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Category:CPC H01L23/5386
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Pages in category "CPC H01L23/5386"
The following 136 pages are in this category, out of 136 total.
1
- 18026083. WIRING SUBSTRATE AND ELECTRONIC DEVICE simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.)
- 18028340. WIRING SUBSTRATE AND ELECTRONIC DEVICE simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.)
- 18091150. ZERO MISALIGNED PAD AND VIA METALLIZATION STRUCTURES IN GLASS PACKAGE SUBSTRATES simplified abstract (Intel Corporation)
- 18120910. INTERPOSER SOLUTION FOR HIGH CORE COUNT COMPUTE PLATFORMS simplified abstract (Intel Corporation)
- 18130584. EMBEDDED INTERCONNECT BRIDGE WITH INDUCTOR FOR POWER DELIVERY simplified abstract (Intel Corporation)
- 18147487. METHODS AND APPARATUS TO PREVENT OVER-ETCH IN SEMICONDUCTOR PACKAGES simplified abstract (Intel Corporation)
- 18173027. PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18189299. DEFORMATION-RESISTANT INTERPOSER FOR A LOCAL SILICON INTERCONNECT AND METHODS FOR FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company Limited)
- 18218589. SUBSTRATE-FREE SEMICONDUCTOR DEVICE ASSEMBLIES WITH MULTIPLE SEMICONDUCTOR DEVICES AND METHODS FOR MAKING THE SAME (Micron Technology, Inc.)
- 18228278. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18337040. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18344900. PACKAGE STRUCTURE INCLUDING LOWER MOLDED STRUCTURE INCLUDING A SUBSTRATE PORTION, AND METHODS OF FORMING THE PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company Limited)
- 18374310. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18440297. PHOTONICS INTEGRATED CIRCUIT PACKAGE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18455368. INTEGRATED DEVICE WITH EMBEDDED INTERCONNECT STRUCTURE (QUALCOMM Incorporated)
- 18520743. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract (DENSO CORPORATION)
- 18520743. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract (TOYOTA JIDOSHA KABUSHIKI KAISHA)
- 18592829. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18646110. SEMICONDUCTOR MODULE (FUJI ELECTRIC CO., LTD.)
- 18653619. POWER MODULE, POWER CONVERSION DEVICE, AND VEHICLE simplified abstract (Huawei Digital Power Technologies Co., Ltd.)
- 18663089. SEMICONDUCTOR PACKAGE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18677075. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18678813. HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD simplified abstract (Intel Corporation)
- 18780899. ELECTRONIC DEVICE (InnoLux Corporation)
- 18947350. RADIO FREQUENCY MODULE (Murata Manufacturing Co., Ltd.)
A
- Adeia Semiconductor Bonding Technologies Inc. Patent Application Trends in 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. Patent Application Trends in 2024
- Advanced micro devices Patent Application Trends in 2024
- Advantest Corporation Patent Application Trends in 2025
- Apple Patent Application Trends in 2024
I
- Innolux Corporation Patent Application Trends in 2024
- Intel corporation (20240222282). ZERO MISALIGNED PAD AND VIA METALLIZATION STRUCTURES IN GLASS PACKAGE SUBSTRATES simplified abstract
- Intel corporation (20240222283). METHODS AND APPARATUS TO PREVENT OVER-ETCH IN SEMICONDUCTOR PACKAGES simplified abstract
- Intel corporation (20240312919). INTERPOSER SOLUTION FOR HIGH CORE COUNT COMPUTE PLATFORMS simplified abstract
- Intel corporation (20240321762). HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD simplified abstract
- Intel corporation (20240339412). EMBEDDED INTERCONNECT BRIDGE WITH INDUCTOR FOR POWER DELIVERY simplified abstract
- Intel corporation (20240355751). SELECTIVE UNDERCUT FOR GLASS CORE SUBSTRATE BRIDGE FIRST LEVEL INTERCONNECT (FLI) BUMP PLATING simplified abstract
- Intel corporation (20240355752). GLASS PACKAGE SUBSTRATE WITH CHIP DISAGGREGATION INTERFACE simplified abstract
- INTEL CORPORATION Patent Application Trends in 2025
- Intel Corporation patent applications on July 4th, 2024
- Intel Corporation patent applications on October 10th, 2024
- Intel Corporation patent applications on October 24th, 2024
- Intel Corporation patent applications on September 19th, 2024
- Intel Corporation patent applications on September 26th, 2024
L
M
- MEDIATEK Inc. Patent Application Trends in 2024
- MEDIATEK INC. Patent Application Trends in 2024
- Micron technology, inc. (20240258243). STACKED DIE MODULES FOR SEMICONDUCTOR DEVICE ASSEMBLIES AND METHODS OF MANUFACTURING STACKED DIE MODULES simplified abstract
- Micron technology, inc. (20250015006). SUBSTRATE-FREE SEMICONDUCTOR DEVICE ASSEMBLIES WITH MULTIPLE SEMICONDUCTOR DEVICES AND METHODS FOR MAKING THE SAME
- Micron Technology, Inc. Patent Application Trends in 2024
- Micron Technology, Inc. patent applications on August 1st, 2024
- Micron Technology, Inc. patent applications on January 9th, 2025
- Microsoft Technology Licensing, LLC Patent Application Trends in 2024
- Microsoft Technology Licensing, LLC Patent Application Trends in 2025
- Microsoft Technology Licensing, LLC patent applications on January 30th, 2025
- Mitsubishi electric corporation (20240243071). SEMICONDUCTOR DEVICE simplified abstract
- Mitsubishi Electric Corporation Patent Application Trends in 2024
- MITSUBISHI ELECTRIC CORPORATION Patent Application Trends in 2024
- Mitsubishi Electric Corporation patent applications on July 18th, 2024
- Murata manufacturing co., ltd. (20250070037). RADIO FREQUENCY MODULE
- Murata Manufacturing Co., Ltd. patent applications on February 27th, 2025
Q
- Qualcomm incorporated (20250070034). INTEGRATED DEVICE WITH EMBEDDED INTERCONNECT STRUCTURE
- Qualcomm Incorporated Patent Application Trends in 2024
- QUALCOMM INCORPORATED Patent Application Trends in 2024
- Qualcomm Incorporated Patent Application Trends in 2025
- QUALCOMM Incorporated patent applications on February 27th, 2025
R
S
- Samsung Electro-Mechanics Co., Ltd. Patent Application Trends in 2025
- SAMSUNG ELECTRONICS CO., LTD Patent Application Trends in 2024
- Samsung electronics co., ltd. (20240222284). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240258242). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240297122). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240312920). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240312923). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240379575). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240429174). SEMICONDUCTOR PACKAGE
- Samsung electronics co., ltd. (20250022806). SEMICONDUCTOR PACKAGE
- Samsung electronics co., ltd. (20250062238). SEMICONDUCTOR PACKAGE AND INTEGRATED CIRCUIT DEVICE
- Samsung electronics co., ltd. (20250062239). SIGNAL CHANNEL, MODULE SUBSTRATE, AND SEMICONDUCTOR SYSTEM INCLUDING THE SAME
- Samsung electronics co., ltd. (20250062240). SEMICONDUCTOR PACKAGE WITH IMPROVED STRUCTURAL STABILITY
- Samsung electronics co., ltd. (20250062241). SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF SEMICONDUCTOR CHIPS
- Samsung Electronics Co., Ltd. Patent Application Trends in 2024
- SAMSUNG ELECTRONICS CO., LTD. Patent Application Trends in 2024
- Samsung electronics Co., Ltd. Patent Application Trends in 2024
- Samsung electronics CO., LTD. Patent Application Trends in 2025
- Samsung Electronics Co., Ltd. patent applications on August 1st, 2024
- Samsung Electronics Co., Ltd. patent applications on December 26th, 2024
- Samsung Electronics Co., Ltd. patent applications on February 13th, 2025
- Samsung Electronics Co., Ltd. patent applications on February 20th, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on February 20th, 2025
- Samsung Electronics Co., Ltd. patent applications on February 6th, 2025
- Samsung Electronics Co., Ltd. patent applications on January 16th, 2025
- Samsung Electronics Co., Ltd. patent applications on January 30th, 2025
- Samsung Electronics Co., Ltd. patent applications on July 4th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on July 4th, 2024
- Samsung Electronics Co., Ltd. patent applications on November 14th, 2024
- Samsung Electronics Co., Ltd. patent applications on September 19th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on September 19th, 2024
- Samsung Electronics Co., Ltd. patent applications on September 5th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on September 5th, 2024
- SAMSUNG ELECTRONICS CO.,LTD Patent Application Trends in 2024
- SAMSUNG ELECTRONICS CO.,LTD. Patent Application Trends in 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC Patent Application Trends in 2024
- SILICONWARE PRECISION INDUSTRIES CO., LTD. Patent Application Trends in 2024
- SK hynix Inc. patent applications on January 30th, 2025
- Sumitomo electric industries, ltd. (20240413090). SEMICONDUCTOR DEVICE
- SUMITOMO ELECTRIC INDUSTRIES, LTD. Patent Application Trends in 2024
- Sumitomo Electric Industries, Ltd. Patent Application Trends in 2024
- SUMITOMO ELECTRIC INDUSTRIES, LTD. patent applications on December 12th, 2024
T
- Taiwan Semiconductor Manufacturing Co., Ltd Patent Application Trends in 2024
- Taiwan semiconductor manufacturing co., ltd. (20240421095). SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Taiwan Semiconductor Manufacturing Co., Ltd. Patent Application Trends in 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on December 19th, 2024
- Taiwan semiconductor manufacturing company, ltd. (20240266296). PHOTONICS INTEGRATED CIRCUIT PACKAGE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240282713). PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240304561). SEMICONDUCTOR PACKAGE simplified abstract
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2025
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on August 22nd, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on August 8th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on March 6th, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on September 12th, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD. Patent Application Trends in 2024
