There is currently no text in this page. You can search for this page title in other pages, or search the related logs, but you do not have permission to create this page.
Category:CPC H01L24/32
Jump to navigation
Jump to search
Pages in category "CPC H01L24/32"
The following 165 pages are in this category, out of 165 total.
1
- 18090922. SEMICONDUCTOR PACKAGE FOR STRESS ISOLATION simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18123838. BARRIER DISPENSING COMBINED WITH NON-CONDUCTIVE PASTE TO ENABLE PACKAGES WITH RESTRICTED UNDERFILL AREAS simplified abstract (Intel Corporation)
- 18277443. POWER MODULE, ELECTRICAL DEVICE AND METHOD FOR PRODUCING A POWER MODULE simplified abstract (Siemens Aktiengesellschaft)
- 18301367. THERMAL SOLUTIONS FOR ADVANCED SEMICONDUCTORS simplified abstract (International Business Machines Corporation)
- 18464704. SEMICONDUCTOR DEVICE simplified abstract (Kabushiki Kaisha Toshiba)
- 18464704. SEMICONDUCTOR DEVICE simplified abstract (Toshiba Electronic Devices & Storage Corporation)
- 18469014. THERMAL DISSIPATION IN SEMICONDUCTOR DEVICES (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18601216. ELECTRONIC DEVICE simplified abstract (STMicroelectronics International N.V.)
- 18640576. SEMICONDUCTOR PACKAGE COMPRISING DAM AND MULTI-LAYERED UNDER-FILL LAYER (SAMSUNG ELECTRONICS CO., LTD.)
- 18654268. Structure and Method of Forming a Joint Assembly simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18659400. SEMICONDUCTOR PACKAGE INCLUDING NON-CONDUCTIVE FILM AND METHOD FOR FORMING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18729395. SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE (Mitsubishi Electric Corporation)
- 18970353. SEMICONDUCTOR PACKAGE INCLUDING RESIN, AND ELECTRONIC DEVICE INCLUDING SAME (SAMSUNG ELECTRONICS CO., LTD.)
A
- Adeia Semiconductor Bonding Technologies Inc. Patent Application Trends in 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. Patent Application Trends in 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. Patent Application Trends in 2025
- Advanced micro devices Patent Application Trends in 2024
- Advanced Semiconductor Engineering, Inc. Patent Application Trends in 2025
- ALIBABA GROUP HOLDING LIMITED Patent Application Trends in 2024
- Ams-OSRAM International GmbH Patent Application Trends in 2025
- Apple Patent Application Trends in 2024
- AUO Corporation Patent Application Trends in 2025
C
D
H
- HONEYWELL INTERNATIONAL INC. Patent Application Trends in 2024
- Honeywell International Inc. Patent Application Trends in 2024
- HUAWEI DIGITAL POWER TECHNOLOGIES CO., LTD. Patent Application Trends in 2025
- Hyundai Motor Company Patent Application Trends in 2024
- HYUNDAI MOTOR COMPANY Patent Application Trends in 2025
I
- Industrial Technology Research Institute Patent Application Trends in 2024
- INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE Patent Application Trends in 2024
- Industrial Technology Research Institute Patent Application Trends in 2025
- Innolux Corporation Patent Application Trends in 2024
- Intel corporation (20240321807). BARRIER DISPENSING COMBINED WITH NON-CONDUCTIVE PASTE TO ENABLE PACKAGES WITH RESTRICTED UNDERFILL AREAS simplified abstract
- INTEL CORPORATION Patent Application Trends in 2025
- Intel Corporation Patent Application Trends in 2025
- Intel Corporation patent applications on September 26th, 2024
- International business machines corporation (20240347497). THERMAL SOLUTIONS FOR ADVANCED SEMICONDUCTORS simplified abstract
- International Business Machines Corporation Patent Application Trends in 2025
- International Business Machines Corporation patent applications on October 17th, 2024
K
- Kabushiki kaisha toshiba (20240321808). SEMICONDUCTOR DEVICE simplified abstract
- KABUSHIKI KAISHA TOSHIBA Patent Application Trends in 2024
- Kabushiki Kaisha Toshiba Patent Application Trends in 2025
- Kabushiki Kaisha Toshiba patent applications on September 26th, 2024
- Kioxia Corporation Patent Application Trends in 2024
- KYOCERA CORPORATION Patent Application Trends in 2024
L
- LENOVO (SINGAPORE) PTE. LTD. Patent Application Trends in 2024
- LG Display Co., Ltd Patent Application Trends in 2024
- LG Electronics Inc. Patent Application Trends in 2024
- LG INNOTEK CO., LTD. Patent Application Trends in 2024
- Littelfuse Semiconductor (Wuxi) Co., Ltd. Patent Application Trends in 2024
- Lockheed Martin Corporation Patent Application Trends in 2024
M
- MEDIATEK Inc. Patent Application Trends in 2024
- MEDIATEK INC. Patent Application Trends in 2024
- MediaTek Singapore Pte. Ltd. Patent Application Trends in 2024
- Micron Technology, Inc. Patent Application Trends in 2024
- MICRON TECHNOLOGY, INC. Patent Application Trends in 2025
- Micron Technology, Inc. patent applications on February 13th, 2025
- Micron Technology, Inc. patent applications on February 20th, 2025
- Mitsubishi electric corporation (20250105197). SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Mitsubishi Electric Corporation Patent Application Trends in 2024
- MITSUBISHI ELECTRIC CORPORATION Patent Application Trends in 2024
- Mitsubishi Electric Corporation patent applications on March 27th, 2025
N
- Nuvoton Technology Corporation Japan Patent Application Trends in 2025
- NUVOTON TECHNOLOGY CORPORATION Patent Application Trends in 2025
- NVIDIA Corporation Patent Application Trends in 2024
- NVIDIA Corporation Patent Application Trends in 2025
- Nvidia Patent Application Trends in 2024
- NXP B.V. Patent Application Trends in 2024
- NXP USA, Inc. Patent Application Trends in 2024
- NXP USA, INC. Patent Application Trends in 2025
- NXP USA, Inc. Patent Application Trends in 2025
P
- Panasonic Intellectual Property Management Co., Ltd. Patent Application Trends in 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. Patent Application Trends in 2024
- Panasonic Intellectual Property Management Co., Ltd. Patent Application Trends in 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. Patent Application Trends in 2025
- PixArt Imaging Inc. Patent Application Trends in 2024
Q
R
S
- SAFRAN Patent Application Trends in 2024
- Samsung Display Co., LTD Patent Application Trends in 2024
- SAMSUNG DISPLAY CO., LTD. Patent Application Trends in 2024
- Samsung Display Co., Ltd. Patent Application Trends in 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD. Patent Application Trends in 2024
- Samsung Electro-Mechanics Co., Ltd. Patent Application Trends in 2025
- SAMSUNG ELECTRONICS CO., LTD Patent Application Trends in 2024
- Samsung electronics co., ltd. (20240297141). SEMICONDUCTOR PACKAGE INCLUDING NON-CONDUCTIVE FILM AND METHOD FOR FORMING THE SAME simplified abstract
- Samsung electronics co., ltd. (20250062268). SEMICONDUCTOR PACKAGES HAVING TRENCH STRUCTURES
- Samsung electronics co., ltd. (20250070072). SEMICONDUCTOR PACKAGE COMPRISING DAM AND MULTI-LAYERED UNDER-FILL LAYER
- Samsung electronics co., ltd. (20250096186). SEMICONDUCTOR PACKAGE INCLUDING RESIN, AND ELECTRONIC DEVICE INCLUDING SAME
- Samsung Electronics Co., Ltd. Patent Application Trends in 2024
- SAMSUNG ELECTRONICS CO., LTD. Patent Application Trends in 2024
- Samsung electronics Co., Ltd. Patent Application Trends in 2024
- Samsung electronics CO., LTD. Patent Application Trends in 2025
- Samsung Electronics Co., Ltd. patent applications on February 20th, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on February 20th, 2025
- Samsung Electronics Co., Ltd. patent applications on February 27th, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on February 27th, 2025
- Samsung Electronics Co., Ltd. patent applications on February 6th, 2025
- Samsung Electronics Co., Ltd. patent applications on March 20th, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on March 20th, 2025
- Samsung Electronics Co., Ltd. patent applications on September 5th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on September 5th, 2024
- SAMSUNG ELECTRONICS CO.,LTD. Patent Application Trends in 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC Patent Application Trends in 2024
- Semiconductor Manufacturing International (Shanghai) Corporation Patent Application Trends in 2025
- SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD Patent Application Trends in 2024
- SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. Patent Application Trends in 2024
- Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Patent Application Trends in 2024
- SHENZHEN STS MICROELECTRONICS CO., LTD. Patent Application Trends in 2024
- SILICONWARE PRECISION INDUSTRIES CO., LTD. Patent Application Trends in 2024
- SK hynix Inc. Patent Application Trends in 2025
- Skyworks Solutions, Inc. Patent Application Trends in 2025
- SONY GROUP CORPORATION Patent Application Trends in 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION Patent Application Trends in 2025
- Sony Semiconductor Solutions Corporation Patent Application Trends in 2025
- STMicroelectronics International N.V. Patent Application Trends in 2024
- STMicroelectronics International N.V. Patent Application Trends in 2025
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC. Patent Application Trends in 2025
- Sumitomo Electric Industries, Ltd. Patent Application Trends in 2025
T
- Taiwan Semiconductor Manufacturing Co., Ltd Patent Application Trends in 2024
- Taiwan semiconductor manufacturing co., ltd. (20250096185). THERMAL DISSIPATION IN SEMICONDUCTOR DEVICES
- Taiwan Semiconductor Manufacturing Co., Ltd. Patent Application Trends in 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. Patent Application Trends in 2025
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on March 20th, 2025
- Taiwan Semiconductor Manufacturing Company Limited Patent Application Trends in 2024
- Taiwan semiconductor manufacturing company, ltd. (20240282743). Structure and Method of Forming a Joint Assembly simplified abstract
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. Patent Application Trends in 2025
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on August 22nd, 2024
- TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. Patent Application Trends in 2024
- Tesla Patent Application Trends in 2024
- Tesla, Inc. Patent Application Trends in 2025
- TOKYO ELECTRON LIMITED Patent Application Trends in 2024
- Tokyo Electron Limited Patent Application Trends in 2024
- TOKYO ELECTRON LIMITED Patent Application Trends in 2025
- Tokyo Electron Limited Patent Application Trends in 2025
- TONG HSING ELECTRONIC INDUSTRIES, LTD. Patent Application Trends in 2024
- TOPPAN Holdings Inc. Patent Application Trends in 2024
- TOPPAN Holdings Inc. Patent Application Trends in 2025