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Category:CPC H01L23/5383
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Pages in category "CPC H01L23/5383"
The following 90 pages are in this category, out of 90 total.
1
- 18239846. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18419469. WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)
- 18430066. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18473479. INTEGRATED CIRCUIT PACKAGES INCLUDING A SUBSTRATE COUPLED TO A GLASS CORE BY INTERCONNECTS (Intel Corporation)
- 18479820. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18506739. INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18592911. INTERCONNECTION STRUCTURE FOR MULT-CHIP INTERPOSER AND METHOD OF MANUFACTURING SAME (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18606843. PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18745613. Semiconductor Package and Method simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18894360. BRIDGE CHIP AND SEMICONDUCTOR INTEGRATED MODULE (Sumitomo Electric Industries, Ltd.)
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F
I
- Industrial Technology Research Institute Patent Application Trends in 2025
- Innolux Corporation Patent Application Trends in 2024
- Intel corporation (20240413089). IMPROVING SIZE AND EFFICIENCY OF DIES
- Intel corporation (20250105156). INTEGRATED CIRCUIT PACKAGES INCLUDING A SUBSTRATE COUPLED TO A GLASS CORE BY INTERCONNECTS
- INTEL CORPORATION Patent Application Trends in 2025
- Intel Corporation Patent Application Trends in 2025
- Intel Corporation patent applications on December 12th, 2024
- Intel Corporation patent applications on March 27th, 2025
M
Q
- Qualcomm incorporated (20250062235). PACKAGE SUBSTRATE WITH METALLIZATION LAYER(S) THAT INCLUDES AN ADDITIONAL METAL PAD LAYER TO FACILITATE REDUCED VIA SIZE FOR REDUCED BUMP PITCH, AND RELATED INTEGRATED CIRCUIT (IC) PACKAGES AND FABRICATION METHODS
- Qualcomm Incorporated Patent Application Trends in 2024
- QUALCOMM INCORPORATED Patent Application Trends in 2024
- Qualcomm Incorporated Patent Application Trends in 2025
- QUALCOMM Incorporated patent applications on February 20th, 2025
S
- Samsung Electro-Mechanics Co., Ltd. Patent Application Trends in 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD. Patent Application Trends in 2025
- SAMSUNG ELECTRONICS CO., LTD Patent Application Trends in 2024
- Samsung electronics co., ltd. (20240203888). SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240234325). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240304557). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240321753). PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240421093). WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Samsung electronics co., ltd. (20250079319). SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Samsung Electronics Co., Ltd. Patent Application Trends in 2024
- SAMSUNG ELECTRONICS CO., LTD. Patent Application Trends in 2024
- Samsung electronics Co., Ltd. Patent Application Trends in 2024
- Samsung electronics CO., LTD. Patent Application Trends in 2025
- Samsung Electronics Co., Ltd. patent applications on December 19th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on December 19th, 2024
- Samsung Electronics Co., Ltd. patent applications on February 6th, 2025
- Samsung Electronics Co., Ltd. patent applications on July 11th, 2024
- Samsung Electronics Co., Ltd. patent applications on June 20th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on June 20th, 2024
- Samsung Electronics Co., Ltd. patent applications on March 6th, 2025
- Samsung Electronics Co., Ltd. patent applications on September 12th, 2024
- Samsung Electronics Co., Ltd. patent applications on September 26th, 2024
- SAMSUNG ELECTRONICS CO.,LTD. Patent Application Trends in 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC Patent Application Trends in 2024
- SILICONWARE PRECISION INDUSTRIES CO., LTD. Patent Application Trends in 2024
- Sumitomo electric industries, ltd. (20250105157). BRIDGE CHIP AND SEMICONDUCTOR INTEGRATED MODULE
- SUMITOMO ELECTRIC INDUSTRIES, LTD. Patent Application Trends in 2024
- Sumitomo Electric Industries, Ltd. Patent Application Trends in 2024
- Sumitomo Electric Industries, Ltd. Patent Application Trends in 2025
- Sumitomo Electric Industries, Ltd. patent applications on March 27th, 2025
T
- Taiwan Semiconductor Manufacturing Co., Ltd Patent Application Trends in 2024
- Taiwan semiconductor manufacturing co., ltd. (20250087588). INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Taiwan semiconductor manufacturing co., ltd. (20250087589). INTERCONNECTION STRUCTURE FOR MULT-CHIP INTERPOSER AND METHOD OF MANUFACTURING SAME
- Taiwan Semiconductor Manufacturing Co., Ltd. Patent Application Trends in 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. Patent Application Trends in 2025
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on March 13th, 2025
- Taiwan Semiconductor Manufacturing Company Limited Patent Application Trends in 2024
- Taiwan semiconductor manufacturing company, ltd. (20240339408). Semiconductor Package and Method simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379565). INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME simplified abstract
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. Patent Application Trends in 2025
- Taiwan Semiconductor Manufacturing Company, LTD. patent applications on February 6th, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on November 14th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on October 10th, 2024
- TOPPAN Holdings Inc. Patent Application Trends in 2025