Mitsubishi electric corporation (20250140638). SEMICONDUCTOR DEVICE
SEMICONDUCTOR DEVICE
Organization Name
mitsubishi electric corporation
Inventor(s)
SEMICONDUCTOR DEVICE
This abstract first appeared for US patent application 20250140638 titled 'SEMICONDUCTOR DEVICE
Original Abstract Submitted
a semiconductor device includes a heat dissipation base member and a plurality of heat dissipation fins. the plurality of heat dissipation fins is joined to a lower surface of the heat dissipation base member. each of the plurality of heat dissipation fins includes a plurality of crest portions formed by repeatedly bending a band-shaped plate member extending in one direction. the cross-sectional shape of each of the plurality of heat dissipation fins is distorted due to a left-right asymmetric shape of each of the plurality of crest portions. the plurality of crest portions has a sparse region in which an interval between the plurality of crest portions in an extending direction of each of the plurality of heat dissipation fins is sparse and a dense region in which an interval between the plurality of crest portions in the extending direction is denser than the interval in the sparse region.