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Category:CPC H01L23/585
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Pages in category "CPC H01L23/585"
The following 76 pages are in this category, out of 76 total.
1
- 18173039. PACKAGE STRUCTURE, PACKAGE-ON-PACKAGE STRUCTURE, AND MANUFACTURING METHOD OF INTEGRATED FAN-OUT PACKAGE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18216923. DOUBLE-SIDED INTEGRATED CIRCUIT WITH ELECTROSTATIC GUARD RING (International Business Machines Corporation)
- 18217008. THREE DIMENSIONAL MECHANICALLY BOLTING STAPLE FILL (International Business Machines Corporation)
- 18416410. SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18424871. SEMICONDUCTOR CHIP INCLUDING CHIP GUARD STRUCTURE AND UPPER GUARD LINE DISPOSED SPACED APART FROM EACH OTHER (SK hynix Inc.)
- 18458122. INTERCONNECTION MEMBER AND METHOD OF MANUFACTURING THE SAME simplified abstract (Kabushiki Kaisha Toshiba)
- 18458122. INTERCONNECTION MEMBER AND METHOD OF MANUFACTURING THE SAME simplified abstract (Toshiba Electronic Devices & Storage Corporation)
- 18482663. SEMICONDUCTOR DEVICE HAVING DIE RING CONDUCTOR simplified abstract (Micron Technology, Inc.)
- 18514054. SEMICONDUCTOR DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18615303. METHOD OF MAKING ELECTROSTATIC DISCHARGE PROTECTION CELL AND ANTENNA INTEGRATED WITH THROUGH SILICON VIA simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18663878. DUMMY STACKED STRUCTURES SURROUNDING TSVS AND METHOD FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18732662. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18945109. METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES (Intel Corporation)
I
- Intel corporation (20250070056). METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES
- INTEL CORPORATION Patent Application Trends in 2025
- Intel Corporation Patent Application Trends in 2025
- Intel Corporation patent applications on February 27th, 2025
- International business machines corporation (20250006663). DOUBLE-SIDED INTEGRATED CIRCUIT WITH ELECTROSTATIC GUARD RING
- International business machines corporation (20250006664). THREE DIMENSIONAL MECHANICALLY BOLTING STAPLE FILL
- International Business Machines Corporation Patent Application Trends in 2025
- International Business Machines Corporation patent applications on January 2nd, 2025
K
- Kabushiki kaisha toshiba (20240321779). INTERCONNECTION MEMBER AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Kabushiki Kaisha Toshiba Patent Application Trends in 2025
- Kabushiki Kaisha Toshiba patent applications on September 26th, 2024
- KIOXIA CORPORATION Patent Application Trends in 2025
M
S
- SAMSUNG ELECTRONICS CO., LTD Patent Application Trends in 2024
- Samsung electronics co., ltd. (20240194616). SEMICONDUCTOR DEVICE simplified abstract
- Samsung electronics co., ltd. (20250062252). SEMICONDUCTOR PACKAGE
- Samsung Electronics Co., Ltd. Patent Application Trends in 2024
- SAMSUNG ELECTRONICS CO., LTD. Patent Application Trends in 2024
- Samsung electronics Co., Ltd. Patent Application Trends in 2024
- Samsung electronics CO., LTD. Patent Application Trends in 2025
- Samsung Electronics Co., Ltd. patent applications on February 20th, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on February 20th, 2025
- Samsung Electronics Co., Ltd. patent applications on January 30th, 2025
- Samsung Electronics Co., Ltd. patent applications on June 13th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on June 13th, 2024
- SILICONWARE PRECISION INDUSTRIES CO., LTD. Patent Application Trends in 2024
- SK hynix Inc. Patent Application Trends in 2025
T
- Taiwan Semiconductor Manufacturing Co., Ltd Patent Application Trends in 2024
- Taiwan semiconductor manufacturing co., ltd. (20250105174). SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE
- Taiwan Semiconductor Manufacturing Co., Ltd. Patent Application Trends in 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. Patent Application Trends in 2025
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on March 27th, 2025
- Taiwan Semiconductor Manufacturing Company Limited Patent Application Trends in 2024
- Taiwan semiconductor manufacturing company, ltd. (20240234347). METHOD OF MAKING ELECTROSTATIC DISCHARGE PROTECTION CELL AND ANTENNA INTEGRATED WITH THROUGH SILICON VIA simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240282721). PACKAGE STRUCTURE, PACKAGE-ON-PACKAGE STRUCTURE, AND MANUFACTURING METHOD OF INTEGRATED FAN-OUT PACKAGE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240304571). DUMMY STACKED STRUCTURES SURROUNDING TSVS AND METHOD FORMING THE SAME simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240321780). SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379584). SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379586). GUARD RING AND MANUFACTURING METHOD THEREOF simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379587). SEAL RING REINFORCEMENT simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379588). GUARD RING STRUCTURE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240413101). SEAL RINGS IN INTEGRATED CIRCUIT PACKAGE AND METHOD
- Taiwan semiconductor manufacturing company, ltd. (20240413102). FORMING SHALLOW TRENCH FOR DICING AND STRUCTURES THEREOF
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. Patent Application Trends in 2025
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on August 22nd, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on December 12th, 2024
- Taiwan Semiconductor Manufacturing Company, LTD. patent applications on February 13th, 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on July 11th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on November 14th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on September 12th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on September 26th, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD. Patent Application Trends in 2025
