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Category:CPC H10B63/84
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Pages in category "CPC H10B63/84"
The following 46 pages are in this category, out of 46 total.
1
- 18537013. THREE-DIMENSIONAL MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)
- 18586657. MEMORY DEVICE FOR REDUCING THERMAL CROSSTALK simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18595281. MICROELECTRONIC DEVICES WITH ISOLATION TRENCHES IN UPPER PORTIONS OF TIERED STACKS, AND RELATED METHODS simplified abstract (Lodestar Licensing Group LLC)
- 18617466. ARCHITECTURE FOR MULTIDECK MEMORY ARRAYS simplified abstract (Micron Technology, Inc.)
- 18637552. 3D Stackable Memory and Methods of Manufacture simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18815624. MEMORY DEVICES INCLUDING NON-VOLATILE MEMORY CELLS, AND RELATED MICROELECTRONIC DEVICES (Micron Technology, Inc.)
- 18954089. SPLIT PILLAR ARCHITECTURES FOR MEMORY DEVICES (Micron Technology, Inc.)
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- Micron technology, inc. (20240237360). ARCHITECTURE FOR MULTIDECK MEMORY ARRAYS simplified abstract
- Micron technology, inc. (20240268127). CROSS POINT ARRAY ARCHITECTURE FOR MULTIPLE DECKS simplified abstract
- Micron technology, inc. (20240422993). MEMORY DEVICES INCLUDING NON-VOLATILE MEMORY CELLS, AND RELATED MICROELECTRONIC DEVICES
- Micron technology, inc. (20250107105). SPLIT PILLAR ARCHITECTURES FOR MEMORY DEVICES
- Micron Technology, Inc. Patent Application Trends in 2024
- MICRON TECHNOLOGY, INC. Patent Application Trends in 2025
- Micron Technology, Inc. patent applications on August 8th, 2024
- Micron Technology, Inc. patent applications on December 19th, 2024
- Micron Technology, Inc. patent applications on February 6th, 2025
- Micron Technology, Inc. patent applications on January 23rd, 2025
- Micron Technology, Inc. patent applications on July 11th, 2024
- Micron Technology, Inc. patent applications on March 27th, 2025
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- SAMSUNG ELECTRONICS CO., LTD Patent Application Trends in 2024
- Samsung electronics co., ltd. (20250008747). THREE-DIMENSIONAL MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Samsung Electronics Co., Ltd. Patent Application Trends in 2024
- SAMSUNG ELECTRONICS CO., LTD. Patent Application Trends in 2024
- Samsung electronics Co., Ltd. Patent Application Trends in 2024
- Samsung electronics CO., LTD. Patent Application Trends in 2025
- Samsung Electronics Co., Ltd. patent applications on January 2nd, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on January 2nd, 2025
- SK hynix Inc. Patent Application Trends in 2025
- SK hynix Inc. patent applications on February 6th, 2025
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- Taiwan Semiconductor Manufacturing Co., Ltd Patent Application Trends in 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. Patent Application Trends in 2024
- Taiwan Semiconductor Manufacturing Company Limited Patent Application Trends in 2024
- Taiwan Semiconductor Manufacturing Company Patent Application Trends in 2025
- Taiwan semiconductor manufacturing company, ltd. (20240244850). MEMORY DEVICE FOR REDUCING THERMAL CROSSTALK simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240268128). 3D Stackable Memory and Methods of Manufacture simplified abstract
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. Patent Application Trends in 2025
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on August 8th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on July 18th, 2024