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Category:CPC H01L27/14618
Pages in category "CPC H01L27/14618"
The following 54 pages are in this category, out of 54 total.
1
- 18179744. OPTICAL SENSOR PACKAGE simplified abstract (SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC)
- 18235593. IMAGE SENSOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18554244. SEMICONDUCTOR DEVICE simplified abstract (SONY SEMICONDUCTOR SOLUTIONS CORPORATION)
- 18588312. RADIATION DETECTOR, RADIATION IMAGING SYSTEM, AND METHOD FOR MANUFACTURING RADIATION DETECTOR simplified abstract (CANON KABUSHIKI KAISHA)
- 18625541. ELECTRONIC COMPONENT AND EQUIPMENT simplified abstract (CANON KABUSHIKI KAISHA)
- 18651840. IMAGE SENSOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18665958. SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS TO CURB DETERIORIATION OF PICTURE QUALITY simplified abstract (SONY SEMICONDUCTOR SOLUTIONS CORPORATION)
- 18748228. SEMICONDUCTOR PACKAGE WITH PROTECTIVE MOLD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
A
- Adeia Semiconductor Bonding Technologies Inc. Patent Application Trends in 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. Patent Application Trends in 2024
- Adeia Semiconductor Solutions LLC Patent Application Trends in 2024
- Advanced Semiconductor Engineering, Inc. Patent Application Trends in 2025
C
- Canon kabushiki kaisha (20240313015). RADIATION DETECTOR, RADIATION IMAGING SYSTEM, AND METHOD FOR MANUFACTURING RADIATION DETECTOR simplified abstract
- Canon kabushiki kaisha (20240347565). ELECTRONIC COMPONENT AND EQUIPMENT simplified abstract
- CANON KABUSHIKI KAISHA Patent Application Trends in 2025
- Canon Kabushiki Kaisha Patent Application Trends in 2025
- CANON KABUSHIKI KAISHA patent applications on October 17th, 2024
- CANON KABUSHIKI KAISHA patent applications on September 19th, 2024
K
M
P
S
- SAMSUNG ELECTRONICS CO., LTD Patent Application Trends in 2024
- Samsung electronics co., ltd. (20240250100). IMAGE SENSOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240282790). IMAGE SENSOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240339468). SEMICONDUCTOR PACKAGE WITH PROTECTIVE MOLD simplified abstract
- Samsung Electronics Co., Ltd. Patent Application Trends in 2024
- SAMSUNG ELECTRONICS CO., LTD. Patent Application Trends in 2024
- Samsung electronics Co., Ltd. Patent Application Trends in 2024
- Samsung electronics CO., LTD. Patent Application Trends in 2025
- Samsung Electronics Co., Ltd. patent applications on August 22nd, 2024
- Samsung Electronics Co., Ltd. patent applications on July 25th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on July 25th, 2024
- Samsung Electronics Co., Ltd. patent applications on October 10th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on October 10th, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC Patent Application Trends in 2024
- SEMICONDUCTOR ENERGY LABORATORY CO., LTD. Patent Application Trends in 2025
- Semiconductor Energy Laboratory Co., Ltd. Patent Application Trends in 2025
- SONY GROUP CORPORATION Patent Application Trends in 2024
- Sony semiconductor solutions corporation (20250006755). SEMICONDUCTOR DEVICE AND ELECTRONIC EQUIPMENT
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION Patent Application Trends in 2025
- Sony Semiconductor Solutions Corporation Patent Application Trends in 2025
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION patent applications on January 2nd, 2025