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Category:CPC H01L23/53266
Pages in category "CPC H01L23/53266"
The following 49 pages are in this category, out of 49 total.
1
- 18060979. INTEGRATED CIRCUIT DEVICE WITH INTERCONNECTS MADE OF LAYERED TOPOLOGICAL MATERIALS simplified abstract (International Business Machines Corporation)
- 18112564. Layered Substrate with Ruthenium Layer and Method for Producing simplified abstract (Applied Materials, Inc.)
- 18147731. GRAPHENE COATED INTERCONNECTS WITH AIRGAP STRUCTURES simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18369190. INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18534333. POST-TREATMENT FOR REMOVING RESIDUES FROM DIELECTRIC SURFACE simplified abstract (Applied Materials, Inc.)
2
A
- Adeia Semiconductor Bonding Technologies Inc. Patent Application Trends in 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. Patent Application Trends in 2024
- Applied materials, inc. (20240282709). Layered Substrate with Ruthenium Layer and Method for Producing simplified abstract
- APPLIED MATERIALS, INC. Patent Application Trends in 2025
- Applied Materials, Inc. patent applications on August 22nd, 2024
I
- Innolux Corporation Patent Application Trends in 2024
- INTEL CORPORATION Patent Application Trends in 2025
- Intel Corporation Patent Application Trends in 2025
- International business machines corporation (20240222278). GRAPHENE COATED INTERCONNECTS WITH AIRGAP STRUCTURES simplified abstract
- International Business Machines Corporation Patent Application Trends in 2025
- INTERNATIONAL BUSINESS MACHINES CORPORATION patent applications on July 4th, 2024
M
Q
S
- SAMSUNG ELECTRONICS CO., LTD Patent Application Trends in 2024
- Samsung Electronics Co., Ltd. Patent Application Trends in 2024
- SAMSUNG ELECTRONICS CO., LTD. Patent Application Trends in 2024
- Samsung electronics Co., Ltd. Patent Application Trends in 2024
- Samsung electronics CO., LTD. Patent Application Trends in 2025
- SAMSUNG ELECTRONICS CO., LTD. Patent Application Trends in 2025
- Semiconductor Energy Laboratory Co., Ltd. Patent Application Trends in 2025
T
- Taiwan Semiconductor Manufacturing Co., Ltd Patent Application Trends in 2024
- Taiwan semiconductor manufacturing co., ltd. (20250096140). INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME
- Taiwan Semiconductor Manufacturing Co., Ltd. Patent Application Trends in 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on March 20th, 2025
- Taiwan Semiconductor Manufacturing Company Patent Application Trends in 2025
- Taiwan semiconductor manufacturing company, ltd. (20240290721). METHOD FOR FORMING SEMICONDUCTOR STRUCTURE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379557). CONDUCTIVE CONTACT HAVING BARRIER LAYERS WITH DIFFERENT DEPTHS simplified abstract
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. Patent Application Trends in 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on August 29th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on November 14th, 2024