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Category:CPC H01L23/66
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Pages in category "CPC H01L23/66"
The following 99 pages are in this category, out of 99 total.
1
- 18146886. SYSTEM, ELECTRONIC DEVICE AND PACKAGE WITH VERTICAL TO HORIZONTAL SUBSTRATE INTEGRATED WAVEGUIDE TRANSITION AND HORIZONTAL GROUNDED COPLANAR WAVEGUIDE TRANSITION simplified abstract (Texas Instruments Incorporated)
- 18149026. Interposers with Millimeter-Wave Transitions simplified abstract (NXP B.V.)
- 18215480. MICROSTRIP ROUTING ON EMBEDDED HIGH-K DIELECTRIC (Intel Corporation)
- 18218756. POWER MODULE simplified abstract (HYUNDAI MOTOR COMPANY)
- 18218756. POWER MODULE simplified abstract (KIA CORPORATION)
- 18284861. PRINTED CIRCUIT BOARD simplified abstract (Mitsubishi Electric Corporation)
- 18341916. AMPLIFIER AND MIXER IN A III-V MATERIAL FOR WIDEBAND SUB-TERAHERTZ COMMUNICATION (Intel Corporation)
- 18342112. Integrated Waveguides for Semiconductor Technology (Intel Corporation)
- 18349024. SEMICONDUCTOR PACKAGE simplified abstract (ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE)
- 18391914. SEMICONDUCTOR DEVICE AND POWER AMPLIFIER INCLUDING THE SAME simplified abstract (Samsung Electro-Mechanics Co., Ltd.)
- 18430568. INTEGRATED FAN-OUT PACKAGE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18433228. METHODS RELATED TO DUAL-SIDED MODULE WITH LAND-GRID ARRAY (LGA) FOOTPRINT simplified abstract (SKYWORKS SOLUTIONS, INC.)
- 18444742. PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18466351. DEVICE PACKAGES WITH INTEGRATED MILLIMETER-WAVE REFLECTOR CAVITIES (NXP USA, Inc.)
- 18566330. POWER AMPLIFIER simplified abstract (Mitsubishi Electric Corporation)
- 18595729. POWER AMPLIFICATION HIGH-FREQUENCY CIRCUIT DEVICE simplified abstract (Mitsubishi Electric Corporation)
- 18664508. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18706307. MOUNTING STRUCTURE (NIPPON TELEGRAPH AND TELEPHONE CORPORATION)
- 18734746. CAPACITOR DIE EMBEDDED IN PACKAGE SUBSTRATE FOR PROVIDING CAPACITANCE TO SURFACE MOUNTED DIE simplified abstract (Intel Corporation)
- 18735151. PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18784674. ELECTRONIC DEVICE (STMicroelectronics International N.V.)
- 18818540. CHIP, CHIP PREPARATION METHOD, RADIO FREQUENCY POWER AMPLIFIER, AND TERMINAL (Huawei Technologies Co., Ltd.)
- 18887369. IC CHIP, RADIO FREQUENCY MODULE, AND COMMUNICATION DEVICE (Murata Manufacturing Co., Ltd.)
- 18950589. WAVEGUIDE LAUNCHER IN PACKAGE BASED ON HIGH DIELECTRIC CONSTANT CARRIER (NXP USA, Inc.)
- 18966416. RADIO-FREQUENCY MODULE AND COMMUNICATION DEVICE (Murata Manufacturing Co., Ltd.)
- 18969430. Antenna Apparatus and Method (Taiwan Semiconductor Manufacturing Co., Ltd.)
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- Intel corporation (20240321785). CAPACITOR DIE EMBEDDED IN PACKAGE SUBSTRATE FOR PROVIDING CAPACITANCE TO SURFACE MOUNTED DIE simplified abstract
- Intel corporation (20250006666). MICROSTRIP ROUTING ON EMBEDDED HIGH-K DIELECTRIC
- Intel corporation (20250006667). AMPLIFIER AND MIXER IN A III-V MATERIAL FOR WIDEBAND SUB-TERAHERTZ COMMUNICATION
- Intel Corporation (20250006667). AMPLIFIER AND MIXER IN A III-V MATERIAL FOR WIDEBAND SUB-TERAHERTZ COMMUNICATION
- Intel corporation (20250006668). Integrated Waveguides for Semiconductor Technology
- INTEL CORPORATION Patent Application Trends in 2025
- Intel Corporation patent applications on January 2nd, 2025
- Intel Corporation patent applications on September 26th, 2024
- International Business Machines Corporation Patent Application Trends in 2025
- International Business Machines Corporation patent applications on March 6th, 2025
M
- MEDIATEK Inc. Patent Application Trends in 2024
- MEDIATEK INC. Patent Application Trends in 2024
- Micron Technology, Inc. Patent Application Trends in 2024
- Mitsubishi electric corporation (20240282725). POWER AMPLIFIER simplified abstract
- Mitsubishi Electric Corporation Patent Application Trends in 2024
- MITSUBISHI ELECTRIC CORPORATION Patent Application Trends in 2024
- Mitsubishi Electric Corporation patent applications on August 22nd, 2024
- Murata manufacturing co., ltd. (20250015020). IC CHIP, RADIO FREQUENCY MODULE, AND COMMUNICATION DEVICE
- Murata Manufacturing Co., Ltd. patent applications on January 9th, 2025
N
- Nippon telegraph and telephone corporation (20240421107). MOUNTING STRUCTURE
- NIPPON TELEGRAPH AND TELEPHONE CORPORATION patent applications on December 19th, 2024
- Nuvoton Technology Corporation Japan Patent Application Trends in 2025
- NUVOTON TECHNOLOGY CORPORATION Patent Application Trends in 2025
- NXP B.V. Patent Application Trends in 2024
- NXP USA, Inc. Patent Application Trends in 2024
- NXP USA, INC. Patent Application Trends in 2025
- NXP USA, Inc. Patent Application Trends in 2025
Q
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- Samsung electronics Co., Ltd. Patent Application Trends in 2024
- Samsung electronics CO., LTD. Patent Application Trends in 2025
- Samsung Electronics Co., Ltd. patent applications on February 6th, 2025
- SKYWORKS SOLUTIONS, INC. Patent Application Trends in 2024
- Skyworks Solutions, Inc. Patent Application Trends in 2025
- STMicroelectronics International N.V. Patent Application Trends in 2025
T
- Taiwan Semiconductor Manufacturing Co., Ltd Patent Application Trends in 2024
- Taiwan semiconductor manufacturing co., ltd. (20240194619). PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20250096167). Antenna Apparatus and Method
- Taiwan Semiconductor Manufacturing Co., Ltd. Patent Application Trends in 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. Patent Application Trends in 2025
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on June 13th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on March 20th, 2025
- Taiwan semiconductor manufacturing company, ltd. (20240213186). INTEGRATED FAN-OUT PACKAGE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240304572). SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240321786). PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379592). Transmission Line Structures for Three-Dimensional Integrated Circuit and the Methods Thereof simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20250006669). PACKAGE STRUCTURE WITH TRANSMISSION LINE AND METHOD FOR MANUFACTURING THE SAME
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. Patent Application Trends in 2025
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on January 2nd, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on June 27th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on November 14th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on September 12th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on September 26th, 2024
- Technische Universiteit Delft Patent Application Trends in 2024
