There is currently no text in this page. You can search for this page title in other pages, or search the related logs, but you do not have permission to create this page.
Category:CPC H01L21/6833
Jump to navigation
Jump to search
Pages in category "CPC H01L21/6833"
The following 94 pages are in this category, out of 94 total.
1
- 18090394. ENHANCED ELECTROSTATIC WAFER CHUCK DESIGNS simplified abstract (Intel Corporation)
- 18099210. SUBSTRATE SUPPORT CARRIER HAVING MULTIPLE CERAMIC DISCS simplified abstract (Applied Materials, Inc.)
- 18131534. ADVANCED METHOD FOR CREATING ELECTROSTATIC CHUCK (ESC) MESA PATTERNS simplified abstract (Applied Materials, Inc.)
- 18206443. DIFFERENTIAL SUBSTRATE BACKSIDE COOLING simplified abstract (Applied Materials, Inc.)
- 18210328. ELECTROSTATIC SUBSTRATE SUPPORT (Applied Materials, Inc.)
- 18236115. SUSCEPTOR HEIGHT ADJUSTMENT (Applied Materials, Inc.)
- 18396553. ELECTROSTATIC CHUCK simplified abstract (Samsung Electronics Co., Ltd.)
- 18414394. TENSION GENERATION DEVICE AND SEMICONDUCTOR MANUFACTURING DEVICE simplified abstract (Mitsubishi Electric Corporation)
- 18439492. SUBSTRATE SUPPORTER simplified abstract (Samsung Electronics Co., Ltd.)
- 18494103. EDGE COVERING AND SEMICONDUCTOR MANUFACTURING DEVICE COMPRISING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18515267. ELECTROSTATIC CHUCK, DEPOSITION APPARATUS INCLUDING THE SAME, AND DISPLAY PANEL FABRICATED USING THE SAME simplified abstract (SAMSUNG DISPLAY CO., LTD.)
- 18525387. SUSCEPTOR AND METHOD OF MANUFACTURING THE SAME simplified abstract (SEMES CO., LTD.)
- 18586860. SUBSTRATE SUPPORT AND SUBSTRATE PROCESSING APPARATUS simplified abstract (Tokyo Electron Limited)
- 18650955. ELECTROSTATIC CHUCK, PLASMA PROCESSING METHOD, AND PLASMA PROCESSING APPARATUS (SEMES CO., LTD.)
- 18665134. SUBSTRATE HOLDER AND METHODS OF USE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18679357. TUNABLE TEMPERATURE CONTROLLED SUBSTRATE SUPPORT ASSEMBLY simplified abstract (Applied Materials, Inc.)
- 18773943. BIPOLAR ELECTROSTATIC CHUCK TO LIMIT DC DISCHARGE (Applied Materials, Inc.)
- 18814907. FORMING MESAS ON AN ELECTROSTATIC CHUCK (Applied Materials, Inc.)
- 18940092. ADJUSTABLE WAFER CHUCK (Taiwan Semiconductor Manufacturing Company, LTD.)
- 18940332. SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE (Kioxia Corporation)
- 18955355. LONG-LIFE EXTENDED TEMPERATURE RANGE EMBEDDED DIODE DESIGN FOR ELECTROSTATIC CHUCK WITH MULTIPLEXED HEATERS ARRAY (Lam Research Corporation)
A
- AGC Inc. Patent Application Trends in 2024
- AGC INC. Patent Application Trends in 2024
- Applied materials, inc. (20240249965). SUBSTRATE SUPPORT CARRIER HAVING MULTIPLE CERAMIC DISCS simplified abstract
- Applied materials, inc. (20240266200). Electrostatic Chuck simplified abstract
- Applied materials, inc. (20240304486). DIFFERENTIAL SUBSTRATE BACKSIDE COOLING simplified abstract
- Applied materials, inc. (20240339349). ADVANCED METHOD FOR CREATING ELECTROSTATIC CHUCK (ESC) MESA PATTERNS simplified abstract
- Applied materials, inc. (20240420984). ELECTROSTATIC SUBSTRATE SUPPORT
- Applied materials, inc. (20240420986). FORMING MESAS ON AN ELECTROSTATIC CHUCK
- Applied materials, inc. (20250069928). SUSCEPTOR HEIGHT ADJUSTMENT
- Applied Materials, Inc. patent applications on August 8th, 2024
- Applied Materials, Inc. patent applications on December 19th, 2024
- Applied Materials, Inc. patent applications on February 27th, 2025
- Applied Materials, Inc. patent applications on February 6th, 2025
- Applied Materials, Inc. patent applications on July 25th, 2024
- Applied Materials, Inc. patent applications on October 10th, 2024
- Applied Materials, Inc. patent applications on September 12th, 2024
- ASML NETHERLANDS B.V. Patent Application Trends in 2024
- ASML NETHERLANDS B.V. Patent Application Trends in 2025
H
I
K
L
M
P
S
- Samsung Display Co., LTD Patent Application Trends in 2024
- Samsung display co., ltd. (20240274456). SUBSTRATE PLANARIZATION DEVICE, DEPOSITION SYSTEM INCLUDING THE SAME, AND METHOD OF OPERATING SUBSTRATE PLANARIZATION DEVICE simplified abstract
- Samsung display co., ltd. (20240274458). ELECTROSTATIC CHUCK, ETCHING APPARATUS, AND METHOD OF MANUFACTURING DISPLAY DEVICE simplified abstract
- Samsung display co., ltd. (20240347365). ELECTROSTATIC CHUCK, DEPOSITION APPARATUS INCLUDING THE SAME, AND DISPLAY PANEL FABRICATED USING THE SAME simplified abstract
- SAMSUNG DISPLAY CO., LTD. Patent Application Trends in 2024
- Samsung Display Co., Ltd. Patent Application Trends in 2024
- SAMSUNG DISPLAY CO., LTD. patent applications on August 15th, 2024
- SAMSUNG DISPLAY CO., LTD. patent applications on October 17th, 2024
- SAMSUNG ELECTRONICS CO., LTD Patent Application Trends in 2024
- Samsung electronics co., ltd. (20240213071). ELECTROSTATIC CHUCK simplified abstract
- Samsung electronics co., ltd. (20240282613). EDGE COVERING AND SEMICONDUCTOR MANUFACTURING DEVICE COMPRISING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240321619). SUBSTRATE SUPPORTER simplified abstract
- Samsung electronics co., ltd. (20240429084). SUBSTRATE PROCESSING APPARATUS
- Samsung Electronics Co., Ltd. Patent Application Trends in 2024
- SAMSUNG ELECTRONICS CO., LTD. Patent Application Trends in 2024
- Samsung electronics Co., Ltd. Patent Application Trends in 2024
- Samsung electronics CO., LTD. Patent Application Trends in 2025
- Samsung Electronics Co., Ltd. patent applications on August 22nd, 2024
- Samsung Electronics Co., Ltd. patent applications on December 26th, 2024
- Samsung Electronics Co., Ltd. patent applications on January 23rd, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on January 23rd, 2025
- Samsung Electronics Co., Ltd. patent applications on June 27th, 2024
- Samsung Electronics Co., Ltd. patent applications on September 26th, 2024
- SEMES CO., LTD. Patent Application Trends in 2024
T
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. Patent Application Trends in 2025
- Taiwan semiconductor manufacturing company, ltd. (20240304488). SUBSTRATE HOLDER AND METHODS OF USE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379400). WAFER CHUCK STRUCTURE WITH HOLES IN UPPER SURFACE TO IMPROVE TEMPERATURE UNIFORMITY simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379401). SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20250069934). ADJUSTABLE WAFER CHUCK
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. Patent Application Trends in 2025
- Taiwan Semiconductor Manufacturing Company, LTD. patent applications on February 27th, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on November 14th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on September 12th, 2024
- TOKYO ELECTRON LIMITED Patent Application Trends in 2024
- Tokyo Electron Limited Patent Application Trends in 2024
- TOKYO ELECTRON LIMITED Patent Application Trends in 2025
- Tokyo Electron Limited Patent Application Trends in 2025
- TOTO LTD. Patent Application Trends in 2025
