00
CPC Code(s): G01S7/52079
Abstract: an ultrasonic imaging element includes a substrate, an optical transmission element, an optical reception element, an optical waveguide, and a bragg grating waveguide. each of the optical transmission element and the optical reception element is connected to the bragg grating waveguide via the optical waveguide. each of the optical transmission element, the optical reception element, the optical waveguide, and the bragg grating waveguide is disposed on the substrate.
Inventor(s): Asami UCHIYAMA of Tokyo JP for mitsubishi electric corporation, Yoshimichi MORITA of Tokyo JP for mitsubishi electric corporation, Shinya OKUDA of Tokyo JP for mitsubishi electric corporation
IPC Code(s): G02F1/015, G02F1/01, G02F1/017
CPC Code(s): G02F1/0157
Abstract: an ea modulator () and a termination resistor () are monolithically integrated on a substrate (). the termination resistor () is electrically connected in parallel to the ea modulator (). the termination resistor () is made of semiconductor material. a length of the termination resistor () is 0.5 to 1.5 times a length of the ea modulator (). the termination resistor () is arranged in parallel to the ea modulator () in plan view.
Inventor(s): Naoki TAKAHASHI of Tokyo JP for mitsubishi electric corporation, Ryosuke MAEMURA of Tokyo JP for mitsubishi electric corporation, Nariaki TAKEHARA of Tokyo JP for mitsubishi electric corporation, Ken HIKASA of Tokyo JP for mitsubishi electric corporation, Kohei MORI of Tokyo JP for mitsubishi electric corporation
IPC Code(s): G05D1/633, G05D1/248, G05D1/646, G05D105/20, G05D109/10, G05D111/30
CPC Code(s): G05D1/633
Abstract: the mobile object control device includes: a prescribed path information acquisition unit which acquires prescribed path information; an obstacle information acquisition unit which acquires obstacle information; a position orientation information acquisition unit which acquires position orientation information; and a traveling path determination unit which judges whether or not a vehicle is traveling on a prescribed path, and judges whether or not there is a possibility that the vehicle collides with an obstacle, and then, if it is judged that there is the possibility of the collision, determines whether or not to cause the vehicle to travel on a prescribed-path-outside traveling path.
Inventor(s): Hideyuki OZAWA of Tokyo JP for mitsubishi electric corporation, Kazuki NOBUE of Tokyo JP for mitsubishi electric corporation, Masaharu IMAKI of Tokyo JP for mitsubishi electric corporation
IPC Code(s): G08G5/32, G08G5/76
CPC Code(s): G08G5/32
Abstract: a flying assistance system includes: a wind state collection unit configured to analyze future wind states and generate wind state information; a flight route storage unit configured to store route information; and an optimization processing unit configured to optimize a flight plan of a flying object on the basis of flight information, the wind state information, and the route information. the optimization processing unit decides a flight order pattern indicating a flight order for traveling in a circuit to the location of the arrival point corresponding to the flight information on the basis of the wind state information and the route information and changes the flight start time of the flight order pattern to optimize the flight plan including the start time and the flight order pattern according to an optimization index based on the flight order pattern, the wind state information, and the route information.
20250140638. SEMICONDUCTOR DEVICE_simplified_abstract_(mitsubishi electric corporation)
Inventor(s): Nobuchika AOKI of Tokyo JP for mitsubishi electric corporation
IPC Code(s): H01L23/367, H01L23/46
CPC Code(s): H01L23/3677
Abstract: a semiconductor device includes a heat dissipation base member and a plurality of heat dissipation fins. the plurality of heat dissipation fins is joined to a lower surface of the heat dissipation base member. each of the plurality of heat dissipation fins includes a plurality of crest portions formed by repeatedly bending a band-shaped plate member extending in one direction. the cross-sectional shape of each of the plurality of heat dissipation fins is distorted due to a left-right asymmetric shape of each of the plurality of crest portions. the plurality of crest portions has a sparse region in which an interval between the plurality of crest portions in an extending direction of each of the plurality of heat dissipation fins is sparse and a dense region in which an interval between the plurality of crest portions in the extending direction is denser than the interval in the sparse region.
20250140719. SEMICONDUCTOR APPARATUS_simplified_abstract_(mitsubishi electric corporation)
Inventor(s): Seiya NAKANO of Tokyo JP for mitsubishi electric corporation, Hiroya HAMADA of Tokyo JP for mitsubishi electric corporation
IPC Code(s): H01L23/00, H01L23/36, H01L29/739
CPC Code(s): H01L24/05
Abstract: according to the present disclosure, a semiconductor apparatus comprises a semiconductor substrate, on a front surface of which a semiconductor device is formed, a surface electrode formed on the front surface and connected to the semiconductor device, a metal film formed on the surface electrode, a suppression film formed on the surface electrode and configured to suppress the spread of solder applied on the metal film, and a thermally conductive film formed further on an outer periphery side than the metal film and the suppression film on the surface electrode, thicker than the metal film, and having higher thermal conductivity than the suppression film.
Inventor(s): Koichi TOKUBO of Fukuoka JP for mitsubishi electric corporation
IPC Code(s): H01L23/00
CPC Code(s): H01L24/78
Abstract: a semiconductor manufacturing apparatus includes: a wire guide to supply a wire; a tool to bond the wire supplied by the wire guide to a plurality of bonded portions of each of the semiconductor devices; a first blade to half cut a remaining portion of the wire other than a portion between the plurality of bonded portions; and a second blade having a cutting edge whose angle is an acute angle smaller than an angle of a cutting edge of the first blade and to cut the half cut portion of the wire.
Inventor(s): Takeru ZAIMA of Tokyo JP for mitsubishi electric corporation
IPC Code(s): H01L23/00, H01L23/495
CPC Code(s): H01L24/83
Abstract: a nozzle of a semiconductor manufacturing apparatus includes a cross groove provided on a bottom surface, a supply hole provided in the center of the cross groove, and exhaust grooves that extend from ends of the cross groove to the outside of the bottom surface on the bottom surface and are shallower than the cross groove. the semiconductor manufacturing apparatus includes the nozzle, a syringe connected to the nozzle, and a dispenser that fills, in the cross groove, resin paste in the syringe via the supply hole with a gas pressure or an air pressure.
20250141186. SEMICONDUCTOR LASER ELEMENT_simplified_abstract_(mitsubishi electric corporation)
Inventor(s): Kenichi ABE of Chiyoda-ku, Tokyo JP for mitsubishi electric corporation, Koichi AKIYAMA of Chiyoda-ku, Tokyo JP for mitsubishi electric corporation, Satoshi NISHIKAWA of Chiyoda-ku, Tokyo JP for mitsubishi electric corporation
IPC Code(s): H01S5/10, H01S5/12
CPC Code(s): H01S5/1014
Abstract: a semiconductor laser element includes: a semiconductor laser portion; a transition portion that is adjacent to the semiconductor laser portion in a first direction and a spot size converter that is adjacent to the transition portion in the first direction. each of the semiconductor laser portion, the transition portion and the spot size converter includes: a semiconductor substrate having a first surface; and a first clad layer, an active layer and a second clad layer stacked on the first surface in this order from the first surface side in a third direction orthogonal to the first surface. each of the transition portion and the spot size converter further includes a waveguide layer that is in contact with a part of an upper surface of the second clad layer and has a refractive index higher than refractive indexes of the active layer and the second clad layer.
20250141189. OPTICAL SEMICONDUCTOR DEVICE_simplified_abstract_(mitsubishi electric corporation)
Inventor(s): Ayumi FUCHIDA of Tokyo JP for mitsubishi electric corporation, Go SAKAINO of Tokyo JP for mitsubishi electric corporation
IPC Code(s): H01S5/30, H01S5/02, H01S5/042, H01S5/22, H01S5/42
CPC Code(s): H01S5/3013
Abstract: active portions (a) and passive portions (b) are alternately arranged along a first direction on a semiconductor substrate () of a first conductive type. an electrode () is provided on the active portion (a). the active portion (a) includes an active layer (), a second conductive type cladding layer (), and a second conductive type contact layer () that are stacked in order on the semiconductor substrate (). the active portion (a) has a resonator structure sandwiched between a front end surface () and a rear end surface () in a second direction perpendicular to the first direction. the second conductive type contact layer () in the active portion (a) is in contact with the electrode (). the passive portion (b) includes the second conductive type contact layer () and a first conductive type layer () provided on the second conductive type contact layer ().
Inventor(s): Yoshiaki ISHIGURO of Tokyo JP for mitsubishi electric corporation, Kohei ONDA of Tokyo JP for mitsubishi electric corporation
IPC Code(s): H02M1/08, H03K17/687
CPC Code(s): H02M1/08
Abstract: the present disclosure includes: a gate drive unit which applies a gate drive voltage to a control terminal of a semiconductor switching element so as to drive the semiconductor switching element; a voltage feedback unit which is connected to a high-potential main terminal of the semiconductor switching element and which causes a voltage of the high-potential main terminal to be fed back to the gate drive unit, the voltage being generated when the semiconductor switching element is turned off; and a discharge unit forming a path through which electric charge included in the voltage feedback unit is discharged to the high-potential main terminal side of the semiconductor switching element when the semiconductor switching element is turned on.
Inventor(s): Haruka MATSUO of Tokyo JP for mitsubishi electric corporation, Tomohiro KUTSUKI of Tokyo JP for mitsubishi electric corporation, Takaaki TAKAHARA of Tokyo JP for mitsubishi electric corporation, Koichi ARISAWA of Tokyo JP for mitsubishi electric corporation, Yuki TANIYAMA of Tokyo JP for mitsubishi electric corporation
IPC Code(s): H02M1/12, H02M1/14, H02M1/44, H02M5/458, H02P27/06
CPC Code(s): H02M1/12
Abstract: a power converting apparatus includes a rectifier unit that rectifies first alternating-current power supplied from a commercial power supply, a capacitor connected to an output end of the rectifier unit, an inverter connected across the capacitor to generate second alternating-current power and output the second alternating-current power to a motor, and a control unit that controls an operation of the inverter and an operation of the motor using a dq-rotational coordinate system rotating in synchronization with a rotor position of the motor. the control unit extracts multiple frequency components from a q-axis current pulsation, which is a pulsatile component of a q-axis current, and limits the amplitude value of each of the extracted frequency components to control the amplitude of the q-axis current pulsation.
20250141365. CONTROL DEVICE FOR CONVERTER_simplified_abstract_(mitsubishi electric corporation)
Inventor(s): Takeshi OKAMOTO of Tokyo JP for mitsubishi electric corporation, Hiroyuki ENOKIJIMA of Tokyo JP for mitsubishi electric corporation, Yasushi OTSUKA of Tokyo JP for mitsubishi electric corporation
IPC Code(s): H02M7/219
CPC Code(s): H02M7/219
Abstract: in a control device, a phase corrector corrects an error in a phase of an ac power supply detected by a phase detector. a current coordinate transformer transforms detected values of three-phase currents of a converter into dq-axes currents using the corrected phase. a current controller calculates a voltage command so that current commands of the converter and the dq-axes currents match each other. a voltage coordinate transformer transforms the voltage command into three-phase voltage commands using the corrected phase. an estimator estimates an inductance of a reactor using the voltage commands and the dq-axes currents. the phase corrector corrects a phase detection error using the voltage commands, the dq-axes currents, and an impedance of the reactor. the current controller updates a current control gain using the inductance estimated by the estimator.
20250141383. MOTOR CONTROLLER_simplified_abstract_(mitsubishi electric corporation)
Inventor(s): Shota TANIWAKI of Tokyo JP for mitsubishi electric corporation, Shuzo AKIYAMA of Tokyo JP for mitsubishi electric corporation
IPC Code(s): H02P23/04, B62D5/04, H02P5/50
CPC Code(s): H02P23/04
Abstract: a motor controller is a motor controller that controls a first motor and a second motor which share an output shaft, and includes: a first control unit configured to include a voltage conversion circuit that converts a first voltage output from a first power source into a predetermined voltage, and to control the first motor using the predetermined voltage converted by the voltage conversion circuit; and a second control unit configured to control the second motor using a second voltage output from a second power source.
Inventor(s): Tadahiro SHIMODA of Tokyo JP for mitsubishi electric corporation, Mitsuru MOCHIZUKI of Tokyo JP for mitsubishi electric corporation, Masayuki NAKAZAWA of Tokyo JP for mitsubishi electric corporation, Naofumi IWAYAMA of Tokyo JP for mitsubishi electric corporation
IPC Code(s): H04W68/02, H04W56/00, H04W68/00, H04W74/0833
CPC Code(s): H04W68/02
Abstract: a terminal apparatus includes a plurality of subscriber identity modules (sims). the terminal apparatus is configured to connect a plurality of networks using the plurality of sims. the terminal apparatus is configured to determine paging collision between the plurality of networks.
20250142852. SEMICONDUCTOR APPARATUS_simplified_abstract_(mitsubishi electric corporation)
Inventor(s): Reona FURUKAWA of Tokyo JP for mitsubishi electric corporation, Shinya SONEDA of Tokyo JP for mitsubishi electric corporation
IPC Code(s): H01L29/739, H01L23/495, H01L29/06, H01L29/861
CPC Code(s): H10D12/481
Abstract: an interconnection member has a bonded surface in contact with a bonding member. in plan view seen in a direction perpendicular to a front surface electrode, the bonded surface covers at least a portion of each of a plurality of diode regions. the plurality of diode regions include a first diode region, a second diode region, and a third diode region. in plan view, the second diode region is located in a first direction with respect to the first diode region and is spaced from the first diode region. in plan view, the third diode region is located in a second direction, which is perpendicular to the first direction, with respect to the first diode region, and is spaced from each of the first diode region and the second diode region.
Inventor(s): Asuka MATSUYAMA of Tokyo JP for mitsubishi electric corporation, Noriyuki YABUOSHI of Tokyo JP for mitsubishi electric corporation, Akie YUTANI of Tokyo JP for mitsubishi electric corporation
IPC Code(s): H01L29/43, H01L21/02, H01L21/3115, H01L23/528
CPC Code(s): H10D64/605
Abstract: provided is a semiconductor device in which deterioration of a gate insulating layer is suppressed. a semiconductor device includes a semiconductor substrate, a gate insulating film, a gate electrode, a first electric wire, and a semiconductive insulating layer. the gate insulating film is formed on the semiconductor substrate. the gate electrode is formed on the semiconductor substrate with the gate insulating film being interposed therebetween. the first electric wire is connected to the gate electrode. the semiconductive insulating layer is connected to at least one of the gate electrode and the first electric wire.
20250142974. POWER SEMICONDUCTOR DEVICE_simplified_abstract_(mitsubishi electric corporation)
Inventor(s): Yasuo ATA of Tokyo JP for mitsubishi electric corporation, Tsuyoshi OSAGA of Tokyo JP for mitsubishi electric corporation
IPC Code(s): H10D89/60, H10D64/27, H10D64/66
CPC Code(s): H10D89/611
Abstract: an object of the present disclosure is to provide a power semiconductor device in which a temperature sensing diode is built in a trench without losing its function as an active gate. a power semiconductor device includes, in an active region, a p-type base layer formed on an n-type drift layer, a plurality of n-type well regions formed in a front layer of the p-type base layer, and a polysilicon layer formed in each trench via an insulating film. the polysilicon layer formed in at least one trench includes an n-type polysilicon layer connected to an emitter terminal of a switching element, and a p-type polysilicon layer connected to a gate terminal of the switching element and enclosing a surface of the n-type polysilicon layer facing a side surface of the trench.
Mitsubishi Electric Corporation patent applications on May 1st, 2025
- Mitsubishi Electric Corporation
- B60Q1/08
- B60Q1/00
- CPC B60Q1/085
- Mitsubishi electric corporation
- B60Q9/00
- G01S13/04
- CPC B60Q9/00
- B60W30/09
- B60W30/095
- B60W50/00
- G06V20/56
- CPC B60W30/09
- B60W50/029
- B60W60/00
- CPC B60W50/029
- B60W30/18
- G08G1/01
- G08G1/056
- G08G1/0967
- G08G1/16
- H04W4/44
- CPC B60W60/001
- F24F11/88
- CPC F24F11/88
- G01N33/49
- G01N21/17
- G01N21/3577
- G01N21/41
- CPC G01N33/49
- G01S5/14
- CPC G01S5/14
- G01S7/52
- A61B8/00
- CPC G01S7/52079
- G02F1/015
- G02F1/01
- G02F1/017
- CPC G02F1/0157
- G05D1/633
- G05D1/248
- G05D1/646
- G05D105/20
- G05D109/10
- G05D111/30
- CPC G05D1/633
- G08G5/32
- G08G5/76
- CPC G08G5/32
- H01L23/367
- H01L23/46
- CPC H01L23/3677
- H01L23/00
- H01L23/36
- H01L29/739
- CPC H01L24/05
- CPC H01L24/78
- H01L23/495
- CPC H01L24/83
- H01S5/10
- H01S5/12
- CPC H01S5/1014
- H01S5/30
- H01S5/02
- H01S5/042
- H01S5/22
- H01S5/42
- CPC H01S5/3013
- H02M1/08
- H03K17/687
- CPC H02M1/08
- H02M1/12
- H02M1/14
- H02M1/44
- H02M5/458
- H02P27/06
- CPC H02M1/12
- H02M7/219
- CPC H02M7/219
- H02P23/04
- B62D5/04
- H02P5/50
- CPC H02P23/04
- H04W68/02
- H04W56/00
- H04W68/00
- H04W74/0833
- CPC H04W68/02
- H01L29/06
- H01L29/861
- CPC H10D12/481
- H01L29/43
- H01L21/02
- H01L21/3115
- H01L23/528
- CPC H10D64/605
- H10D89/60
- H10D64/27
- H10D64/66
- CPC H10D89/611