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Category:CPC H01L23/49822
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Pages in category "CPC H01L23/49822"
The following 200 pages are in this category, out of 202 total.
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- 18061181. INTEGRATED CIRCUIT PACKAGE ARCHITECTURES WITH CORE AND/OR BUILD-UP LAYERS COMPRISING SPIN-ON GLASS (SOG) simplified abstract (Intel Corporation)
- 18061237. INTEGRATED CIRCUIT PACKAGE ARCHITECTURES WITH CORE AND/OR BUILD-UP LAYERS COMPRISING SPIN-ON GLASS (SOG) simplified abstract (Intel Corporation)
- 18061283. INTEGRATED CIRCUIT PACKAGE ARCHITECTURES WITH CORE AND/OR BUILD-UP LAYERS COMPRISING SPIN-ON GLASS (SOG) simplified abstract (Intel Corporation)
- 18091555. APPARATUS AND METHOD FOR ATTACHING AN OPTICAL COMPONENT USING HYBRID BONDING simplified abstract (Intel Corporation)
- 18097970. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18187660. INTERPOSER DEVICE AND SEMICONDUCTOR PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18230416. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18358644. MULTI-WAFER BONDING FOR NAND SCALING simplified abstract (SanDisk Technologies LLC)
- 18374792. FAN-OUT SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE FAN-OUT SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18380042. SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR CHIP HAVING THROUGH-ELECTRODE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18453422. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18464091. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18468493. INTEGRATED DEVICE COMPRISING SILICON SUBSTRATE WITH POROUS PORTION (QUALCOMM Incorporated)
- 18470250. PACKAGE COMPRISING A SUBSTRATE WITH VIA INTERCONNECT WITH VERTICAL WALLS (QUALCOMM Incorporated)
- 18474166. BACKSIDE POWER simplified abstract (ADVANCED MICRO DEVICES, INC.)
- 18490995. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18494611. COMPOUND COMPONENT DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Murata Manufacturing Co., Ltd.)
- 18503690. SEMICONDUCTOR PACKAGE INCLUDING AN INTERPOSER simplified abstract (Samsung Electronics Co., Ltd.)
- 18515441. SEMICONDUCTOR PACKAGE (SAMSUNG ELECTRONICS CO., LTD.)
- 18588460. WIRING STRUCTURE, SEMICONDUCTOR PACKAGE INCLUDING THE SAME AND MANUFACTURING METHOD FOR THE WIRING STRUCTURE (Samsung Electronics Co., Ltd.)
- 18591183. SMT PACKAGES AND SMT SUBSTRATES INCLUDED IN SMT PACKAGES (SAMSUNG ELECTRONICS CO., LTD.)
- 18594573. THERMALLY IMPROVED SUBSTRATE STRUCTURE AND PACKAGE ASSEMBLY WITH THE SAME simplified abstract (MEDIATEK Inc.)
- 18604613. SOLDER RESIST STRUCTURE TO MITIGATE SOLDER BRIDGE RISK simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18612193. SEMICONDUCTOR PACKAGE INCLUDING A REDISTRIBUTION SUBSTRATE AND A METHOD OF FABRICATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18619711. SEMICONDUCTOR PACKAGES AND METHOD OF FABRICATING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)
- 18621138. PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18626388. SEMICONDUCTOR PACKAGE DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18626736. WIRING SUBSTRATE simplified abstract (IBIDEN CO., LTD.)
- 18639081. SEMICONDUCTOR SUBSTRATE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR SUBSTRATE (SAMSUNG ELECTRONICS CO., LTD.)
- 18641480. SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME simplified abstract (Resonac Corporation)
- 18644867. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)
- 18674891. SEMICONDUCTOR PACKAGE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18682829. CIRCUIT BOARD simplified abstract (LG Innotek Co.,LTD.)
- 18748765. SEMICONDUCTOR PACKAGE INCLUDING UNDER BUMP METALLIZATION PAD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18806023. Advanced Substrates for Large, High Performance Power Packages (Google LLC)
- 18815875. ELECTRONIC DEVICE (InnoLux Corporation)
- 18883752. METHODS AND APPARATUS FOR PACKAGE SUBSTRATES WITH STACKS OF GLASS LAYERS HAVING DIFFERENT COEFFICIENTS OF THERMAL EXPANSION (Intel Corporation)
- 18883781. METHODS AND APPARATUS FOR POWER DELIVERY THROUGH PACKAGE SUBSTRATES WITH STACKS OF GLASS LAYERS HAVING DIFFERENT COEFFICIENTS OF THERMAL EXPANSION (Intel Corporation)
- 18883786. METHODS AND APPARATUS FOR POWER DELIVERY THROUGH PACKAGE SUBSTRATES WITH STACKS OF GLASS LAYERS HAVING DIFFERENT COEFFICIENTS OF THERMAL EXPANSION (Intel Corporation)
- 18883796. METHODS AND APPARATUS FOR POWER DELIVERY THROUGH PACKAGE SUBSTRATES WITH STACKS OF GLASS LAYERS HAVING DIFFERENT COEFFICIENTS OF THERMAL EXPANSION (Intel Corporation)
- 18883807. METHODS AND APPARATUS FOR PACKAGE SUBSTRATES WITH STACKS OF GLASS LAYERS INCLUDING INTERCONNECT BRIDGES (Intel Corporation)
- 18960244. MULTILAYER SUBSTRATE (Murata Manufacturing Co., Ltd.)
- 18963534. STACKED VIA STRUCTURE DISPOSED ON A CONDUCTIVE PILLAR OF A SEMICONDUCTOR DIE (Taiwan Semiconductor Manufacturing Co., Ltd.)
A
- Adeia Semiconductor Bonding Technologies Inc. Patent Application Trends in 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. Patent Application Trends in 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. Patent Application Trends in 2025
- Advanced micro devices Patent Application Trends in 2024
- Advanced Semiconductor Engineering, Inc. Patent Application Trends in 2025
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- Industrial Technology Research Institute Patent Application Trends in 2024
- INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE Patent Application Trends in 2024
- Innolux Corporation Patent Application Trends in 2024
- Intel corporation (20240222243). APPARATUS AND METHOD FOR ATTACHING AN OPTICAL COMPONENT USING HYBRID BONDING simplified abstract
- Intel corporation (20240413066). EMBEDDED SEMICONDUCTOR DEVICE
- Intel corporation (20250006609). METHODS AND APPARATUS FOR PACKAGE SUBSTRATES WITH STACKS OF GLASS LAYERS HAVING DIFFERENT COEFFICIENTS OF THERMAL EXPANSION
- Intel corporation (20250006610). METHODS AND APPARATUS FOR POWER DELIVERY THROUGH PACKAGE SUBSTRATES WITH STACKS OF GLASS LAYERS HAVING DIFFERENT COEFFICIENTS OF THERMAL EXPANSION
- Intel corporation (20250006611). METHODS AND APPARATUS FOR POWER DELIVERY THROUGH PACKAGE SUBSTRATES WITH STACKS OF GLASS LAYERS HAVING DIFFERENT COEFFICIENTS OF THERMAL EXPANSION
- Intel corporation (20250006612). METHODS AND APPARATUS FOR POWER DELIVERY THROUGH PACKAGE SUBSTRATES WITH STACKS OF GLASS LAYERS HAVING DIFFERENT COEFFICIENTS OF THERMAL EXPANSION
- Intel corporation (20250006613). METHODS AND APPARATUS FOR PACKAGE SUBSTRATES WITH STACKS OF GLASS LAYERS INCLUDING INTERCONNECT BRIDGES
- INTEL CORPORATION Patent Application Trends in 2025
- Intel Corporation patent applications on December 12th, 2024
- Intel Corporation patent applications on January 2nd, 2025
- Intel Corporation patent applications on July 4th, 2024
- International Business Machines Corporation Patent Application Trends in 2025
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L
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- MEDIATEK Inc. Patent Application Trends in 2024
- MEDIATEK INC. Patent Application Trends in 2024
- Meta Platforms Technologies, LLC Patent Application Trends in 2024
- Micron Technology, Inc. Patent Application Trends in 2024
- MICRON TECHNOLOGY, INC. Patent Application Trends in 2025
- Mitsubishi electric corporation (20240429148). SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Mitsubishi Electric Corporation Patent Application Trends in 2024
- MITSUBISHI ELECTRIC CORPORATION Patent Application Trends in 2024
- Mitsubishi Electric Corporation patent applications on December 26th, 2024
- Murata manufacturing co., ltd. (20250087568). MULTILAYER SUBSTRATE
- Murata Manufacturing Co., Ltd. patent applications on March 13th, 2025
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- Qualcomm incorporated (20250062203). SUBSTRATE(S) FOR AN INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING A CORE LAYER AND AN ADJACENT INSULATION LAYER(S) WITH AN EMBEDDED METAL STRUCTURE(S) POSITIONED FROM THE CORE LAYER
- Qualcomm incorporated (20250096090). INTEGRATED DEVICE COMPRISING SILICON SUBSTRATE WITH POROUS PORTION
- Qualcomm incorporated (20250096091). PACKAGE COMPRISING A SUBSTRATE WITH VIA INTERCONNECT WITH VERTICAL WALLS
- Qualcomm Incorporated Patent Application Trends in 2024
- QUALCOMM INCORPORATED Patent Application Trends in 2024
- Qualcomm Incorporated Patent Application Trends in 2025
- QUALCOMM Incorporated patent applications on February 20th, 2025
- QUALCOMM Incorporated patent applications on March 20th, 2025
- QUALCOMM Incorporated patent applications on March 6th, 2025
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- SAMSUNG ELECTRO-MECHANICS CO., LTD. Patent Application Trends in 2024
- Samsung Electro-Mechanics Co., Ltd. Patent Application Trends in 2025
- SAMSUNG ELECTRONICS CO., LTD Patent Application Trends in 2024
- Samsung electronics co., ltd. (20240194575). SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR CHIP HAVING THROUGH-ELECTRODE simplified abstract
- Samsung electronics co., ltd. (20240222244). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240234276). FAN-OUT SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE FAN-OUT SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240234277). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240234279). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240243050). SEMICONDUCTOR PACKAGE INCLUDING AN INTERPOSER simplified abstract
- Samsung electronics co., ltd. (20240250008). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240258222). 3D INTEGRATED CIRCUIT (3DIC) STRUCTURES AND METHODS FOR MANUFACTURING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240266268). SEMICONDUCTOR PACKAGE INCLUDING A REDISTRIBUTION SUBSTRATE AND A METHOD OF FABRICATING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240266269). SEMICONDUCTOR PACKAGE DEVICE simplified abstract
- Samsung electronics co., ltd. (20240290702). INTERCONNECTION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240332150). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240347435). SEMICONDUCTOR PACKAGE INCLUDING UNDER BUMP METALLIZATION PAD simplified abstract
- Samsung electronics co., ltd. (20240379515). SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240404931). METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGES
- Samsung electronics co., ltd. (20240413068). SEMICONDUCTOR SUBSTRATE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR SUBSTRATE
- Samsung electronics co., ltd. (20240421056). SEMICONDUCTOR PACKAGE
- Samsung electronics co., ltd. (20240421057). SMT PACKAGES AND SMT SUBSTRATES INCLUDED IN SMT PACKAGES
- Samsung electronics co., ltd. (20240421058). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Samsung electronics co., ltd. (20250087565). WIRING STRUCTURE, SEMICONDUCTOR PACKAGE INCLUDING THE SAME AND MANUFACTURING METHOD FOR THE WIRING STRUCTURE
- Samsung electronics co., ltd. (20250105117). SEMICONDUCTOR PACKAGES AND METHOD OF FABRICATING THE SAME
- Samsung Electronics Co., Ltd. Patent Application Trends in 2024
- SAMSUNG ELECTRONICS CO., LTD. Patent Application Trends in 2024
- Samsung electronics Co., Ltd. Patent Application Trends in 2024
- Samsung electronics CO., LTD. Patent Application Trends in 2025
- Samsung Electronics Co., Ltd. patent applications on August 1st, 2024
- Samsung Electronics Co., Ltd. patent applications on August 29th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on August 29th, 2024
- Samsung Electronics Co., Ltd. patent applications on August 8th, 2024
- Samsung Electronics Co., Ltd. patent applications on December 12th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on December 12th, 2024
- Samsung Electronics Co., Ltd. patent applications on December 19th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on December 19th, 2024
- Samsung Electronics Co., Ltd. patent applications on December 5th, 2024
- Samsung Electronics Co., Ltd. patent applications on February 6th, 2025
- Samsung Electronics Co., Ltd. patent applications on January 23rd, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on January 23rd, 2025
- Samsung Electronics Co., Ltd. patent applications on July 11th, 2024
- Samsung Electronics Co., Ltd. patent applications on July 18th, 2024
- Samsung Electronics Co., Ltd. patent applications on July 25th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on July 25th, 2024
- Samsung Electronics Co., Ltd. patent applications on July 4th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on July 4th, 2024
- Samsung Electronics Co., Ltd. patent applications on June 13th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on June 13th, 2024
- Samsung Electronics Co., Ltd. patent applications on March 13th, 2025
- Samsung Electronics Co., Ltd. patent applications on March 27th, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on March 27th, 2025
- Samsung Electronics Co., Ltd. patent applications on November 14th, 2024
- Samsung Electronics Co., Ltd. patent applications on October 17th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on October 17th, 2024
- Samsung Electronics Co., Ltd. patent applications on October 3rd, 2024
- SAMSUNG ELECTRONICS CO.,LTD Patent Application Trends in 2024
- SAMSUNG ELECTRONICS CO.,LTD. Patent Application Trends in 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC Patent Application Trends in 2024
- SILICONWARE PRECISION INDUSTRIES CO., LTD. Patent Application Trends in 2024
- Skyworks Solutions, Inc. Patent Application Trends in 2025
- SONY GROUP CORPORATION Patent Application Trends in 2024
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- Taiwan Semiconductor Manufacturing Co., Ltd Patent Application Trends in 2024
- Taiwan semiconductor manufacturing co., ltd. (20240222247). SOLDER RESIST STRUCTURE TO MITIGATE SOLDER BRIDGE RISK simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240312887). SEMICONDUCTOR PACKAGE simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20250096092). STACKED VIA STRUCTURE DISPOSED ON A CONDUCTIVE PILLAR OF A SEMICONDUCTOR DIE
- Taiwan Semiconductor Manufacturing Co., Ltd. Patent Application Trends in 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. Patent Application Trends in 2025
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on January 30th, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on July 4th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on March 20th, 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. patent applications on September 19th, 2024
- Taiwan Semiconductor Manufacturing Company Limited Patent Application Trends in 2024
- Taiwan semiconductor manufacturing company, ltd. (20240243047). SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240243051). PACKAGE STRUCTURE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379517). WAFER BONDING INCORPORATING THERMAL CONDUCTIVE PATHS simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20250062202). PACKAGE STRUCTURE, SEMICONDUCTOR DIE AND METHOD OF MANUFACTURING THE SAME
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. Patent Application Trends in 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on February 20th, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on July 18th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on March 6th, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on November 14th, 2024
- TDK Corporation Patent Application Trends in 2024
- Texas instruments incorporated (20250006607). SEMICONDUCTOR PACKAGE WITH RETREATING METAL LAYERS
- Texas Instruments Incorporated patent applications on January 2nd, 2025
- TEXAS INSTRUMENTS INCORPORATED patent applications on March 6th, 2025
- TOPPAN Holdings Inc. Patent Application Trends in 2024
- TOPPAN INC. Patent Application Trends in 2024